Abstract: The present invention relates to a method for screening protein-protein interaction inhibitors using a nanopore, a method for analyzing protein structures, a method for analyzing protein-protein interactions, and a kit therefor.

Abstract: A nonvolatile memory device includes a first area of single-level cells (SLCs) and a second area of multi-level cells (MLCs). The device determines whether a free block can be created by copying data between memory blocks of the first area. Upon determining that the free memory block can be created by copying data between the memory blocks of the first area, the device copies the data between the memory blocks of the first area to create the free memory block. Otherwise, the device selects at least one memory block from the first area and allocates the selected memory block as free memory block by copying the data stored in the selected memory block of the first area to the second area.

Abstract: A method of operating a memory controller includes allocating a new entry whenever a write command is input from a host; and transferring data corresponding to an entry in a specific state among a plurality of states to the host in response to a read command output from the host, wherein the plurality of states are a FREE state, a WRITE state, a WRITE OLD state, a READ state, a PEND state, a PEND OLD state, a CACHE state, and a DEL state, and the specific state is at least one of the PEND state, the PEND OLD state, or the CACHE state.

Abstract: A method of executing a write operation in a nonvolatile memory system includes receiving a write command indicating the write operation and write data associated with the write operation, and determining a selected merge size for use by a merge operation responsive to the write command by determining a number of free blocks and then determining a selected free block level (FBL) from among a plurality of FBLs in accordance with the number of free blocks.

Abstract: A method of operating a memory controller includes allocating a new entry whenever a write command is input from a host; and transferring data corresponding to an entry in a specific state among a plurality of states to the host in response to a read command output from the host, wherein the plurality of states are a FREE state, a WRITE state, a WRITE OLD state, a READ state, a PEND state, a PEND OLD state, a CACHE state, and a DEL state, and the specific state is at least one of the PEND state, the PEND OLD state, or the CACHE state.

Abstract: A method of executing a write operation in a nonvolatile memory system includes receiving a write command indicating the write operation and write data associated with the write operation, and determining a selected merge size for use by a merge operation responsive to the write command by determining a number of free blocks and then determining a selected free block level (FBL) from among a plurality of FBLs in accordance with the number of free blocks.

Abstract: Disclosed is a method of executing a write operation in a nonvolatile memory system. The method includes receiving a write command indicating the write operation and write data associated with the write operation, and determining a selected merge size for use by a merge operation responsive to the write command by determining a number of free blocks and then determining a selected free block level (FBL) from among a plurality of FBLs in accordance with the number of free blocks.

Abstract: A nonvolatile memory device comprises a first area of single-level cells (SLCs) and a second area of multi-level cells (MLCs). The device determines whether a free block can be created by copying data between memory blocks of the first area. Upon determining that the free memory block can be created by copying data between the memory blocks of the first area, the device copies the data between the memory blocks of the first area to create the free memory block. Otherwise, the device selects at least one memory block from the first area and allocates the selected memory block as free memory block by copying the data stored in the selected memory block of the first area to the second area.

Abstract: Disclosed is a method of executing a write operation in a nonvolatile memory system. The method includes receiving a write command indicating the write operation and write data associated with the write operation, and determining a selected merge size for use by a merge operation responsive to the write command by determining a number of free blocks and then determining a selected free block level (FBL) from among a plurality of FBLs in accordance with the number of free blocks.

Abstract: A storage device performs a program operation to store program data in a selected memory block of a flash memory. The storage device allocates a reserved area of the flash memory as a free block upon detecting that a program failure has occurred in the program operation, reads the program data from a cache latch in a page buffer of the flash memory, copies valid data stored in the selected memory block to a first area of the free block, and reprograms the program data read from the cache latch to a second area of the free block.

Abstract: Integrated circuit ferroelectric memory devices are manufactured by forming a first patterned conductive layer on an integrated circuit substrate, to define a lower capacitor electrode and a gate electrode that is spaced apart therefrom. A source region and a drain region are formed on opposite sides of the gate electrode. A ferroelectric layer is formed on the lower capacitor electrode. An upper capacitor electrode is formed on the ferroelectric layer opposite the lower capacitor electrode, to thereby form a ferroelectric capacitor. After forming the upper capacitor electrode, an interconnect layer is formed that electrically connects the top electrode and the source region. A bit line is formed that electrically contacts the drain region. Preferably, both the interconnect layer and the bit line are formed from the same conductive layer.

Abstract: Integrated circuit ferroelectric memory devices are manufactured by forming a first patterned conductive layer on an integrated circuit substrate, to define a lower capacitor electrode and a gate electrode that is spaced apart therefrom. A source region and a drain region are formed on opposite sides of the gate electrode. A ferroelectric layer is formed on the lower capacitor electrode. An upper capacitor electrode is formed on the ferroelectric layer opposite the lower capacitor electrode, to thereby form a ferroelectric capacitor. After forming the upper capacitor electrode, an interconnect layer is formed that electrically connects the top electrode and the source region. A bit line is formed that electrically contacts the drain region. Preferably, both the interconnect layer and the bit line are formed from the same conductive layer.

Abstract: A first conductive impurity ion is implanted into a semiconductor substrate to form a well area on which a gate electrode is formed. A first non-conductive impurity is implanted into the well area on both sides of the gate electrode to control a substrate defect therein and to form a first precipitate area to a first depth. A second conductive impurity ion is implanted into the well area on both sides of the gate electrode, so that a source/drain area is formed to a second depth being relatively shallower than the first depth. A second non-conductive impurity is implanted into the source/drain area so as to control a substrate defect therein and to form a second precipitate area. As a result, substrate defects such as dislocation, extended defect, and stacking fault are isolated from a P-N junction area, thereby forming a stable P-N junction.

Abstract: Methods of forming FRAM devices include the steps of forming first and second field effect access transistors in a semiconductor substrate, forming first and second bit lines (BL) electrically coupled to a drain region of the first field effect access transistor and a drain region of the second field effect access transistor, respectively, and forming first and second ferroelectric capacitors (CF) between the first and second bit lines in order to improve integration density. These first and second ferroelectric capacitors share a first electrode extending between the first and second bit lines and have respective second electrodes electrically coupled to respective source regions of the first and second field effect access transistors. The preferred methods may also include the step of forming a field oxide isolation region adjacent a face of the substrate and extending between the first and second field effect access transistors.