Patents by Inventor Meng-Tse Chen

Meng-Tse Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10504858
    Abstract: A package structure including a semiconductor die, a warpage control layer, an insulating encapsulant and a redistribution layer is provided. The semiconductor die has an active surface and a backside surface opposite to the active surface. The warpage control layer is disposed on the backside surface of the semiconductor die, wherein the warpage control layer comprises a material having a Young's Modulus of 100 GPa or more. The insulating encapsulant is encapsulating the semiconductor die and the warpage control layer. The redistribution layer is located on the insulating encapsulant and over the active surface of the semiconductor die.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: December 10, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Meng-Tse Chen, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Hao-Cheng Hou, Jung-Wei Cheng
  • Patent number: 10503973
    Abstract: There is provided a pupil tracking device including an active light source, an image sensor and a processing unit. The active light source emits light toward an eyeball alternatively in a first brightness value and a second brightness value. The image sensor captures a first brightness image corresponding to the first brightness value and a second brightness image corresponding to the second brightness value. The processing unit identifies a brightest region at corresponding positions of the first brightness image and the second brightness image as an active light image.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: December 10, 2019
    Assignee: PIXART IMAGING INC.
    Inventors: Yu-Hao Huang, Ming-Tsan Kao, Yi-Fang Lee, En-Feng Hsu, Meng-Huan Hsieh, Nien-Tse Chen
  • Patent number: 10490539
    Abstract: A semiconductor device includes a first package component and a second package component. The first package component has a first die formed on a first substrate. A second package component has a second die formed on a second substrate. A thermal isolation material is attached on the first die, wherein the thermal isolation material thermally insulates the second die from the first die, and the thermal isolation material has a thermal conductivity of from about 0.024 W/mK to about 0.2 W/mK. A first set of conductive elements couples the first package component to the second package component.
    Type: Grant
    Filed: August 4, 2016
    Date of Patent: November 26, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Meng-Tse Chen, Kuei-Wei Huang, Tsai-Tsung Tsai, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu
  • Publication number: 20190333877
    Abstract: A semiconductor device including a chip package, a dielectric structure and a first antenna pattern is provided. The dielectric structure disposed on the chip package and includes a cavity and a vent in communication with the cavity. The first antenna pattern disposed on the dielectric structure, wherein the chip package is electrically coupled to the first antenna pattern, and the cavity of the dielectric structure is disposed between the chip package and the first antenna pattern. A manufacturing method of a semiconductor device is also provided.
    Type: Application
    Filed: April 30, 2018
    Publication date: October 31, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Albert Wan, Ching-Hua Hsieh, Chao-Wen Shih, Han-Ping Pu, Meng-Tse Chen, Sheng-Hsiang Chiu
  • Publication number: 20190333870
    Abstract: A package structure including a semiconductor die, a warpage control layer, an insulating encapsulant and a redistribution layer is provided. The semiconductor die has an active surface and a backside surface opposite to the active surface. The warpage control layer is disposed on the backside surface of the semiconductor die, wherein the warpage control layer comprises a material having a Young's Modulus of 100 GPa or more. The insulating encapsulant is encapsulating the semiconductor die and the warpage control layer. The redistribution layer is located on the insulating encapsulant and over the active surface of the semiconductor die.
    Type: Application
    Filed: April 27, 2018
    Publication date: October 31, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Meng-Tse Chen, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Hao-Cheng Hou, Jung-Wei Cheng
  • Publication number: 20190273068
    Abstract: An embodiment is method including forming a first die package over a carrier substrate, the first die package comprising a first die, forming a first redistribution layer over and coupled to the first die, the first redistribution layer including one or more metal layers disposed in one or more dielectric layers, adhering a second die over the redistribution layer, laminating a first dielectric material over the second die and the first redistribution layer, forming first vias through the first dielectric material to the second die and forming second vias through the first dielectric material to the first redistribution layer, and forming a second redistribution layer over the first dielectric material and over and coupled to the first vias and the second vias.
    Type: Application
    Filed: April 29, 2019
    Publication date: September 5, 2019
    Inventors: Meng-Tse Chen, Chung-Shi Liu, Chih-Wei Lin, Hui-Min Huang, Hsuan-Ting Kuo, Ming-Da Cheng
  • Publication number: 20190221544
    Abstract: The present disclosure, in some embodiments, relates to a method of forming a package. The method includes coupling a first package component to a second package component using a first set of conductive elements. A first polymer-comprising material is formed over the second package component and surrounding the first set of conductive elements. The first polymer-comprising material is cured to solidify the first polymer-comprising material. A part of the first polymer-comprising material is removed to expose an upper surface of the second package component. The second package component is coupled to a third package component using a second set of conductive elements that are formed onto the upper surface of the second package component.
    Type: Application
    Filed: March 21, 2019
    Publication date: July 18, 2019
    Inventors: Meng-Tse Chen, Yu-Chih Liu, Hui-Min Huang, Wei-Hung Lin, Jing Ruei Lu, Ming-Da Cheng, Chung-Shi Liu
  • Patent number: 10325883
    Abstract: A method includes attaching a first semiconductor package on a carrier, wherein the first semiconductor package comprises a plurality of stacked semiconductor dies and a plurality of contact pads, depositing a first molding compound layer over the carrier, wherein the first semiconductor package is embedded in the first molding compound layer, forming a plurality of vias over the plurality of contact pads, attaching a semiconductor die on the first molding compound layer, depositing a second molding compound layer over the carrier, wherein the semiconductor die and the plurality of vias are embedded in the second molding compound layer, forming an interconnect structure over the second molding compound layer and forming a plurality of bumps over the interconnect structure.
    Type: Grant
    Filed: November 10, 2017
    Date of Patent: June 18, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sheng-Hsiang Chiu, Meng-Tse Chen, Ching-Hua Hsieh, Chung-Shi Liu, Sheng-Feng Weng, Ming-Da Cheng
  • Publication number: 20190139787
    Abstract: An integrated fan-out (InFO) package includes at least one die, a plurality of conductive structures, an encapsulant, an enhancement layer, and a redistribution structure. The die has an active surface and includes a plurality of conductive posts on the active surface. The conductive structures surround the die. The encapsulant partially encapsulates the die. The enhancement layer is over the encapsulant. A top surface of the enhancement layer is substantially coplanar with top surfaces of the conductive posts and the conductive structures. A material of the enhancement layer is different from a material of the encapsulant. A roughness of an interface between the encapsulant and the enhancement layer is larger than a roughness of the top surface of the enhancement layer. The redistribution structure is over the enhancement layer and is electrically connected to the conductive structures and the die.
    Type: Application
    Filed: December 5, 2017
    Publication date: May 9, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Meng-Tse Chen, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Sheng-Hsiang Chiu, Yao-Tong Lai
  • Patent number: 10283470
    Abstract: A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package includes a chip, a molding compound, and a dielectric layer. The chip has a connector thereon. The molding compound encapsulates the chip, wherein a surface of the molding compound is substantially lower than an active surface of the chip. The dielectric layer is disposed over the chip and the molding compound, wherein the dielectric layer has a planar surface, and a material of the dielectric layer is different from a material of the molding compound.
    Type: Grant
    Filed: May 19, 2017
    Date of Patent: May 7, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Wei Lin, Shing-Chao Chen, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu, Meng-Tse Chen, Sheng-Hsiang Chiu, Sheng-Feng Weng
  • Patent number: 10283377
    Abstract: An integrated fan-out (InFO) package includes at least one die, a plurality of conductive structures, an encapsulant, an enhancement layer, and a redistribution structure. The die has an active surface and includes a plurality of conductive posts on the active surface. The conductive structures surround the die. The encapsulant partially encapsulates the die. The enhancement layer is over the encapsulant. A top surface of the enhancement layer is substantially coplanar with top surfaces of the conductive posts and the conductive structures. A material of the enhancement layer is different from a material of the encapsulant. A roughness of an interface between the encapsulant and the enhancement layer is larger than a roughness of the top surface of the enhancement layer. The redistribution structure is over the enhancement layer and is electrically connected to the conductive structures and the die.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: May 7, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Meng-Tse Chen, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Sheng-Hsiang Chiu, Yao-Tong Lai
  • Publication number: 20190131261
    Abstract: Some embodiments relate to a semiconductor device package, which includes a substrate with a contact pad. A non-solder ball is coupled to the contact pad at a contact pad interface surface. A layer of solder is disposed over an outer surface of the non-solder ball, and has an inner surface and an outer surface which are generally concentric with the outer surface of the non-solder ball. An intermediate layer separates the non-solder ball and the layer of solder. The intermediate layer is distinct in composition from both the non-solder ball and the layer of solder. Sidewalls of the layer of solder are curved or sphere-like and terminate at a planar surface, which is disposed at a maximum height of the layer of solder as measured from the contact pad interface surface.
    Type: Application
    Filed: December 27, 2018
    Publication date: May 2, 2019
    Inventors: Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng, Mirng-Ji Lii, Meng-Tse Chen, Wei-Hung Lin
  • Patent number: 10276541
    Abstract: An embodiment is method including forming a first die package over a carrier substrate, the first die package comprising a first die, forming a first redistribution layer over and coupled to the first die, the first redistribution layer including one or more metal layers disposed in one or more dielectric layers, adhering a second die over the redistribution layer, laminating a first dielectric material over the second die and the first redistribution layer, forming first vias through the first dielectric material to the second die and forming second vias through the first dielectric material to the first redistribution layer, and forming a second redistribution layer over the first dielectric material and over and coupled to the first vias and the second vias.
    Type: Grant
    Filed: June 30, 2015
    Date of Patent: April 30, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Meng-Tse Chen, Chung-Shi Liu, Chih-Wei Lin, Hui-Min Huang, Hsuan-Ting Kuo, Ming-Da Cheng
  • Patent number: 10269763
    Abstract: The present disclosure relates to a package-on-package structure providing mechanical strength and warpage control. In some embodiments, the package-on-package structure includes a first set of conductive elements coupling a first package component to a second package component. A first molding material is arranged on the first package component. The first molding material surrounds the first set of conductive elements and outer sidewalls of the second package component and has a top surface below a top surface of the second package component. The stacked integrated chip structure further includes a second set of conductive elements that couples the second package component to a third package component.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: April 23, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Meng-Tse Chen, Yu-Chih Liu, Hui-Min Huang, Wei-Hung Lin, Jing Ruei Lu, Ming-Da Cheng, Chung-Shi Liu
  • Patent number: 10192804
    Abstract: A device comprises a first package component, and a first metal trace and a second metal trace on a top surface of the first package component. The device further includes a dielectric mask layer covering the top surface of the first package component, the first metal trace and the second metal trace, wherein the dielectric mask layer has an opening therein exposing the first metal trace. The device also includes a second package component and an interconnect formed on the second package component, the interconnect having a metal bump and a solder bump formed on the metal bump, wherein the solder bump contacts the first metal trace in the opening of the dielectric mask layer.
    Type: Grant
    Filed: July 9, 2012
    Date of Patent: January 29, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Meng-Tse Chen, Wei-Hung Lin, Chih-Wei Lin, Kuei-Wei Huang, Hui-Min Huang, Ming-Da Cheng, Chung-Shi Liu
  • Patent number: 10177104
    Abstract: Some embodiments relate to a semiconductor device package, which includes a substrate with a contact pad. A non-solder ball is coupled to the contact pad at a contact pad interface surface. A layer of solder is disposed over an outer surface of the non-solder ball, and has an inner surface and an outer surface which are generally concentric with the outer surface of the non-solder ball. An intermediate layer separates the non-solder ball and the layer of solder. The intermediate layer is distinct in composition from both the non-solder ball and the layer of solder. Sidewalls of the layer of solder are curved or sphere-like and terminate at a planar surface, which is disposed at a maximum height of the layer of solder as measured from the contact pad interface surface.
    Type: Grant
    Filed: June 23, 2017
    Date of Patent: January 8, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng, Mirng-Ji Lii, Meng-Tse Chen, Wei-Hung Lin
  • Patent number: 10153180
    Abstract: A system and method for applying an underfill is provided. An embodiment comprises applying an underfill to a substrate and patterning the underfill. Once patterned other semiconductor devices, such as semiconductor dies or semiconductor packages may then be attached to the substrate through the underfill, with electrical connections from the other semiconductor devices extending into the pattern of the underfill.
    Type: Grant
    Filed: October 2, 2013
    Date of Patent: December 11, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Meng-Tse Chen, Hsiu-Jen Lin, Wei-Hung Lin, Kuei-Wei Huang, Ming-Da Cheng, Chung-Shi Liu
  • Publication number: 20180342482
    Abstract: Methods of packaging semiconductor devices and packaged semiconductor devices are disclosed. In some embodiments, a method of packaging a semiconductor device includes forming a dam structure on dies proximate edge regions of the dies. A molding material is disposed around the dies, and a top portion of the molding material and a top portion of the dam structure are removed.
    Type: Application
    Filed: August 6, 2018
    Publication date: November 29, 2018
    Inventors: Chen-Hua Yu, Chung-Shi Liu, Meng-Tse Chen, Hui-Min Huang, Chih-Fan Huang, Ming-Da Cheng
  • Publication number: 20180337149
    Abstract: A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package includes a chip, a molding compound, and a dielectric layer. The chip has a connector thereon. The molding compound encapsulates the chip, wherein a surface of the molding compound is substantially lower than an active surface of the chip. The dielectric layer is disposed over the chip and the molding compound, wherein the dielectric layer has a planar surface, and a material of the dielectric layer is different from a material of the molding compound.
    Type: Application
    Filed: May 19, 2017
    Publication date: November 22, 2018
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Wei Lin, Shing-Chao Chen, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu, Meng-Tse Chen, Sheng-Hsiang Chiu, Sheng-Feng Weng
  • Publication number: 20180337106
    Abstract: A device comprises a first package component, and a first metal trace and a second metal trace on a top surface of the first package component. The device further includes a dielectric mask layer covering the top surface of the first package component, the first metal trace and the second metal trace, wherein the dielectric mask layer has an opening therein exposing the first metal trace. The device also includes a second package component and an interconnect formed on the second package component, the interconnect having a metal bump and a solder bump formed on the metal bump, wherein the solder bump contacts the first metal trace in the opening of the dielectric mask layer.
    Type: Application
    Filed: July 31, 2018
    Publication date: November 22, 2018
    Inventors: Meng-Tse Chen, Wei-Hung Lin, Chih-Wei Lin, Kuei-Wei Huang, Hui-Min Huang, Ming-Da Cheng, Chung-Shi Liu