Abstract: An apparatus for fixing a heat sink having a bottom plate includes a circuit board, two fasteners, and two blocks. The circuit board defines two through holes. The fasteners respectively extend through the bottom plate of the heat sink for fixing the heat sink to the circuit board. Each of the fasteners includes two spaced feet to extend through a corresponding one of the through holes and engage with a bottom of the circuit board. Each of the blocks is inserted into a space between the feet of a corresponding one of the fasteners after the feet extend through the corresponding through hole, to prevent the feet from deforming and disengaging from the circuit board.

Abstract: One embodiment of the present invention provides a method for forming a nanoparticle film, which comprises the steps of: preparing a nanoparticle solution, which comprises a solvent and supersaturated nanoparticles with surface ligand molecules; and dip coating a substrate to the nanoparticle solutions to form a first monolayer of the nanoparticles on the substrate, the first monolayer and repeatedly formed monolayers on top of the first monolayer constructing the nanoparticle film. Another embodiment of the present invention provides a nanoparticle film, comprising a first monolayer consisted of a two-dimensional nanoparticles array that are near-field coupled with each other to have tunable plasmonic properties by changing the number of stacked monolayers.

Abstract: A computer system includes an enclosure having an air intake, a heat sink and an electronic element. The heat sink includes a first heat dissipating portion, a second heat dissipating portion, and a third heat dissipating portion interconnecting the first and second heat dissipating portions. Each of the first heat dissipating portion, second heat dissipating portion, and third heat dissipating portion includes a number of fins and passages formed between each two adjacent fins. The passages of the first heat dissipating portion face toward the air intake. A space is maintained between the first heat dissipating portion and the second heat dissipating portion, and the electronic element is mounted in the space.

Abstract: A fan speed control system includes a fan, a hardware device, and a basic input/output system (BIOS) module. The BIOS module includes a memory unit, an edit unit, a searching unit, and a control unit. The memory unit stores a matching table of different hardware device numbers and corresponding fan speed control curves. The edit unit is operable to edit the matching table. The searching unit is operable to read the matching table and search which fan speed control curve matches with the hardware device number of the hardware device. The control unit is operable to select the matched fan speed control curve to control the fan speed of the fan.

Abstract: An exemplary computer enclosure includes a chassis, a mounting frame, two air-guiding members, and a fan. The chassis includes a first side panel, a second side panel, and a ventilation area defining ventilation through holes. The mounting frame is fixed to the chassis and faces the ventilation through holes. The mounting frame is configured for receiving electronic components. The two air-guiding members respectively connect two opposite sides of the mounting frame to the chassis. The two air-guiding members incline relative to the mounting frame and the chassis to form an air passage. The fan is configured for exhausting air passing through the ventilation through holes and the mounting frame. The two air-guiding members and the first and second side panels cooperatively surround the ventilation area to allow the air to enter the chassis from the ventilation area and allow all of the air to pass through the mounting frame.

Abstract: A heat sink includes a substrate, a first heat dissipation body, and a second heat dissipation. The first heat dissipation body includes a first base plate attached to the substrate, and a number of first cooling fins extending from the first base plate. The second heat dissipation body includes a second base plate attached to tops of first cooling fins and a number of second cooling fins extending from the second base plate.

Abstract: A heat sink includes a base, two heat pipes, a fin assembly, and two thermally conductive cover. The heat pipes are thermally connected to the base. Each of the heat pipes includes a cylindrical body and an ineffective end portion distal from the base. The ineffective end portion is connected to the cylindrical body. A diameter of the ineffective end portion is smaller than that of the body. The fin assembly is thermally coupled to the two heat pipes. Each of the thermally conductive covers envelops the ineffective end portion and is in thermal contact with the ineffective end portion and the fin assembly.

Abstract: A computer system includes an enclosure having an air intake, a heat sink and an electronic element. The heat sink includes a first heat dissipating portion, a second heat dissipating portion, and a third heat dissipating portion interconnecting the first and second heat dissipating portions. Each of the first heat dissipating portion, second heat dissipating portion, and third heat dissipating portion includes a number of fins and passages formed between each two adjacent fins. The passages of the first heat dissipating portion face toward the air intake. A space is maintained between the first heat dissipating portion and the second heat dissipating portion, and the electronic element is mounted in the space.

Abstract: A fan speed control system includes a fan, a hardware device, and a basic input/output system (BIOS) module. The BIOS module includes a memory unit, an edit unit, a searching unit, and a control unit. The memory unit stores a matching table of different hardware device numbers and corresponding fan speed control curves. The edit unit is operable to edit the matching table. The searching unit is operable to read the matching table and search which fan speed control curve matches with the hardware device number of the hardware device. The control unit is operable to select the matched fan speed control curve to control the fan speed of the fan.

Abstract: An electronic device and a method for controlling fan speed of the electronic device include setting a speed range corresponding to a variety of pulse-width modulation (PWM) duty cycles of the fan, and setting a speed variation value of the fan. The method further includes reading the PWM duty cycle and detecting an actual speed of the fan, and adjusting the PWM duty cycle in the PWM duty cycle instruction according to the speed variation value.

Abstract: A heat sink includes a cooling member to dissipate heat, and a fixing member for mounting fasteners. The cooling member includes a base and a number of fins extending from the base. The cooling member and the fixing member are independently formed, and the fixing member is fixed to a bottom of the base of the cooling member via fixing means.

Abstract: One embodiment of the present invention provides a method for forming a nanoparticle film, which comprises the steps of: preparing a nanoparticle solution, which comprises a solvent and supersaturated nanoparticles with surface ligand molecules; and dip coating a substrate to the nanoparticle solutions to form a first monolayer of the nanoparticles on the substrate, the first monolayer and repeatedly formed monolayers on top of the first monolayer constructing the nanoparticle film. Another embodiment of the present invention provides a nanoparticle film, comprising a first monolayer consisted of a two-dimensional nanoparticles array that are near-field coupled with each other to have tunable plasmonic properties by changing the number of stacked monolayers.

Abstract: A disk drive assembly includes a disk drive, a carrier containing the disk drive and a pad. The carrier includes a bottom frame and two opposite sidewalls connected to two opposite edges of the bottom frame. The pad is sandwiched between the disk drive and each of the two sidewalls.

Abstract: A computer enclosure includes a chassis, a mounting frame, two air-guiding members, and a fan. The chassis includes a ventilation area defining a plurality of ventilation through holes. The mounting frame is fixed to the chassis and faces the ventilation through holes. The mounting frame configured for receiving electronic components. The two air-guiding members respectively connect two opposite sides of the mounting frame to the chassis. The two air-guiding members incline relative to the mounting frame and the chassis to form an air passage. The fan is configured for exhausting air passing through the ventilation through holes and the mounting frame.

Abstract: A method for modifying a surface in selective areas and a method for forming patterns are described. A template is attached to a surface of a sample, and plasma is provided to selectively modify the surface by using the template as a mask. Consequently, a pattern consisting of a modified area and an unmodified area is formed on the surface of the sample.

Abstract: A heat sink includes a cooling member to dissipate heat, and a fixing member for mounting fasteners. The cooling member includes a base and a number of fins extending from the base. The cooling member and the fixing member are independently formed, and the fixing member is fixed to a bottom of the base of the cooling member via fixing means.

Abstract: An electronic device includes a housing, a track formed on the housing, and a sliding bar slidable along the track. The sliding bar has a cleaning element. When the sliding bar slides along the track, the cleaning element cleans oil, dust, and such from the display panel of the electronic device.