Patents by Inventor Michael A. Bunyan

Michael A. Bunyan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180344515
    Abstract: The present disclosure provides for a thermoregulatory glove for reducing sleep latency. The thermoregulatory glove includes a gel pocket with a gel pack disposed inside of the gel pocket. A method for producing a convergence in body temperature of a subject includes heating the thermoregulatory glove, placing the heated thermoregulatory glove on a hand of the subject, and cooling the thermoregulatory glove.
    Type: Application
    Filed: June 4, 2018
    Publication date: December 6, 2018
    Inventors: Matthew Ebben, Michael Bunyan, Gino Banco, William Lionetta, George Spies, Marc Larosee, Steven Bythrow, Andrew Douglas Sylvester
  • Publication number: 20070224441
    Abstract: A reactive foil assembly for the packaging and presenting of a reactive foil. The reactive foil assembly comprising a reactive foil, a film, a flex circuit and an adhesive. The reactive foil is placed above the film such that a portion of the reactive foil does not overlap with the film. The flex circuit is also placed above the film such that the flex circuit is operably coupled to the reactive foil. The reactive foil assembly is placed over a surface such that the film adheres to the surface with the help of the adhesive. The reactive foil is ignited by an energy pulse provided by the power source and delivered by the flex circuit coupled to the power source. An exothermic reaction of the reactive foil is initiated, which provides a molten foil available for joining of two objects.
    Type: Application
    Filed: March 23, 2007
    Publication date: September 27, 2007
    Inventor: Michael Bunyan
  • Publication number: 20070052125
    Abstract: A form in place conductive gasket is disclosed. The gasket, foamed, gelled or unfoamed is made of one or more elastomer resins, such as silicone urethane and/or thermoplastic block copolymers and is either filled with a conductive filler and lined onto a desired substrate or lined onto the substrate unfilled and then coated with a conductive outerlayer, such as a silver filled elastomer or a conductive flocked layer. A process and system for making the gaskets are also disclosed.
    Type: Application
    Filed: September 27, 2006
    Publication date: March 8, 2007
    Inventors: John Kalinoski, Michael Bunyan
  • Publication number: 20060263570
    Abstract: The present invention discloses a thermal laminate for the dissipation of heat generated in the vicinity of an installed PCMCIA card. The thermal laminate includes a top film layer, a middle gap filler layer and a bottom layer. The top film layer provides a protective, non-resistive, low friction surface with a soft conformal interface for enhancing the workability of the thermal laminate. The middle gap filler layer is disposed underneath the top film layer and provides a conformal thermal pathway for the heat radiation emitted from the installed PCMCIA card. The bottom layer is disposed underneath the middle gap filler layer and provides a grip to the middle gap filler layer and the top film layer. The bottom layer is made from either a thermal adhesive layer or a copper foil layer. The thermal laminate utilizes sliding contacts for proper housing between a PCMCIA card surface and a heat sink surface to provide better thermal management within an assembly.
    Type: Application
    Filed: May 18, 2006
    Publication date: November 23, 2006
    Inventor: Michael Bunyan
  • Publication number: 20050241801
    Abstract: A heat sink disposable on a heat transfer surface of a heat-generating source such as an electronic component. The heat sink includes a base portion and a body portion. The base portion has a first surface disposable on the heat transfer surface, and a second surface opposite the first surface. The body portion is joined to the second surface of the base portion and is formed of a stack of corrugated sheets of one or more metal foils arranged to form a cellular, honeycomb-like structure.
    Type: Application
    Filed: January 28, 2005
    Publication date: November 3, 2005
    Inventors: Jonathan Mitchell, Michael Bunyan
  • Patent number: 5115104
    Abstract: A shielding gasket is provided, comprising a conductive or non-conductive resilient core, the surface of which is rendered electrically conductive by flocking with conductive fibers. The gasket is inexpensive, lightweight and allows a low closure force. The invention further provides a method of rendering selected areas of the surface of a core conductive by selectively flocking with conductive fibers.
    Type: Grant
    Filed: March 29, 1991
    Date of Patent: May 19, 1992
    Assignee: Chomerics, Inc.
    Inventor: Michael A. Bunyan