Abstract: A media headset for exchanging data with a media device includes at least one audio speaker that provides an audio output, a data store that stores media device data, a communications interface for exchanging the media device data with the media device, and a connector for detachably connecting the communications interface to the media device.

Abstract: Handheld electronic devices are provided that contain wireless communications circuitry. The wireless communications circuitry may include an antenna. A radio-frequency coupler may be coupled to the antenna. Transceiver circuitry may be used to transmit and receive radio-frequency signals through the coupler and the antenna. A reflected power detection circuit may be connected to the coupler. When the transceiver circuitry transmits radio-frequency signals, some of the signals are reflected back from the antenna into the coupler. The coupler directs the reflected antenna signals into the reflected power detection circuit. Processing circuitry may analyze a reflected power signal from the reflected power detection circuit to determine whether operation of the antenna is being disrupted by the placement of a user's hand over the antenna or other proximity effects. If antenna operation is being disrupted, the user may be alerted or other suitable actions may be taken.

Abstract: Some embodiments of the present invention provide a system which supports a dual-purpose aperture for an electronic device. This system includes a first component configured to perform an acoustic function through the aperture and a second component configured to perform a non-acoustic function through the aperture.

Abstract: Some embodiments of the present invention provide a system which supports a dual-purpose aperture for an electronic device. This system includes a first component configured to perform an acoustic function through the aperture and a second component configured to perform a non-acoustic function through the aperture.

Abstract: A process for assembling a rigid-flex printed circuit board (PCB) is presented. During operation, the process receives rigid-flex PCBs that are to be coupled together, wherein a rigid-flex PCB includes flexible PCBs coupled to rigid PCBs. The process then places the PCBs onto a carrier which is configured to: align the PCBs so that bond regions located on the flexible PCBs overlap with bond regions located on corresponding flexible PCBs, and apply pressure to the overlapped bond regions. The process then sends the carrier through a reflow oven which reflows solder on the PCBs so that the components become mechanically and electrically coupled to the PCBs. The temperature profile generated by the reflow oven and the pressure applied by the carrier cures and sets an anisotropic conductive film located in the bond regions so that the overlapped flexible PCBs become mechanically and electrically coupled together.

Abstract: Some embodiments of the present invention provide a system which supports a dual-purpose aperture for an electronic device. This system includes a first component configured to perform an acoustic function through the aperture and a second component configured to perform a non-acoustic function through the aperture.

Abstract: Some embodiments of the present invention provide a system which supports a dual-purpose aperture for an electronic device. This system includes a first component configured to perform an acoustic function through the aperture and a second component configured to perform a non-acoustic function through the aperture.

Abstract: Some embodiments of the present invention provide a system which supports a dual-purpose aperture for an electronic device. This system includes a first component configured to perform an acoustic function through the aperture and a second component configured to perform a non-acoustic function through the aperture.

Abstract: A process for assembling a rigid-flex printed circuit board (PCB) is presented. During operation, the process receives rigid-flex PCBs that are to be coupled together, wherein a rigid-flex PCB includes flexible PCBs coupled to rigid PCBs. The process then places the PCBs onto a carrier which is configured to: align the PCBs so that bond regions located on the flexible PCBs overlap with bond regions located on corresponding flexible PCBs, and apply pressure to the overlapped bond regions. The process then sends the carrier through a reflow oven which reflows solder on the PCBs so that the components become mechanically and electrically coupled to the PCBs. The temperature profile generated by the reflow oven and the pressure applied by the carrier cures and sets an anisotropic conductive film located in the bond regions so that the overlapped flexible PCBs become mechanically and electrically coupled together.

Abstract: A process for assembling a rigid-flex printed circuit board (PCB) is presented. During operation, the process receives rigid-flex PCBs that are to be coupled together, wherein a rigid-flex PCB includes flexible PCBs coupled to rigid PCBs. The process then places the PCBs onto a carrier which is configured to: align the PCBs so that bond regions located on the flexible PCBs overlap with bond regions located on corresponding flexible PCBs, and apply pressure to the overlapped bond regions. The process then sends the carrier through a reflow oven which reflows solder on the PCBs so that the components become mechanically and electrically coupled to the PCBs. The temperature profile generated by the reflow oven and the pressure applied by the carrier cures and sets an anisotropic conductive film located in the bond regions so that the overlapped flexible PCBs become mechanically and electrically coupled together.

Abstract: A process for assembling a rigid-flex printed circuit board (PCB) is presented. During operation, the process receives rigid-flex PCBs that are to be coupled together, wherein a rigid-flex PCB includes flexible PCBs coupled to rigid PCBs. The process then places the PCBs onto a carrier which is configured to: align the PCBs so that bond regions located on the flexible PCBs overlap with bond regions located on corresponding flexible PCBs, and apply pressure to the overlapped bond regions. The process then sends the carrier through a reflow oven which reflows solder on the PCBs so that the components become mechanically and electrically coupled to the PCBs. The temperature profile generated by the reflow oven and the pressure applied by the carrier cures and sets an anisotropic conductive film located in the bond regions so that the overlapped flexible PCBs become mechanically and electrically coupled together.

Abstract: Some embodiments of the present invention provide a system which supports a dual-purpose aperture for an electronic device. This system includes a first component configured to perform an acoustic function through the aperture and a second component configured to perform a non-acoustic function through the aperture.

Abstract: A media headset for exchanging data with a media device includes at least one audio speaker that provides an audio output, a data store that stores media device data, a communications interface for exchanging the media device data with the media device, and a connector for detachably connecting the communications interface to the media device.

Abstract: Handheld electronic devices are provided that contain wireless communications circuitry. The wireless communications circuitry may include an antenna. A radio-frequency coupler may be coupled to the antenna. Transceiver circuitry may be used to transmit and receive radio-frequency signals through the coupler and the antenna. A reflected power detection circuit may be connected to the coupler. When the transceiver circuitry transmits radio-frequency signals, some of the signals are reflected back from the antenna into the coupler. The coupler directs the reflected antenna signals into the reflected power detection circuit. Processing circuitry may analyze a reflected power signal from the reflected power detection circuit to determine whether operation of the antenna is being disrupted by the placement of a user's hand over the antenna or other proximity effects. If antenna operation is being disrupted, the user may be alerted or other suitable actions may be taken.

Abstract: Solar cells are integrated into a portable device. Multiple cells are arranged on the surface of the device such that a number of solar cells may always be functional and produce a desired voltage even if the rest is obstructed. Information regarding solar cells' functions or performances can be displayed either on the device's main display or on top of the solar cells. Solar cells are typically stacked with other layers made of transparent or semi-transparent materials. These layers are glued with shock absorbent materials. Some of these layers may be used for display or input purposes, and some layers may be coated with various materials or they may be etched with product logos or other patterns. This stack of layers may be attached to the device's frame through a shock absorber.