Abstract: A radio-frequency identification (RFID) transponder (tag) in accordance with the principles of the invention includes a patch antenna. The patch antenna may be co-located with RFID circuitry and an impedance matching circuit on one side of a substrate. A ground plane may be formed on the opposite side of the substrate. A quarter wave transformer may provide an “RF short” to ground to connect the RFID circuitry on one side of the substrate with a ground plane located on the opposite side of the substrate.

Abstract: A magnetic tape information storage media includes a cassette housing having one or more spools for holding a length of magnetic tape and an integral radio frequency identification (RFID) transponder. The RFID transponder may be utilized by an external system to provide functions such as, automated sale, rental, or loan of the media, authentication of the media, indexing of information recorded to the media, enablement/disablement of playback of the media, recording of the number of times the media has been played, inventory, and the like.

Abstract: An impedance matching circuit in accordance with the principles of the present invention employs series-connected transmission lines to match a high reflection coefficient source impedance with a load impedance. The matching circuit is formed on a dielectric substrate material and accommodates the relatively limited capabilities of photo-lithographic circuit production. The new impedance matching circuit may be constructed of three series-connected transmission line sections. A first section, the section that is to be connected to the source, transforms the high source impedance into a relatively low valued impedance that is substantially resistive. The reflection coefficient of the first section is substantially equal to the reflection coefficient of the source. A second may be implemented as a quarter-wave transformer that transforms the low impedance developed by the first section into an intermediate impedance value.

Abstract: An RF/ID transponder comprises an integrated circuit package including at least a memory and an RF modulator. A dipole antenna is coupled to the RF modulator, and has a length greater than one-half wavelength of an electromagnetic wave having a nominal frequency within an operating frequency band of the RF modulator. A base plate provides an electrically conductive ground plane, and a housing is attached to the base plate. The integrated circuit package and the dipole antenna are supported by the housing at a predetermined distance from the conductive ground plane. Thereby, the dipole antenna provides a radiation pattern that includes at least first and second squinted beams extending at respective acute angles relative to a vector defined normal to the conductive ground plane, and at least one center beam extending along the vector defined normal to the conductive ground plane.

Abstract: Processes and apparatus for manufacturing radio frequency transponders having substrates formed from a flexible tape or film are disclosed. The RF transponders are formed on the tape so that their longest dimension (e.g., their length ("L")) is oriented parallel to the length of the tape. This layout places few or no constraints in the transponder's length allowing the length of the transponder's antenna circuit to be adjusted to satisfy the requirements of various applications.

Abstract: A system for controlling assets for inventory, loss-control, or monitoring. The system includes a combination RFID and EAS tag and a reader.

Abstract: A radio frequency identification (RFID) transponder (tag) includes a spiral over ground plane antenna. The RFID tag includes a RFID circuitry that may be implemented as an RFID tag integrated circuit and may be mounted on one surface of a substrate such as a printed circuit board. The RFID tag circuitry may be electrically connected to an impedance matching circuit printed on the same side of printed circuit board. The matching circuit is electrically connected to a spiral antenna that may be mounted on same side of the printed circuit board as the tag circuit and matching circuit. The spiral antenna is held a prescribed distance from the ground plane in order to maximize the gain of the RFID tag and to thereby maximize the range of the RFID tag.

Abstract: The present invention provides a method and apparatus for testing RFID tags using wireless radio frequency (RF) communication. The method and apparatus allow RFID tags to be tested individually or in groups while they are in close proximity to each other (e.g., within the read range of the tag).

Abstract: The invention is a radiofrequency identification tag comprising a semiconductor chip having radio frequency, logic, and memory circuits, and an antenna that are mounted on a substrate. The antenna may be used by the chip to modulate an incident RF signal to transfer information to a base station. The antenna comprises one or more lengths of thin wire that are connected directly to the chip by means of wire bonding. The chip and antenna combination are sealed with an organic film covering.

Abstract: The invention is a radiofrequency identification tag comprising a semiconductor chip having radio frequency, logic, and memory circuits, and an antenna that are mounted on a substrate. The antenna may be used by the chip to modulate an incident RF signal to transfer information to a base station. The antenna comprises one or more lengths of thin wire that are connected directly to the chip by means of wire bonding. The chip and antenna combination are sealed with an organic film covering.

Abstract: The present invention is an apparatus and method for mixing a plurality of materials in-situ to form an admixture and heating a localized portion of admixture upon dispense. The heat thereby primarily effects the speed of chemical reaction and curing of only the exiting reactants with little effect upon the admixture not dispensed. The apparatus and process are especially useful for encapsulating a plurality of workpieces at a high throughput. Advantageous configurations are described such as wherein the workpieces and/or the dispensing mechanism may be mounted on a carrier and fed by an assembly line. Alternative admixture chemistries are described.

Abstract: Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.

Abstract: Communication of information between the inside and the outside of an electrically conducting enclosure is performed through the use of a frequency selective surface on the electrically conducting enclosure, which permits passage of electromagnetic waves at particular frequencies, but prohibits waves of other frequencies from penetration. Thus, one or more objects contained within the electrically conducting enclosure, which include radio frequency tags attached to the objects containing information about the objects, may be monitored or interrogated by the transmission of an electromagnetic wave at the permitted frequency through the frequency selective surface. With such a system, control and inventory of enclosed objects may be performed while the EMI shielding function of the electrically conducting enclosure is maintained.

Abstract: The present invention is a magnetic sensor used with one or more frequency band pass filters and a logic circuit that produces a ("critical") signal that is used for enabling and disabling an external electronic circuit, e.g. a computer circuit. The magnetic sensor produces a signal when excited by an externally applied alternating current (ac) magnetic field. The external ac magnetic field can comprise one or more frequencies, each of which induces an electrical signal at the respective frequency in the sensor. Depending on the linearity of the sensor, one or more harmonic frequencies of the signal frequencies can also be induced in the sensor. One or more bandpass filters is connected to the magnetic sensor and each of the bandpass filters is tuned to filter the signal to select filtered signals, from the output of the sensor. A logic circuit is activated by one or more of the filtered signals or a combination of one or more of the signal frequencies.

Abstract: A radiofrequency identification tag has a semiconductor chip with radio frequency circuit, logic, memory circuits, and further includes an antenna that is mounted on a substrate. The antenna may be used by the chip to modulate an incident RF signal to transfer information to a base station. The antenna comprises one or more lengths of thin wire that are connected directly to the chip by means of wire bonding. The chip and antenna combination can be sealed with an organic film covering.

Abstract: An optical assembly structure wherein miniature optical components such as lasers, modulators, lenses, thin-film and fiber-optic waveguides, and photodetectors are critically aligned and supported for coactive operation by means of two or more wafers which are formed with complementary grooves and mortises to support the loose optical components such as lenses and fiber-optic waveguides and to receive alignment rails to insure the relativity of the wafers, which also have formed integral therewith optical elements such as waveguides, modulators, and lasers, to produce an integrated optical assembly somewhat in the manner of an "optical bench," wherein the bench structure also provides an active optical element.