Abstract: A technique for non-invasively assessing current drawn by a device under test (DUT) by monitoring a supply voltage to the DUT. Frequency data for the DUT may be generated and used to form a current estimation model. First and second voltages are simultaneously measured using first and second test probes electrically connected to the DUT, while the first test probe is connected at a current source, and while the second test probe is connected at a DUT load that is configured to draw current from the current source. The current drawn by the DUT is then assessed by applying the current estimation model to the measured first and second voltages. In one case, the current drawn by the DUT is estimated without insertion of a circuit component into the DUT or extraction of a circuit conductor from the DUT.

Abstract: A technique for non-invasively assessing current drawn by a device under test (DUT) by monitoring a supply voltage to the DUT. Frequency data for the DUT may be generated and used to form a current estimation model. First and second voltages are simultaneously measured using first and second test probes electrically connected to the DUT, while the first test probe is connected at a current source, and while the second test probe is connected at a DUT load that is configured to draw current from the current source. The current drawn by the DUT is then assessed by applying the current estimation model to the measured first and second voltages. In one case, the current drawn by the DUT is estimated without insertion of a circuit component into the DUT or extraction of a circuit conductor from the DUT.

Abstract: Application of open and short structures may result in improved accuracy in determination of ABCD parameters of a substantially symmetric two-port network for purposes of bisect de-embedding. Either one or both of the open and/or short techniques may be used to improve results of an ABCD optimization algorithm. Bisect de-embedding may then be performed to determine the ABCD parameters of a device under test based on the ABCD parameters of the substantially symmetric two-port network and measured s-parameters of the substantially symmetric two-port network and the embedded device under test.

Abstract: Application of open and short structures may result in improved accuracy in determination of ABCD parameters of a substantially symmetric THRU for purposes of bisect de-embedding. Either one or both of the open and/or short techniques may be used to improve results of an ABCD optimization algorithm. Bisect de-embedding may then be performed to determine the ABCD parameters of a device under test based on the ABCD parameters of the substantially symmetric THRU and measured s-parameters of the substantially symmetric THRU and the embedded device under test.

Abstract: Various port reduction methods are employed to reduce the number of port definitions in a simulation file. A ground port reduction method is first employed to reduce certain power supply reference connections to an absolute ground reference for the circuit model. Next, all commonly defined port definitions are combined into a single port definition. Finally, a current analysis is used to further reduce the number of port definitions in the simulation file by removing the current return ports from the simulation file.

Abstract: A printed circuit board (PCB) embedded filter is utilized to provide a low-pass filter characteristic using minimal lumped circuit elements. Microstrips extend on top layer of the PCB to conductive vias to form a first series connected inductive element, while microstrips extend from conductive vias to conductive vias to form a second series connected inductive element. Shunt capacitance is employed on a lower layer using striplines extending outwardly and symmetrically from conductive vias. An absorption circuit is implemented using microstrips on back layer of the PCB and capacitive plates on inner layers of the PCB. A surface mount resistor may be installed between pads to complete the absorption circuit.

Abstract: Various apparatus for performing high frequency electronic package testing are disclosed. A test fixture assembly includes an electronics package having an interface structure, a mock-up IC, coupled to the interface structure for providing circuit connections, and a fixture board, coupled to the interface structure, wherein at least one of the fixture board and mock-up IC includes high frequency probe pads for providing a signal and ground point for high bandwidth test probing. Raw measurements are used for validation of the electronic package specifications when adequate test fixture bandwidth is available or included into circuit simulations models when a minimal phase error is acceptable, else phase and loss corrections are applied to the measurements.