Patents by Inventor Michael Melzl
Michael Melzl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10648096Abstract: An electrolyte may be provided. The electrolyte may include at least one additive configured to decompose or evaporate at a temperature above approximately 100° C., and a water soluble metal salt, and the electrolyte may be free from carbon nanotubes. In various embodiments, a method of forming a metal layer may be provided: The method may include depositing a metal layer on a carrier using an electrolyte, wherein the electrolyte may include at least one additive configured to decompose or evaporate at a temperature above approximately 100° C. and a water soluble metal salt, wherein the electrolyte is free from carbon nanotubes; and annealing the metal layer to form a metal layer comprising a plurality of pores. In various embodiments, a semiconductor device may be provided.Type: GrantFiled: November 23, 2015Date of Patent: May 12, 2020Assignee: INFINEON TECHNOLOGIES AGInventors: Werner Robl, Michael Melzl, Manfred Schneegans, Bernhard Weidgans, Franziska Haering
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Publication number: 20160168739Abstract: An electrolyte may be provided. The electrolyte may include at least one additive configured to decompose or evaporate at a temperature above approximately 100° C., and a water soluble metal salt, and the electrolyte may be free from carbon nanotubes. In various embodiments, a method of forming a metal layer may be provided: The method may include depositing a metal layer on a carrier using an electrolyte, wherein the electrolyte may include at least one additive configured to decompose or evaporate at a temperature above approximately 100° C. and a water soluble metal salt, wherein the electrolyte is free from carbon nanotubes; and annealing the metal layer to form a metal layer comprising a plurality of pores. In various embodiments, a semiconductor device may be provided.Type: ApplicationFiled: November 23, 2015Publication date: June 16, 2016Inventors: Werner ROBL, Michael MELZL, Manfred SCHNEEGANS, Bernhard WEIDGANS, Franziska HAERING
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Patent number: 8759230Abstract: The invention relates to an arrangement of electronic semiconductor components on a carrier system for treating the semiconductor components with a liquid medium. A semiconductor component is detachably mounted on the carrier system with the active side thereof in such a way that the arrangement comprises a gap at least in the edge region and partially between the semiconductor components and the carrier system. The aim of the invention is to provide a detachable arrangement of electronic semiconductor components on a mechanically stable carrier system for safely handling the semiconductor components during the production process, wherein the capillarity of the gap between the semiconductor components and the carrier system is reduced in a controlled manner, thus preventing the damaging effect of a liquid medium seeping into the gap. To this end, the surface of the carrier system is shaped in such a way that the gap is widened along the entire edge region thereof.Type: GrantFiled: December 9, 2008Date of Patent: June 24, 2014Assignee: Infineon Technologies AGInventors: Stephan Bradl, Michael Melzl, Josef Schwaiger, Thilo Stache
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Patent number: 8669666Abstract: An integrated circuit includes a substrate. A surface region of the substrate includes a contact pad region. A passivation layer stack includes at least one passivation layer. The passivation layer stack is formed over the surface region and adjacent to the contact pad region. An upper portion of the passivation layer stack is removed in, in a portion of the passivation layer stack proximate the contact pad region.Type: GrantFiled: October 19, 2010Date of Patent: March 11, 2014Assignee: Infineon Technologies AGInventors: Markus Hammer, Guenther Ruhl, Andreas Strasser, Michael Melzl, Reinhard Goellner, Doerthe Groteloh
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Patent number: 8357588Abstract: A workpiece machining method includes attaching a workpiece to a workpiece support with the aid of joining means. The workpiece and the workpiece support are joined to one another by an annular joining means. The composite produced is machined. The machined workpiece is separated from the workpiece support.Type: GrantFiled: February 22, 2011Date of Patent: January 22, 2013Assignee: Infineon Technologies AGInventors: Stephen Bradl, Walther Grommes, Werner Kröninger, Michael Melzl, Josef Schwaiger, Thilo Stache
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Publication number: 20110232074Abstract: A workpiece machining method includes attaching a workpiece to a workpiece support with the aid of joining means. The workpiece and the workpiece support are joined to one another by an annular joining means. The composite produced is machined. The machined workpiece is separated from the workpiece support.Type: ApplicationFiled: February 22, 2011Publication date: September 29, 2011Inventors: Stephen Bradl, Walther Grommes, Werner Kröninger, Michael Melzl, Josef Schwaiger, Thilo Stache
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Patent number: 7892947Abstract: A workpiece machining method includes attaching a workpiece to a workpiece support with the aid of joining means. The workpiece and the workpiece support are joined to one another by an annular joining means. The composite produced is machined. The machined workpiece is separated from the workpiece support.Type: GrantFiled: October 13, 2006Date of Patent: February 22, 2011Assignee: Infineon Technologies AGInventors: Stephen Bradl, Walther Grommes, Werner Kröninger, Michael Melzl, Josef Schwaiger, Thilo Stache
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Publication number: 20110031625Abstract: An integrated circuit includes a substrate. A surface region of the substrate includes a contact pad region. A passivation layer stack includes at least one passivation layer. The passivation layer stack is formed over the surface region and adjacent to the contact pad region. An upper portion of the passivation layer stack is removed in, in a portion of the passivation layer stack proximate the contact pad region.Type: ApplicationFiled: October 19, 2010Publication date: February 10, 2011Inventors: Markus Hammer, Guenther Ruhl, Andreas Strasser, Michael Melzl, Reinhard Goellner, Doerthe Groteloh
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Patent number: 7851913Abstract: A semiconductor device exhibits a first metal layer, made of a first metal, with at least one contiguous subsection. At least one second metal layer, made of a second metal, is placed on the contiguous subsection of the first metal layer. The second metal is harder than the first metal. The second metal layer is structured to form at least two layer regions, which are disposed on the contiguous subsection of the first metal layer. The second metal exhibits a boron-containing or phosphorus-containing metal or a boron-containing or phosphorus-containing metal alloy.Type: GrantFiled: November 20, 2006Date of Patent: December 14, 2010Assignee: Infineon Technologies AGInventors: Thomas Gutt, Dirk Siepe, Thomas Laska, Michael Melzl, Matthias Stecher, Roman Roth
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Patent number: 7829450Abstract: In a method of processing a contact pad, a passivation layer stack including at least one passivation layer is formed on at least an upper surface of a contact pad region. A first portion of the passivation layer stack is removed from above the contact pad region, wherein a second portion of the passivation layer remains on the contact pad region and covers the contact pad region. An adhesion layer is formed on the passivation layer stack. The adhesion layer is patterned, wherein the adhesion layer is removed from above the contact pad region. Furthermore, the second portion of the passivation layer stack is removed.Type: GrantFiled: November 7, 2007Date of Patent: November 9, 2010Assignee: Infineon Technologies AGInventors: Markus Hammer, Guenther Ruhl, Andreas Strasser, Michael Melzl, Reinhard Goellner, Doerthe Groteloh
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Patent number: 7566378Abstract: The invention relates to an arrangement of electronic semiconductor components on a carrier system for treating the semiconductor components with a liquid medium. A semiconductor component is detachably mounted on the carrier system with the active side thereof in such a way that the arrangement comprises a gap at least in the edge region and partially between the semiconductor components and the carrier system. The aim of the invention is to provide a detachable arrangement of electronic semiconductor components on a mechanically stable carrier system for safely handling the semiconductor components during the production process, wherein the capillarity of the gap between the semiconductor components and the carrier system is reduced in a controlled manner, thus preventing the damaging effect of a liquid medium seeping into the gap. To this end, the surface of the carrier system is shaped in such a way that the gap is widened along the entire edge region thereof.Type: GrantFiled: May 23, 2006Date of Patent: July 28, 2009Assignee: Infineon Technologies AGInventors: Stephan Bradl, Michael Melzl, Josef Schwaiger, Thilo Stache
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Publication number: 20090115074Abstract: In a method of processing a contact pad, a passivation layer stack including at least one passivation layer is formed on at least an upper surface of a contact pad region. A first portion of the passivation layer stack is removed from above the contact pad region, wherein a second portion of the passivation layer remains on the contact pad region and covers the contact pad region. An adhesion layer is formed on the passivation layer stack. The adhesion layer is patterned, wherein the adhesion layer is removed from above the contact pad region. Furthermore, the second portion of the passivation layer stack is removed.Type: ApplicationFiled: November 7, 2007Publication date: May 7, 2009Inventors: Markus Hammer, Guenther Ruhl, Andreas Strasser, Michael Melzl, Reinhard Goellner, Doerthe Groteloh
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Publication number: 20090093127Abstract: The invention relates to an arrangement of electronic semiconductor components on a carrier system for treating the semiconductor components with a liquid medium. A semiconductor component is detachably mounted on the carrier system with the active side thereof in such a way that the arrangement comprises a gap at least in the edge region and partially between the semiconductor components and the carrier system. The aim of the invention is to provide a detachable arrangement of electronic semiconductor components on a mechanically stable carrier system for safely handling the semiconductor components during the production process, wherein the capillarity of the gap between the semiconductor components and the carrier system is reduced in a controlled manner, thus preventing the damaging effect of a liquid medium seeping into the gap. To this end, the surface of the carrier system is shaped in such a way that the gap is widened along the entire edge region thereof.Type: ApplicationFiled: December 9, 2008Publication date: April 9, 2009Inventors: Stephan Bradl, Michael Melzl, Josef Schwaiger, Thilo Stache
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Publication number: 20080122091Abstract: A semiconductor device exhibits a first metal layer, made of a first metal, with at least one contiguous subsection. At least one second metal layer, made of a second metal, is placed on the contiguous subsection of the first metal layer. The second metal is harder than the first metal. The second metal layer is structured to form at least two layer regions, which are disposed on the contiguous subsection of the first metal layer. The second metal exhibits a boron-containing or phosphorus-containing metal or a boron-containing or phosphorus-containing metal alloy.Type: ApplicationFiled: November 20, 2006Publication date: May 29, 2008Inventors: Thomas Gutt, Drik Siepe, Thomas Laska, Michael Melzl, Matthias Stecher, Roman Roth
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Publication number: 20070117351Abstract: A workpiece machining method includes attaching a workpiece to a workpiece support with the aid of joining means. The workpiece and the workpiece support are joined to one another by an annular joining means. The composite produced is machined. The machined workpiece is separated from the workpiece support.Type: ApplicationFiled: October 13, 2006Publication date: May 24, 2007Inventors: Stephan Bradl, Walther Grommes, Werner Kroninger, Michael Melzl, Josef Schwaiger, Thilo Stache
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Publication number: 20060276010Abstract: The invention relates to an arrangement of electronic semiconductor components on a carrier system for treating the semiconductor components with a liquid medium. A semiconductor component is detachably mounted on the carrier system with the active side thereof in such a way that the arrangement comprises a gap at least in the edge region and partially between the semiconductor components and the carrier system. The aim of the invention is to provide a detachable arrangement of electronic semiconductor components on a mechanically stable carrier system for safely handling the semiconductor components during the production process, wherein the capillarity of the gap between the semiconductor components and the carrier system is reduced in a controlled manner, thus preventing the damaging effect of a liquid medium seeping into the gap. To this end, the surface of the carrier system is shaped in such a way that the gap is widened along the entire edge region thereof.Type: ApplicationFiled: May 23, 2006Publication date: December 7, 2006Inventors: Stephan Bradl, Michael Melzl, Josef Schwaiger, Thilo Stache
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Patent number: 6714392Abstract: An electronic component is described and has a dielectric layer which is constructed on a substrate, conductive surfaces that are constructed on the dielectric layer, and an electrically conductive guard structure. The guard structure is disposed in a plane above the conductive surfaces such that the conductive surfaces are not completely covered by the guard structure.Type: GrantFiled: July 16, 2001Date of Patent: March 30, 2004Assignee: Infineon Technologies AGInventors: Heinz Opolka, Paul-Werner Von Basse, Thomas Scheiter, Rainer Grossmann, Christian Peters, Reinhard Fischbach, Andreas Gaymann, Thomas Rosteck, Domagoj Siprak, Thorsten Sasse, Reinhard Göllner, Justin Bierner, Michael Melzl, Klaus Hammer, Markus Witte
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Publication number: 20020066942Abstract: An electronic component is described and has a dielectric layer which is constructed on a substrate, conductive surfaces that are constructed on the dielectric layer, and an electrically conductive guard structure. The guard structure is disposed in a plane above the conductive surfaces such that the conductive surfaces are not completely covered by the guard structure.Type: ApplicationFiled: July 16, 2001Publication date: June 6, 2002Inventors: Heinz Opolka, Paul-Werner Von Basse, Thomas Scheiter, Rainer Grossmann, Christian Peters, Reinhard Fischbach, Andreas Gaymann, Thomas Rosteck, Domagoj Siprak, Thorsten Sasse, Reinhard Gollner, Justin Bierner, Michael Melzl, Klaus Hammer, Markus Witte
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Publication number: 20010000160Abstract: A gas pipe system for a process reactor is described, which may be, for example, a vertical oven for depositing an As-doped SiO2 layer onto wafers. The gas pipe system has a TEAS bubbler which is connected on the input side to a carrier gas source and, on the output side, is connected via at least one heated pipe to the process reactor. Furthermore, a TEOS evaporator is provided, which is connected on the input side to a gas source and, on the output side, is connected via at least one heated pipe to the process reactor. Furthermore, a vertical oven and a method for deposition of an As-doped SiO2 layer onto wafers are described, with the gas pipe system being used in each case.Type: ApplicationFiled: December 5, 2000Publication date: April 5, 2001Applicant: Infineon Technologies AGInventors: Josef Schwaiger, Gerhard Niederhofer, Gerhard Ott, Michael Melzl