Abstract: A chip may include a first substantially planar isolation layer with a first surface and a second surface opposite the first surface. The chip may include a first substantially planar conduction layer with a first surface positioned adjacent to the second surface of the first isolation layer and a second surface opposite the first surface. The chip may include a second substantially planar isolation layer with a first surface positioned adjacent to the second surface of the first conduction layer and a second surface opposite the first surface. The chip may include a second conduction layer etched on the second surface of the second isolation layer. The second conduction layer may include an anode trace, a cathode trace, and an optical transmitter positioned on the cathode trace. The chip may include one or more vias through the second isolation layer electrically coupling the anode trace with the first conduction layer.

Abstract: A resistance weldable cover for an OSA may include multiple walls, one or more supports, and an opening disposed in one of the walls. The walls may define an interior cavity within the walls. The one or more supports may extend from one or more of the walls. Each of the one or more supports may be weldable to a heat sink stiffener. The opening may be sized and shaped to receive at least a portion of a barrel such that optical signals are transmittable between the interior cavity and the barrel.

Abstract: A resistance weldable cover for an OSA may include multiple walls, one or more supports, and an opening disposed in one of the walls. The walls may define an interior cavity within the walls. The one or more supports may extend from one or more of the walls. Each of the one or more supports may be weldable to a heat sink stiffener. The opening may be sized and shaped to receive at least a portion of a barrel such that optical signals are transmittable between the interior cavity and the barrel.

Abstract: A chip may include a first substantially planar isolation layer with a first surface and a second surface opposite the first surface. The chip may include a first substantially planar conduction layer with a first surface positioned adjacent to the second surface of the first isolation layer and a second surface opposite the first surface. The chip may include a second substantially planar isolation layer with a first surface positioned adjacent to the second surface of the first conduction layer and a second surface opposite the first surface. The chip may include a second conduction layer etched on the second surface of the second isolation layer. The second conduction layer may include an anode trace, a cathode trace, and an optical transmitter positioned on the cathode trace. The chip may include one or more vias through the second isolation layer electrically coupling the anode trace with the first conduction layer.

Abstract: A chip may include a first substantially planar isolation layer with a first surface and a second surface opposite the first surface. The chip may include a first substantially planar conduction layer with a first surface positioned adjacent to the second surface of the first isolation layer and a second surface opposite the first surface. The chip may include a second substantially planar isolation layer with a first surface positioned adjacent to the second surface of the first conduction layer and a second surface opposite the first surface. The chip may include a second conduction layer etched on the second surface of the second isolation layer. The second conduction layer may include an anode trace, a cathode trace, and an optical transmitter positioned on the cathode trace. The chip may include one or more vias through the second isolation layer electrically coupling the anode trace with the first conduction layer.

Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a substrate with a substrate top and a substrate bottom; at least one optoelectronic transducer on the substrate top; at least one top electrical component on the substrate top, the electrical component can be operably coupled with the optoelectronic transducer; and at least one bottom electrical component on the substrate bottom, the bottom electrical component can be operably coupled with the optoelectronic transducer.

Abstract: In one embodiment, an optoelectronic assembly may include at least one transmitter or at least one receiver, a sleeve, a housing, a fiber stub, and a receptacle. The sleeve may define a sleeve opening sized and shaped to receive an optically transmissive portion of an optical fiber. The housing may define a housing cavity at least partially enclosing the transmitter or the receiver. The housing may include a lens port defining a lens port opening. The fiber stub may be positioned at least partially in the sleeve opening and the lens port opening. The receptacle may define a receptacle opening. The lens port, the sleeve and the fiber stub may be positioned at least partially in the receptacle opening.

Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a substrate with a substrate top and a substrate bottom; at least one optoelectronic transducer on the substrate top; at least one top electrical component on the substrate top, the electrical component can be operably coupled with the optoelectronic transducer; and at least one bottom electrical component on the substrate bottom, the bottom electrical component can be operably coupled with the optoelectronic transducer.

Abstract: An optical transmitter may include a transmit laser assembly configured to emit multiple light beams. The optical transmitter may additionally include an isolator configured to rotate a corresponding polarization state of each of the multiple light beams. The optical transmitter may additionally include a power multiplexing combiner configured to receive the multiple light beams from the isolator and combine the multiple light beams into a combined light beam. The optical transmitter may additionally include a lens configured to focus the combined light beam onto an optical fiber for transmission.

Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to ferrule assemblies and/or ferrule alignment assemblies. In some aspects, the disclosed devices and methods may relate to a ferrule assembly including: optical fibers, an upper clamp member and a lower clamp member configured to retain the optical fibers that are positioned between the upper and lower clamp members, and a ferrule body surrounding at least a portion of the upper and lower clamp members; and an alignment sleeve including a sleeve cavity configured to receive the ferrule body such that the ferrule assembly is capable of being longitudinally repositioned with respect to the alignment sleeve.

Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a multi-layer substrate with a bottom layer, a top layer having top thin film signal lines, and one or more intermediate layers having thick film traces between the top layer and the bottom layer, the thick film traces electrically coupled to the top thin film signal lines; and optoelectronic components positioned over the multi-layer substrate and electrically coupled with the signal lines.

Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a substrate with a substrate top and a substrate bottom; at least one optoelectronic transducer on the substrate top; at least one top electrical component on the substrate top, the electrical component can be operably coupled with the optoelectronic transducer; and at least one bottom electrical component on the substrate bottom, the bottom electrical component can be operably coupled with the optoelectronic transducer.

Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to lens receptacles and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods relate to a lens receptacle including a receptacle body extending between a receptacle top and a receptacle bottom, the receptacle body including: a port body defining a receptacle port with a port opening at the receptacle top; a receptacle window defining a base of the receptacle port; a lens array including lenses positioned on the receptacle window; and at least one receptacle alignment feature.

Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to multi-lens optical components and/or optoelectronic subassemblies. In some aspects, devices and methods relate to an optical component including a housing defining a cavity and a lens array having a plurality of lenses on an optically transmissive portion of the housing. In some aspects, devices and methods relate to an optical component including a substrate; and a lens array on the substrate, the lens array having a plurality of discrete lenses.

Abstract: A method may include selecting a transistor-outline can (TO-can) assembly cap. The method may further include welding the TO-can assembly cap to a rim that surrounds an optical opening of an optical subassembly box (OSA) such that the TO-can assembly cap hermetically seals the optical opening and allows optical signals to pass through the TO-can assembly cap and the optical opening.

Abstract: This disclosure generally relates to devices and methods involving optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a multi-channel optoelectronic subassembly including a multi-channel header subassembly with a plurality of optoelectronic transducers on a substrate, a housing defining a housing cavity and including an optically transmissive portion, a ferrule assembly retaining optical fibers and an alignment sleeve with a sleeve cavity sized and shaped to receive the ferrule assembly. At least one of the optoelectronic transducers may be configured to transmit and/or receive optical signals corresponding to one channel.

Abstract: An optical transmitter may include a transmit laser assembly configured to emit multiple light beams. The optical transmitter may additionally include an isolator configured to rotate a corresponding polarization state of each of the multiple light beams. The optical transmitter may additionally include a power multiplexing combiner configured to receive the multiple light beams from the isolator and combine the multiple light beams into a combined light beam. The optical transmitter may additionally include a lens configured to focus the combined light beam onto an optical fiber for transmission.

Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to thermoelectric coolers (TECs) and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a TEC having a TEC top, a top layer of an optoelectronic subassembly substrate, and a plurality of pillars extending between the TEC top and the top layer, such that the TEC is devoid of a TEC base between the pillars and optoelectronic subassembly substrate.

Abstract: A method may include selecting a transistor-outline can (TO-can) assembly cap. The method may further include welding the TO-can assembly cap to a rim that surrounds an optical opening of an optical subassembly box (OSA) such that the TO-can assembly cap hermetically seals the optical opening and allows optical signals to pass through the TO-can assembly cap and the optical opening.

Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to lens receptacles and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods relate to a lens receptacle including a receptacle body extending between a receptacle top and a receptacle bottom, the receptacle body including: a port body defining a receptacle port with a port opening at the receptacle top; a receptacle window defining a base of the receptacle port; a lens array including lenses positioned on the receptacle window; and at least one receptacle alignment feature.