Patents by Inventor Melanie Beauchemin

Melanie Beauchemin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190074237
    Abstract: While the use of 2.5D/3D packaging technology results in a compact IC package, it also raises challenges with respect to thermal management. Integrated component packages according to the present disclosure provide a thermal management solution for 2.5D/3D IC packages that include a high-power component integrated with multiple lower-power components. The thermal solution provided by the present disclosure includes a mix of passive cooling by traditional heatsink or cold plate and active cooling by thermoelectric cooling (TEC) elements. Certain methods according to the present disclosure include controlling a temperature during normal operation in an IC package that includes a plurality of lower-power components located adjacent to a high-power component in which the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation.
    Type: Application
    Filed: September 6, 2017
    Publication date: March 7, 2019
    Inventors: Melanie Beauchemin, Madhusudan Iyengar, Christopher Malone, Gregory Imwalle
  • Patent number: 9918377
    Abstract: The present disclosure discusses an improved optical transceiver. The optical transceiver of the present disclosure includes an optical transmitter and an optical receiver coupled to an area of a printed circuit board that includes a plurality of thermal microvias. The thermal microvias are coupled to a heat sink or other heat dissipater and provide a path from the components of the optical transceiver to the heat dissipater for heat to travel.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: March 13, 2018
    Assignee: Google LLC
    Inventors: Zuowei Shen, Kyle Fukuchi, Melanie Beauchemin, Ryohei Urata
  • Patent number: 9641254
    Abstract: The present disclosure discusses an improved optical transceiver. The optical transceiver of the present disclosure includes an optical transmitter and an optical receiver coupled to an area of a printed circuit board that includes a plurality of thermal microvias. The thermal microvias are coupled to a heat sink or other heat dissipater and provide a path from the components of the optical transceiver to the heat dissipater for heat to travel.
    Type: Grant
    Filed: April 3, 2015
    Date of Patent: May 2, 2017
    Assignee: Google Inc.
    Inventors: Zuowei Shen, Kyle Fukuchi, Melanie Beauchemin, Ryohei Urata
  • Patent number: 9614619
    Abstract: The present disclosure discusses an improved optical transceiver. The optical transceiver of the present disclosure includes an optical transmitter and an optical receiver that are spatially separated. In some implementations, the optical receiver and optical transmitter are staggered from one another. Each of the optical receiver and the optical transmitter and housed within a separate optical lens. In some implementations, the separation of the components reduces mechanical, thermal, and electrical cross talk between the optical transmitter and the optical receiver. The separation of the components can also ease the constraints of the optical alignment between the optical transmitter and the optical receiver and each of their respective lenses.
    Type: Grant
    Filed: April 3, 2015
    Date of Patent: April 4, 2017
    Assignee: Google Inc.
    Inventors: Zuowei Shen, Jamyuen Ko, Melanie Beauchemin, Hong Liu, Ryohei Urata
  • Patent number: 9379819
    Abstract: Systems and methods for reducing temperature of an optical signal source co-packaged with a driver are provided. An optical transmitter can include a housing. The optical transmitter can include an optical signal source positioned within the housing. The optical transmitter can include a signal source driver positioned within the housing and configured to control an output of the optical signal source. The optical transmitter can include a substrate mounted on an interior surface of the housing and having a microwave waveguide coupled to it. The microwave waveguide can be configured to direct electrical signals originating outside the housing to the signal source driver. The substrate is can also be configured to limit heat transfer from the signal source driver to the optical signal source.
    Type: Grant
    Filed: January 3, 2014
    Date of Patent: June 28, 2016
    Assignee: Google Inc.
    Inventors: Erji Mao, Hong Liu, Ryohei Urata, Melanie Beauchemin
  • Patent number: 9313926
    Abstract: A server rack sub-assembly includes at least one motherboard having a perimeter; a plurality of heat-generating electronic devices mounted on the motherboard in an area of the motherboard thermally decoupled from the motherboard perimeter; one or more brackets including heat transfer surfaces and attached to the motherboard along at least a portion of the motherboard perimeter; and a heat transfer device thermally coupled to the area of the motherboard that is thermally decoupled from the motherboard perimeter and the one or more brackets. The one or more brackets are adapted to receive a cooling airflow circulated over the bracket and to convectively transfer heat into the cooling airflow and are further adapted to couple the motherboard to a server rack assembly. The heat transfer device is arranged to conductively transfer heat from the one or more electronic devices to the brackets.
    Type: Grant
    Filed: February 3, 2014
    Date of Patent: April 12, 2016
    Assignee: Google Inc.
    Inventors: Michael Chi Kin Lau, Richard C. Bruns, Melanie Beauchemin
  • Publication number: 20140146466
    Abstract: A server rack sub-assembly includes at least one motherboard having a perimeter; a plurality of heat-generating electronic devices mounted on the motherboard in an area of the motherboard thermally decoupled from the motherboard perimeter; one or more brackets including heat transfer surfaces and attached to the motherboard along at least a portion of the motherboard perimeter; and a heat transfer device thermally coupled to the area of the motherboard that is thermally decoupled from the motherboard perimeter and the one or more brackets. The one or more brackets are adapted to receive a cooling airflow circulated over the bracket and to convectively transfer heat into the cooling airflow and are further adapted to couple the motherboard to a server rack assembly. The heat transfer device is arranged to conductively transfer heat from the one or more electronic devices to the brackets.
    Type: Application
    Filed: February 3, 2014
    Publication date: May 29, 2014
    Applicant: Google Inc.
    Inventors: Michael Chi Kin Lau, Richard C. Bruns, Melanie Beauchemin
  • Patent number: 8644020
    Abstract: A server rack sub-assembly includes at least one motherboard having a perimeter; a plurality of heat-generating electronic devices mounted on the motherboard in an area of the motherboard thermally decoupled from the motherboard perimeter; one or more brackets including heat transfer surfaces and attached to the motherboard along at least a portion of the motherboard perimeter; and a heat transfer device thermally coupled to the area of the motherboard that is thermally decoupled from the motherboard perimeter and the one or more brackets. The one or more brackets are adapted to receive a cooling airflow circulated over the bracket and to convectively transfer heat into the cooling airflow and are further adapted to couple the motherboard to a server rack assembly. The heat transfer device is arranged to conductively transfer heat from the one or more electronic devices to the brackets.
    Type: Grant
    Filed: December 1, 2010
    Date of Patent: February 4, 2014
    Assignee: Google Inc.
    Inventors: Michael Lau, Richard C. Bruns, Melanie Beauchemin
  • Publication number: 20120140403
    Abstract: A server rack sub-assembly includes at least one motherboard having a perimeter; a plurality of heat-generating electronic devices mounted on the motherboard in an area of the motherboard thermally decoupled from the motherboard perimeter; one or more brackets including heat transfer surfaces and attached to the motherboard along at least a portion of the motherboard perimeter; and a heat transfer device thermally coupled to the area of the motherboard that is thermally decoupled from the motherboard perimeter and the one or more brackets. The one or more brackets are adapted to receive a cooling airflow circulated over the bracket and to convectively transfer heat into the cooling airflow and are further adapted to couple the motherboard to a server rack assembly. The heat transfer device is arranged to conductively transfer heat from the one or more electronic devices to the brackets.
    Type: Application
    Filed: December 1, 2010
    Publication date: June 7, 2012
    Applicant: GOOGLE INC.
    Inventors: Michael Lau, Richard C. Bruns, Melanie Beauchemin