Patents by Inventor Matthias Merz

Matthias Merz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11879752
    Abstract: A sensor module as well as a method for manufacturing a sensor module for determining a property of a fluid, in particular for measuring air quality, comprises a printed circuit board, at least one sensor on the printed circuit board for measuring a parameter of the surrounding air and a housing for the printed circuit board. A part of the printed circuit board protrudes from an opening in the housing (10), wherein the at least one sensor (21, 22) is located on a front side of the protruding part of the printed circuit board. In addition, at least the front side of the protruding part of the printed circuit board, with the exception of a recess for the at least one sensor, is encapsulated with a filling compound. The sensor module can be used in an interior or an air duct of motor vehicles or buildings. In one embodiment, the sensor module measures temperature, relative humidity and gas concentration in a fluid, especially in the surrounding air.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: January 23, 2024
    Assignee: Sensirion AG
    Inventors: Stephan Braun, Tobias Schmid, Thomas Brugger, Matthias Merz, Manuel Becker
  • Publication number: 20220176780
    Abstract: The invention relates to a sensor module (1) for measuring at least one measurand, comprising: a housing (2) having a flow duct (23) with an air inlet (21) and an air outlet (22), the housing (2) enclosing an interior (20) of the housing (2); a circuit board (4) arranged in the interior (20); at least one sensor (3) which is arranged on the circuit board (4) and is designed to measure at least one measurand of an air flow (L) conducted past the sensor (3); a terminal (5) arranged on the circuit board (4) for making electrical contact with the sensor module (1); and a fan (6), which has a motor (60) and a rotor (61) which can be rotated about an axis of rotation (z) by means of the motor (60), the motor (60) being electrically conductively connected to the circuit board (4), and the fan (6) being designed to generate an air flow (L) in the flow duct (23) between the air inlet (21) and the air outlet (22) such that the air flow (L) flows past the sensor (3) and, in the region of the air inlet (21), flows in a f
    Type: Application
    Filed: April 6, 2020
    Publication date: June 9, 2022
    Applicant: SENSIRION AG
    Inventors: Matthias MERZ, Manuel BECKER
  • Publication number: 20210188625
    Abstract: Aspects of the invention relate to a semiconductor chip comprising a substrate and a stack arranged on the substrate. The stack comprises one or more insulating layers and one or more metal layers. The chip comprises a sensor device arranged in a sensor area (SA) of the semiconductor chip and processing circuitry arranged in a processing area (PA) of the semiconductor chip. The chip further comprises connection circuitry configured to provide an electrical connection between the sensor device and the processing circuitry. A first seal ring structure is arranged between an outer edge (ED) of the chip and an inner area (IA) of the chip. The inner area (IA) of the chip encompasses the sensor area (SA) and the processing area (PA). A second seal ring structure is arranged between the sensor area (SA) and the processing area (PA) and configured to constrain an infiltration of contaminants from the sensor area (SA) to the processing area (PA).
    Type: Application
    Filed: May 17, 2018
    Publication date: June 24, 2021
    Applicant: Sensirion AG
    Inventors: Matthias STUDER, Robert WÜEST, Matthias MERZ, Gijs VAN STEENWIJK, Dominikus KÖLBL, Cyrill KÜMIN
  • Patent number: 10942141
    Abstract: The disclosure relates to a sensor for detecting and/or analysing a gas. The sensor comprises a substrate, a recess or opening arranged in the substrate, a first bridge structure and a second bridge structure. The first bridge structure and the second bridge structure extend over said recess or opening and are anchored in the substrate. The first bridge structure forms a first hotplate and comprises a first patch of sensing material, in particular of a metal oxide material, arranged on the first hotplate, electrodes adapted to measure an electrical property of the first patch and a heater adapted to heat the first hotplate. The second bridge structure comprises a temperature sensor. The sensor comprises circuitry for driving the heater and for processing signals from the electrodes and the temperature sensor.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: March 9, 2021
    Assignee: SENSIRION AG
    Inventors: Matthias Merz, Mark Hornung, Felix Hoehne
  • Publication number: 20210055139
    Abstract: A sensor module as well as a method for manufacturing a sensor module for determining a property of a fluid, in particular for measuring air quality, comprises a printed circuit board, at least one sensor on the printed circuit board for measuring a parameter of the surrounding air and a housing for the printed circuit board. A part of the printed circuit board protrudes from an opening in the housing (10), wherein the at least one sensor (21, 22) is located on a front side of the protruding part of the printed circuit board. In addition, at least the front side of the protruding part of the printed circuit board, with the exception of a recess for the at least one sensor, is encapsulated with a filling compound. The sensor module can be used in an interior or an air duct of motor vehicles or buildings. In one embodiment, the sensor module measures temperature, relative humidity and gas concentration in a fluid, especially in the surrounding air.
    Type: Application
    Filed: October 23, 2018
    Publication date: February 25, 2021
    Inventors: Stephan BRAUN, Tobias SCHMID, Thomas BRUGGER, Matthias MERZ, Manuel BECKER
  • Publication number: 20190293590
    Abstract: The disclosure relates to a sensor for detecting and/or analysing a gas. The sensor comprises a substrate, a recess or opening arranged in the substrate, a first bridge structure and a second bridge structure. The first bridge structure and the second bridge structure extend over said recess or opening and are anchored in the substrate. The first bridge structure forms a first hotplate and comprises a first patch of sensing material, in particular of a metal oxide material, arranged on the first hotplate, electrodes adapted to measure an electrical property of the first patch and a heater adapted to heat the first hotplate. The second bridge structure comprises a temperature sensor. The sensor comprises circuitry for driving the heater and for processing signals from the electrodes and the temperature sensor.
    Type: Application
    Filed: October 30, 2017
    Publication date: September 26, 2019
    Applicant: SENSIRION AG
    Inventors: Matthias MERZ, Mark HORNUNG, Felix HOEHNE
  • Patent number: 10197520
    Abstract: Disclosed is an integrated circuit comprising a substrate (10) carrying a plurality of circuit elements; a metallization stack (12, 14, 16) interconnecting said circuit elements, said metallization stack comprising a patterned upper metallization layer comprising a first metal portion (20) and a second metal portion (21); a passivation stack (24, 26, 28) covering the metallization stack; a gas sensor including a sensing material portion (32, 74) on the passivation stack; a first conductive portion (38) extending through the passivation stack connecting a first region of the sensing material portion to the first metal portion; and a second conductive portion (40) extending through the passivation stack connecting a second region of the sensing material portion to the second metal portion. A method of manufacturing such an IC is also disclosed.
    Type: Grant
    Filed: July 24, 2012
    Date of Patent: February 5, 2019
    Assignee: ams International AG
    Inventors: Matthias Merz, Aurelie Humbert, Roel Daamen, David Tio Castro
  • Patent number: 9884715
    Abstract: A container for containing a perishable substance has a container wall with an inner side and an outer side. The wall has an electrically conductive layer extending between the inner side and the outer side. The inner side faces the space containing the substance. The container comprises electronic circuitry having a sensor for sensing a physical property or condition of the substance, and an antenna for communicating an RF signal to a receiver, external to the container. The RF signal is indicative of the physical property or condition sensed. The sensor is positioned so as to be exposed to the space containing the substance in operational use of the container. The antenna is positioned at the outer side, or between the outer side and the electrically conductive layer, and is electrically isolated from the electrically conductive layer.
    Type: Grant
    Filed: May 26, 2011
    Date of Patent: February 6, 2018
    Assignee: NXP B.V.
    Inventors: Romano Hoofman, Roel Daamen, Youri Victorovitch Ponomarev, Fotopoulou Kyriaki, Matthias Merz, Gilberto Curatola, Anton Tombeur
  • Patent number: 9679857
    Abstract: Disclosed is a semiconductor device comprising a stack of patterned metal layers separated by dielectric layers, the stack comprising a first conductive support structure and a second conductive support structure and a cavity in which an inertial mass element comprising at least one metal portion is conductively coupled to the first support structure and the second support structure by respective conductive connection portions, at least one of said conductive connection portions being designed to break upon the inertial mass element being exposed to an acceleration force exceeding a threshold defined by the dimensions of the conductive connection portions. A method of manufacturing such a semiconductor device is also disclosed.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: June 13, 2017
    Assignee: NXP B.V.
    Inventors: Matthias Merz, Youri Victorovitch Ponomarev, Mark van Dal
  • Patent number: 9651514
    Abstract: Disclosed is a pH and conductivity sensor including a carrier comprising a plurality of conductive tracks and an exposed conductive area defining a reference electrode connected to a first track of said plurality of conductive tracks, a sensing device mounted on the carrier and connected to at least a second track of said plurality of conductive tracks, the sensing device including an exposed surface that is sensitive to H+ concentrations, and a plurality of electrodes adjacent to the exposed surface, an encapsulation covering the carrier, said encapsulation including a first cavity exposing a surface of the sensing device, and a second cavity exposing the exposed conductive area.
    Type: Grant
    Filed: July 30, 2014
    Date of Patent: May 16, 2017
    Assignee: NXP B.V.
    Inventors: Dimitri Soccol, Matthias Merz
  • Patent number: 9632049
    Abstract: Disclosed is an integrated circuit comprising an electrode arrangement for detecting the presence of a liquid, said electrode arrangement comprising a first electrode and a second electrode, wherein, prior to exposure of the electrode arrangement to said liquid, a surface of at least one of the first electrode and second electrode is at least partially covered by a compound that is soluble in the liquid; the electrical properties of the electrode arrangement being dependent on the amount of the compound covering said surface. An package and electronic device comprising such an IC and a method of manufacturing such an IC are also disclosed.
    Type: Grant
    Filed: December 7, 2010
    Date of Patent: April 25, 2017
    Assignee: AMS INTERNATIONAL AG
    Inventors: Matthias Merz, Roel Daamen, Aurelie Humbert, Youri Victorovitch Ponomarev
  • Patent number: 9606079
    Abstract: Disclosed is an integrated circuit comprising a substrate (10) carrying plurality of circuit elements (20); a plurality of sensing electrodes (34) over said substrate, each sensing electrode being electrically connected to at least one of said circuit elements; and a plurality of wells (50) for receiving a sample, each sensing electrode defining the bottom of one of said wells, wherein each sensing electrode comprises at least one portion (34?) extending upwardly into said well. A method of manufacturing such an IC is also disclosed.
    Type: Grant
    Filed: June 21, 2013
    Date of Patent: March 28, 2017
    Assignee: NXP B.V.
    Inventor: Matthias Merz
  • Patent number: 9546884
    Abstract: A sensor comprising a silicon substrate having a first and a second surface, integrated circuitry provided on the first surface of the silicon substrate, and a sensor structure provided on the second surface of the silicon substrate. The sensor structure and the integrated circuitry are electrically coupled to each other.
    Type: Grant
    Filed: September 24, 2010
    Date of Patent: January 17, 2017
    Assignee: NXP B.V.
    Inventors: Roel Daamen, Aurelie Humbert, Matthias Merz, Youri Victorovitch Ponomarev
  • Publication number: 20170005045
    Abstract: Disclosed is a semiconductor device comprising a stack of patterned metal layers separated by dielectric layers, the stack comprising a first conductive support structure and a second conductive support structure and a cavity in which an inertial mass element comprising at least one metal portion is conductively coupled to the first support structure and the second support structure by respective conductive connection portions, at least one of said conductive connection portions being designed to break upon the inertial mass element being exposed to an acceleration force exceeding a threshold defined by the dimensions of the conductive connection portions. A method of manufacturing such a semiconductor device is also disclosed.
    Type: Application
    Filed: September 15, 2016
    Publication date: January 5, 2017
    Applicant: NXP B.V.
    Inventors: Matthias Merz, Youri Victorovitch Ponomarev, Mark van Dal
  • Patent number: 9513247
    Abstract: An electrochemical sensor for sensing a target substance is disclosed. In one example, the sensor discloses an electrolyte matrix, wherein the matrix reposits an electrolyte; a working electrode coupled to the electrolyte matrix at a first location; a counter electrode coupled to the electrolyte matrix at a second location; an electrical circuit, coupled to the working electrode and the counter electrode, and capable of generating an output signal in response to an electrical current which flows between the working electrode and the counter electrode in response to a presence of the target substance.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: December 6, 2016
    Assignee: AMS INTERNATIONAL AG
    Inventors: Matthias Merz, Dimitri Soccol
  • Patent number: 9395318
    Abstract: There is disclosed an electrochemical sensor device comprising: an integrated electrochemical sensor element having: a substrate; first and second electrodes formed on the upper surface of the substrate; and an electrolyte layer formed on the first and second electrodes so as to electrically contact both the first and second electrodes; and a sensor integrated circuit electrically connected to the first and second electrodes of the integrated electrochemical sensor element. The integrated electrochemical sensor element and the sensor integrated circuit are provided in a single package.
    Type: Grant
    Filed: February 7, 2014
    Date of Patent: July 19, 2016
    Assignee: AMS INTERNATIONAL AG
    Inventors: Matthias Merz, Dimitri Soccol
  • Patent number: 9281239
    Abstract: A biocompatible electrode is manufactured by depositing filling metal 36 and etching back the filling metal to the surface of the surrounding insulator 30. Then, a further etch forms a recess 38 at the top of the via 32. An electrode metal 40 is then deposited and etched back to fill the recess 38 and form biocompatible electrode 42. In this way, a planar biocompatible electrode is achieved. The step of etching to form the recess may be carried out in the same CMP tool as is used to etch back the filling metal 36. A hydrogen peroxide etch may be used.
    Type: Grant
    Filed: October 26, 2009
    Date of Patent: March 8, 2016
    Assignee: NXP B.V.
    Inventors: Roel Daamen, Matthias Merz
  • Publication number: 20150241375
    Abstract: An electrochemical sensor for sensing a target substance is disclosed. In one example, the sensor discloses an electrolyte matrix, wherein the matrix reposits an electrolyte; a working electrode coupled to the electrolyte matrix at a first location; a counter electrode coupled to the electrolyte matrix at a second location; an electrical circuit, coupled to the working electrode and the counter electrode, and capable of generating an output signal in response to an electrical current which flows between the working electrode and the counter electrode in response to a presence of the target substance.
    Type: Application
    Filed: February 27, 2014
    Publication date: August 27, 2015
    Applicant: NXP B.V.
    Inventors: Matthias Merz, Dimitri Soccol
  • Patent number: 9099486
    Abstract: Disclosed is an integrated circuit comprising a substrate (10) carrying plurality of circuit elements (20); a metallization stack (30) over said substrate for providing interconnections to at least some of said circuit elements, the metallization stack comprising a plurality of patterned metal layers (31) spatially separated from each other by respective electrically insulating layers (32), at least some of said electrically insulating layers comprising conductive portions (33) that electrically interconnect portions of adjacent metal layers, wherein at least one of the patterned metallization layers comprises a plurality of ion-sensitive electrodes (34), each ion-sensitive electrode being electrically connected to at least one of said circuit elements, a plurality of sample volumes (50) extending into said metallization stack, each sample volume terminating at one of said ion-sensitive electrodes; and an ion-sensitive layer lining at least the ion-sensitive electrodes in said sample volumes.
    Type: Grant
    Filed: June 18, 2013
    Date of Patent: August 4, 2015
    Assignee: NXP, B.V.
    Inventors: Matthias Merz, Casper Juffermans, Axel Nackaerts
  • Patent number: 9034637
    Abstract: A detector device comprises a substrate (50), a source region (S) and a drain region (D), and a channel region (65) between the source and drain regions. A nanopore (54) passes through the channel region, and connects fluid chambers (56,58) on opposite sides of the substrate. A voltage bias is provided between the fluid chambers, the source and drain regions and a charge flow between the source and drain regions is sensed. The device uses a nanopore for the confinement of a sample under test (for example nucleotides) close to a sensor. The size of the sensor can be made similar to the spacing of adjacent nucleotides in a DNA strand. In this way, the disadvantages of PCR based techniques for DNA sequencing are avoided, and single nucleotide resolution can be attained.
    Type: Grant
    Filed: April 5, 2008
    Date of Patent: May 19, 2015
    Assignee: NXP, B.V.
    Inventors: Matthias Merz, Youri V. Ponomarev, Gilberto Curatola