Abstract: A method of forming an acoustic transducer comprises providing a substrate and depositing a first structural layer on the substrate. The first structural layer is selectively etched to form at least one of an enclosed trench or an enclosed pillar thereon. A second structural layer is deposited on the first structural layer and includes a depression or a bump corresponding to the enclosed trench or pillar, respectively. At least the second structural layer is heated to a temperature above a glass transition temperature of the second structural layer causing the second structural layer to reflow. A diaphragm layer is deposited on the second structural layer such that the diaphragm layer includes at least one of a downward facing corrugation corresponding to the depression or an upward facing corrugation corresponding to the bump. The diaphragm layer is released, thereby forming a diaphragm suspended over the substrate.

Abstract: A microelectromechanical systems (MEMS) die comprises a first diaphragm having a first side and a second side, and a second diaphragm having a first side facing the first side of the first diaphragm. A first plurality of interconnect strips is disposed along at least the first side of the first diaphragm, a second plurality of interconnect strips is disposed along the first side of the first diaphragm, and a third plurality of interconnect strips is disposed along the first side of the second diaphragm. First, second, and third runner strips are disposed along the second side of the first diaphragm transverse to the first, second, and third plurality of interconnect strips, respectively. Each of the first, second, and third runner strips is electrically connected to at least a subset of the first, second, and third plurality of interconnect strips, respectively, via electrical connections disposed through the first diaphragm.

Abstract: A MEMS diaphragm assembly comprises a first diaphragm, a second diaphragm, and a stationary electrode assembly spaced between the first and second diaphragms and including a plurality of apertures disposed therethrough. Each of a plurality of pillars is disposed through one of the plurality of apertures and connects the first and second diaphragms. At least one of the first and second diaphragms is connected to the stationary electrode assembly at a geometric center of the assembly.

Abstract: A microelectromechanical systems (MEMS) device comprises a MEMS die that comprises first and second diaphragms, a first plurality of electrodes each disposed on the first diaphragm, and a second plurality of electrodes each disposed on the second diaphragm. A fixed dielectric element is disposed between the first and second diaphragms and includes a plurality of apertures. The MEMS die further comprises a third plurality of electrodes, wherein each of the third plurality comprises a first conductive layer disposed on the first diaphragm proximate to at least one of the first plurality and a second conductive layer disposed on the second diaphragm proximate to at least one of the second plurality, and a conductive pin that extends through an aperture of the plurality of apertures and electrically connects the first conductive layer to the second conductive layer.

Abstract: A support system for hanging of a cabinet door is provided having support arm and a main body with a top member and a front member. The upper end of the front member is operably connected to the forward end of the top member. The front member has lock features located at a plurality of positions between the upper end and the lower end on a front surface. The support arm has an elongated shape extending between a connection end and a support end. The support arm has lock features configured to engage and lock with lock features of the front member. The support end of the support arm having a platform configured to support the cabinet door during installation onto a cabinet. The support arm is movable between the plurality of positions to facilitate adjustment of a height at which the cabinet door is supported.

Abstract: A MEMS device can include a solid dielectric including a plurality of apertures, the solid dielectric having a first side and a second side. The MEMS device can include a first plurality of electrodes extending completely through a first subset of the plurality of apertures, a second plurality of electrodes extending partially through a second subset of the plurality of apertures, a third plurality of electrodes extending partially into a third subset of the plurality of apertures. The MEMS device can include a first diaphragm coupled to the first plurality and to the third plurality of electrodes, the first diaphragm facing the first side of the solid dielectric. The MEMS device can include a second diaphragm coupled to the first plurality and to the second plurality of electrodes the second diaphragm facing the second side of the solid dielectric.

Abstract: A capacitive sensor assembly includes a capacitive transduction element and an electrical circuit disposed in the housing and electrically coupled to contacts on an external-device interface of the housing. The electrical circuit includes a sampling circuit having an operational sampling phase during which a voltage produced by the capacitive sensor is sampled by a sampling capacitor coupled to a comparator and an operational charging phase during which a second capacitor is charged by a charge and discharge circuit until the output of the comparator changes state, wherein the output of the sampling circuit is a pulse width modulated signal representative of the voltage on the input of the sampling circuit during each sample period. The output of the sampling circuit can be coupled to a delta-sigma analog-to-digital (A/D) converter.

Abstract: A vibration sensor/accelerometer includes, in various implementations, a MEMS die that includes a plate having an aperture, an anchor disposed within the aperture, a plurality of arms (e.g., rigid arms) extending from the anchor, and a plurality of resilient members (e.g., looped or folded springs with a carefully designed spring stiffness), each resilient member connecting the plate to an arm of the plurality of arms. The plate may be made from a solid layer in which the resilient members are etched from the same layer. The MEMS die may also include top and bottom wafers, and travel stoppers extending from the top and bottom wafers as well as through the plate.

Abstract: A microphone assembly includes a substrate, an acoustic transducer, an integrated circuit, and a cover couples to the substrate to enclose a back volume of the microphone assembly in which the acoustic transducer and the integrated circuit are disposed. The acoustic transducer includes a back plate and a diaphragm oriented parallel to the back plate disposed over an aperture in the substrate to receive acoustic signals. The cover is a metallic material with a thickness and a corresponding thermal diffusivity to attenuate incoming radio-frequency signals. The attenuation of the radio-frequency signals prevents ambient noise detectable by the microphone assembly.

Abstract: A MEMS device can include a solid dielectric including a plurality of apertures, the solid dielectric having a first side and a second side. The MEMS device can include a first plurality of electrodes extending completely through a first subset of the plurality of apertures, a second plurality of electrodes extending partially through a second subset of the plurality of apertures, a third plurality of electrodes extending partially into a third subset of the plurality of apertures. The MEMS device can include a first diaphragm coupled to the first plurality and to the third plurality of electrodes, the first diaphragm facing the first side of the solid dielectric. The MEMS device can include a second diaphragm coupled to the first plurality and to the second plurality of electrodes the second diaphragm facing the second side of the solid dielectric.

Abstract: A method and system for generating and maintaining an immutable electronic ledger. The method comprises receiving, accessing, and/or modifying one or more decision-influencing factors relating to a commodity and/or a product. The method comprises autonomously storing the one or more decision-influencing factors as a part of the immutable electronic ledger in response to said receiving, accessing, and/or modifying. The immutable electronic ledger serves as a record of decision-influencing factors, that is free of hindsight, for a business entity in an evaluation of a decision associated with the commodity and/or product and influenced by the one or more decision-influencing factors.

Abstract: A MEMS diaphragm assembly comprises a first diaphragm, a second diaphragm, and a stationary electrode assembly spaced between the first and second diaphragms and including a plurality of apertures disposed therethrough. Each of a plurality of pillars is disposed through one of the plurality of apertures and connects the first and second diaphragms. At least one of the first and second diaphragms is connected to the stationary electrode assembly at a geometric center of the assembly.

Abstract: Various implementations of MEMS sensors include an IC die having a cavity that forms at least part of the back volume of the sensor. This arrangement helps to address the problems of lateral velocity gradients and viscosity-induced losses. In some of the embodiments, the cavity is specially configured (e.g., with pillars, channels, and/or rings) to reduce the lateral movement of air. Other solutions (used in conjunction with such cavities) include ways to make a diaphragm move more like a piston (e.g., by adding a protrusion that gives it more “up-down” motion and less lateral motion) or to use a piston (e.g.

Abstract: An acoustic transducer for generating electrical signals in response to acoustic signals, comprises a first diaphragm having a first corrugation formed therein. A second diaphragm has a second corrugation formed therein, and is spaced apart from the first diaphragm such that a cavity having a pressure lower than atmospheric pressure is formed therebetween. A back plate is disposed between the first diaphragm and the second diaphragm. One or more posts extend from at least one of the first diaphragm or the second diaphragm towards the other through the back plate. The one or more posts prevent each of the first diaphragm and the second diaphragm from contacting the back plate due to movement of the first diaphragm and/or the second diaphragm towards the back plate. Each of the first corrugation and the second corrugation protrude outwardly from the first diaphragm and the second diaphragm, respectively, away from the back plate.

Abstract: A MEMS device can include a substrate having a first side and a second side, the substrate including an aperture extending from the first side through the substrate to the second side. The device can include a support structure coupled to the substrate the first side. The device can include a resilient structure coupled to the support structure. The device can include a rigid movable plate coupled to the support structure via the resilient structure and positioned over the aperture. The device can include a proof mass coupled to the movable plate, the proof mass extending into the aperture. The device can include an electrode located on an opposite side of the movable plate from the proof mass.

Abstract: A diffuser having a plurality of atomizers associated with a single pump is provided. The diffuser may include four or more atomizers that may be removably coupled to the diffuser. Each atomizer may store the same or different oils. In some embodiments, the outlet of the atomizer may have a tortuous passageway to prevent diffusion of large oil droplets. The diffuser includes a plurality of valves associated with the plurality of atomizers, such that the valves may be selectively actuated to permit flow to the selected atomizers.

Abstract: A microphone assembly can include a microelectromechanical systems (MEMS) transducer comprising a transducer substrate, a diaphragm oriented substantially parallel to the transducer substrate and spaced apart from the transducer substrate to form a gap, and a counter electrode coupled to the transducer substrate, the counter electrode positioned between the diaphragm and the transducer substrate. The MEMS transducer can generate a signal representative of a change in capacitance between the counter electrode and the diaphragm. A back volume of the MEMS transducer can be an enclosed volume positioned between the transducer substrate and the diaphragm. The microphone assembly can include an integrated circuit that receives the signal, wherein every point within the back volume is less than a thermal boundary layer thickness from a nearest solid surface at an upper limit of an audio frequency band that the integrated circuit is monitoring.

Abstract: A MEMS device can include a first support layer, a second support layer, and a solid dielectric suspended between the first support layer and the second support layer. The solid dielectric can move relative to the first support layer and the second support layer and can include a plurality of apertures. The MEMS device can include a first plurality of electrodes coupled to the first support layer and the second support layer and extending through a first subset of the plurality of apertures. The MEMS device can include a second plurality of electrodes coupled to the first support layer and extending partially into a second subset of the plurality of apertures. The MEMS device can include a third plurality of electrodes coupled to the second support layer and extending partially into a third subset of the plurality of apertures.

Abstract: A first electrode of a MEMS device can be oriented lengthwise along and parallel to an axis, and can have a first end and a second end. A second electrode can be oriented lengthwise along and parallel to the axis and can have a first end and a second end. A third electrode can be oriented lengthwise along and parallel to the axis and can have a first end and a second end. The first, second, and third electrodes can each be located at least partially within an aperture of a plurality of apertures of a solid dielectric that can surround the second electrode second end and the third electrode first end. The second electrode first end and the third electrode second end can be located outside of the solid dielectric.

Abstract: The disclosure describes devices and methods of providing a DC bias voltage in a microphone assembly. Particularly, one implementation of such a device may be implemented on an integrated circuit that includes a direct current (DC) bias circuit. The DC bias circuit may be coupled to a transducer and configured to supply a DC bias signal to the transducer. The DC bias circuit includes a multi-stage charge pump and a low pass filter (LUFF) circuit. The multi-stage charge pump includes transistors that are fabricated with deep trench isolation (DTI).