Patents by Inventor Mi Sun Hwang

Mi Sun Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220104345
    Abstract: A printed circuit board includes: an insulating layer; and a first circuit layer disposed on an upper surface of the insulating layer. A lower surface of the first circuit layer is in contact with at least a portion of the insulating layer, and the first circuit layer includes a first region embedded in the insulating layer, and a second region protruding from the upper surface of the insulating layer.
    Type: Application
    Filed: December 10, 2020
    Publication date: March 31, 2022
    Inventors: Ga Young YOO, Mi Sun HWANG, Jun Hyeong JANG
  • Publication number: 20220078905
    Abstract: A printed circuit board includes a first insulating layer having a first modulus; a second insulating layer disposed on the first insulating layer and having a second modulus; and a cavity penetrating the second insulating layer, wherein the second modulus is greater than the first modulus, and wherein an edge portion of a bottom surface of the cavity is formed of an insulating material.
    Type: Application
    Filed: March 11, 2021
    Publication date: March 10, 2022
    Inventors: Dae Jung BYUN, Mi Sun HWANG, Jung Soo KIM, Jin Won LEE, Duck Young MAENG
  • Publication number: 20220039261
    Abstract: A printed circuit board and an electronic component-embedded substrate including the same are provided. The printed circuit board includes a first insulating layer, a second insulating layer disposed on the first insulating layer, a barrier layer disposed between the first and second insulating layers, a cavity penetrating through one of the first and second insulating layers, and a first wiring layer at least partially in contact with the barrier layer. The barrier layer has a modulus lower than a modulus of each of the first and second insulating layers.
    Type: Application
    Filed: March 22, 2021
    Publication date: February 3, 2022
    Inventors: Mi Sun HWANG, Jun Hyeong JANG, Byung Duk NA
  • Publication number: 20220030710
    Abstract: A substrate with an electronic component embedded therein includes: a core layer having a through-portion; an electronic component disposed in the through-portion; an encapsulant disposed on a lower surface of the core layer, disposed in at least a portion of the through-portion, and covering at least a portion of a lower surface of the electronic component; and a build-up structure disposed on an upper surface of the core layer, and including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers.
    Type: Application
    Filed: March 11, 2021
    Publication date: January 27, 2022
    Inventors: Song I Kim, Mi Sun Hwang
  • Patent number: 11183462
    Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and a plurality of core wiring layers disposed on or in the first insulating body, and having a cavity penetrating at least a portion of the first insulating body in a thickness direction of the substrate and including a stopper layer as a bottom surface of the cavity, and an electronic component disposed in the cavity and attached to the stopper layer, and a surface of the stopper layer connected to the electronic component has a composite including at least two among a metal material, an inorganic particle, a filler, and an insulating resin.
    Type: Grant
    Filed: March 5, 2020
    Date of Patent: November 23, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Mi Sun Hwang, Dae Jung Byun, Chang Hwa Park, Sang Ho Jeong, Jun Hyeong Jang, Ki Ho Na, Je Sang Park, Yong Duk Lee, Yoo Rim Cha, Yeo Il Park
  • Patent number: 11076487
    Abstract: An electronic component embedded substrate includes a core structure including a first insulating body and core wiring layers and having a cavity and a stopper layer. An electronic component is disposed in the cavity. The stopper layer includes a first metal layer embedded in the first insulating body and having a portion of an inner surface exposed from the first insulating body, and a second metal layer disposed below the first metal layer and having at least a portion of an upper surface disposed as a bottom surface of the cavity. The cavity has an inner surface of the first metal layer and an inner surface of the first insulating body as a first wall surface and a second wall surface, respectively, and an inclination of the first wall surface is different from an inclination of the second wall surface.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: July 27, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Mi Sun Hwang, Deok Man Kang, Jun Hyeong Jang
  • Publication number: 20210193609
    Abstract: An electronic component embedded substrate includes a core structure including a first insulating body and core wiring layers and having a cavity and having a stopper layer disposed as a bottom surface; an electronic component disposed in the cavity and attached to the stopper layer; and a build-up structure including a second insulating body covering at least a portion each of the core structure and the electronic component and filling at least a portion of the cavity, and build-up wiring layers wherein the stopper layer has a first region in which a portion of one surface is exposed from the first insulating body and a second region in which the other portion of one surface is covered with the first insulating body, and a surface roughness of one surface of the stopper layer in the first region is greater than that of the stopper layer in the second region.
    Type: Application
    Filed: February 28, 2020
    Publication date: June 24, 2021
    Inventors: Mi Sun Hwang, Dae Jung Byun, Chang Hwa Park, Sang Ho Jeong, Jun Hyeong Jang, Ki Ho Na, Je Sang Park, Yong Duk Lee, Yoo Rim Cha, Yeo Il Park
  • Publication number: 20210185819
    Abstract: An electronic component embedded substrate includes a core structure including a first insulating body and core wiring layers and having a cavity and a stopper layer. An electronic component is disposed in the cavity. The stopper layer includes a first metal layer embedded in the first insulating body and having a portion of an inner surface exposed from the first insulating body, and a second metal layer disposed below the first metal layer and having at least a portion of an upper surface disposed as a bottom surface of the cavity. The cavity has an inner surface of the first metal layer and an inner surface of the first insulating body as a first wall surface and a second wall surface, respectively, and an inclination of the first wall surface is different from an inclination of the second wall surface.
    Type: Application
    Filed: March 16, 2020
    Publication date: June 17, 2021
    Inventors: Mi Sun HWANG, Deok Man KANG, Jun Hyeong JANG
  • Publication number: 20210183774
    Abstract: A substrate embedded electronic component package includes a core member having a cavity in which a metal layer is disposed on a bottom surface thereof, an electronic component disposed in the cavity, an encapsulant filling at least a portion of the cavity and covering at least a portion of each of the core member and the electronic component, and a connection structure disposed on the encapsulant and including a first wiring layer connected to the electronic component. A wall surface of the cavity has at least one groove portion protruding outwardly from a center of the cavity, and the groove portion extends to a same depth in the core member as a depth of the cavity.
    Type: Application
    Filed: March 10, 2020
    Publication date: June 17, 2021
    Inventors: Dae Jung BYUN, Chang Hwa PARK, Sang Ho JEONG, Je Sang PARK, Mi Sun HWANG, Yong Duk LEE, Jin Won LEE, Yeo Il PARK
  • Publication number: 20210183784
    Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and a plurality of core wiring layers disposed on or in the first insulating body, and having a cavity penetrating at least a portion of the first insulating body in a thickness direction of the substrate and including a stopper layer as a bottom surface of the cavity, and an electronic component disposed in the cavity and attached to the stopper layer, and a surface of the stopper layer connected to the electronic component has a composite including at least two among a metal material, an inorganic particle, a filler, and an insulating resin.
    Type: Application
    Filed: March 5, 2020
    Publication date: June 17, 2021
    Inventors: Mi Sun HWANG, Dae Jung BYUN, Chang Hwa PARK, Sang Ho JEONG, Jun Hyeong JANG, Ki Ho NA, Je Sang PARK, Yong Duk LEE, Yoo Rim CHA, Yeo Il PARK
  • Patent number: 11017930
    Abstract: An inductor includes a body structure, a first external electrode and a second external electrode disposed externally on the body structure and spaced apart from each other, and a conductive structure disposed inside the body structure and including a first end portion in contact with the first external electrode and a second end portion in contact with the second external electrode, wherein each of the first and second external electrodes includes an electroless plated layer and an electrolytic plated layer formed of a material different from that of the electroless plated layer and covering the electroless plated layer.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: May 25, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Mi Sun Hwang, Jin Gul Hyun
  • Patent number: 11013114
    Abstract: A printed circuit board is provided. The printed circuit board includes an insulating material, and a circuit comprising a first region that partially penetrates the insulating material, and a second region formed on the first region and that protrudes from an upper portion of the insulating material, the first region includes a first electroplating layer and a first electroless plating layer that are formed between the insulating material and the first electroplating layer.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: May 18, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seon-Ha Kang, Sa-Yong Lee, Mi-Sun Hwang, Ju-Ho Kim
  • Patent number: 10887986
    Abstract: A printed circuit board includes an insulating layer, a pad, and a via fill. The insulating layer includes a via hole. The pad is formed in the insulating layer such that an intermediate portion thereof is exposed by the via hole. The pad includes a through hole formed in the intermediate portion. The via fill is formed in the via hole, configured to fill the through hole, and coupled to the intermediate portion.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: January 5, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Mi-Sun Hwang, Sun-A Kim
  • Patent number: 10849226
    Abstract: A printed circuit board includes: an insulating layer having a via hole formed therein; a single layer metal pad disposed in the insulating layer and having a center portion that is exposed by the via hole, the center portion of the pad having a higher roughness than peripheral portions of the pad; and a via formed in the via hole and connected to the center portion of the pad.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: November 24, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Mi-Sun Hwang, Hye-Won Jung, Jae-Sung Sim, Byung-Duk Na, Hee-Joon Chun, Sun-A Kim, Deok-Man Kang
  • Patent number: 10779409
    Abstract: A printed circuit board including: an insulating material; a metal layer stacked on a surface of the insulating material; and a via hole passing through the metal layer and the insulating material. The metal layer decreases in thickness in a region adjacent to the via hole, and an interface between the insulating material and the metal layer includes a region that is directed toward the via hole.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: September 15, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Byung-Duk Na, Hye-Won Jung, Jae-Sung Sim, Mi-Sun Hwang, Hee-Joon Chun, Deok-Man Kang, Sun-A Kim
  • Publication number: 20200178390
    Abstract: A printed circuit board includes an insulating layer, a pad, and a via fill. The insulating layer includes a via hole. The pad is formed in the insulating layer such that an intermediate portion thereof is exposed by the via hole. The pad includes a through hole formed in the intermediate portion. The via fill is formed in the via hole, configured to fill the through hole, and coupled to the intermediate portion.
    Type: Application
    Filed: November 7, 2019
    Publication date: June 4, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Mi-Sun HWANG, Sun-A KIM
  • Publication number: 20200178392
    Abstract: A printed circuit board includes: an insulating layer having a via hole formed therein; a single layer metal pad disposed in the insulating layer and having a center portion that is exposed by the via hole, the center portion of the pad having a higher roughness than peripheral portions of the pad; and a via formed in the via hole and connected to the center portion of the pad.
    Type: Application
    Filed: October 25, 2019
    Publication date: June 4, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Mi-Sun HWANG, Hye-Won JUNG, Jae-Sung SIM, Byung-Duk NA, Hee-Joon CHUN, Sun-A KIM, Deok-Man KANG
  • Publication number: 20200170110
    Abstract: A printed circuit board is provided. The printed circuit board includes an insulating material, and a circuit comprising a first region that partially penetrates the insulating material, and a second region formed on the first region and that protrudes from an upper portion of the insulating material, the first region includes a first electroplating layer and a first electroless plating layer that are formed between the insulating material and the first electroplating layer.
    Type: Application
    Filed: October 23, 2019
    Publication date: May 28, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seon-Ha KANG, Sa-Yong LEE, Mi-Sun HWANG, Ju-Ho KIM
  • Publication number: 20200154568
    Abstract: A printed circuit board including: an insulating material; a metal layer stacked on a surface of the insulating material; and a via hole passing through the metal layer and the insulating material. The metal layer decreases in thickness in a region adjacent to the via hole, and an interface between the insulating material and the metal layer includes a region that is directed toward the via hole.
    Type: Application
    Filed: November 5, 2019
    Publication date: May 14, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Byung-Duk NA, Hye-Won JUNG, Jae-Sung SIM, Mi-Sun HWANG, Hee-Joon CHUN, Deok-Man KANG, Sun-A KIM
  • Patent number: 10650958
    Abstract: A coil electronic component includes a body portion and an external electrode. The body portion includes a coil layer and a reinforcing layer disposed on at least one of an upper portion and a lower portion of the coil layer. The external electrode is disposed on an outer surface of the body portion. The coil layer includes an insulating layer, a coil pattern, and a first conductivity type via penetrating through the insulating layer to be connected to the coil pattern, and the reinforcing layer has a higher degree of rigidity than the insulating layer.
    Type: Grant
    Filed: August 9, 2016
    Date of Patent: May 12, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dae Hui Jo, Han Lee, Mi Sun Hwang, Jeong Min Cho, Myung Sam Kang, Seok Hwan Ahn, Tae Hoon Kim