Abstract: A printed circuit board includes a substrate and at least one electrical circuit provided at least partially on a surface layer of thee printed circuit board. The electrical circuit includes an electrical trace that is in electrical connection with a test pad provided for accessibility on the surface layer, the test pad being sized and shaped for probing to test an aspect of the circuit, the test pad having a conductive probe surface that is structured to provide at least one vertical surface that extends from the probe surface toward the surface layer and thus providing an edge between the vertical surface and the probe surface, the probe surface having a coating of a material to protect the conductive probe surface from corrosion.

Abstract: A printed circuit board includes a substrate and at least one electrical circuit provided at least partially on a surface layer of the printed circuit board. The electrical circuit includes an electrical trace that is in electrical connection with a test pad provided for accessibility on the surface layer, the test pad being sized and shaped for probing to test an aspect of the circuit, the test pad having a conductive probe surface that is structured to provide at least one vertical surface that extends from the probe surface toward the surface layer and thus providing an edge between the vertical surface and the probe surface, the probe surface having a coating of a material to protect the conductive probe surface from corrosion.

Abstract: A printed circuit board includes a substrate and at least one electrical circuit provided at least partially on a surface layer of the printed circuit board. The electrical circuit includes an electrical trace that is in electrical connection with a test pad provided for accessibility on the surface layer, the test pad being sized and shaped for probing to test an aspect of the circuit, the test pad having a conductive probe surface that is structured to provide at least one vertical surface that extends from the probe surface toward the surface layer and thus providing an edge between the vertical surface and the probe surface, the probe surface having a coating of a material to protect the conductive probe surface from corrosion.

Abstract: Method and apparatus for constructing and operating a printed circuit board assembly (PCBA). In some embodiments, a plurality of electronic components are attached to a first side of a substrate that has at least one electrical lead that connects the electrical components is present on an opposite second side of the substrate. A primary film is adhered to the second side of the substrate to create an air tight seal around each electrical lead. A secondary film is then adhered to the primary film and provides a cantilevered lift tab that extends outside the bounds of the primary film. The secondary film has a lower bond strength than the primary film.

Abstract: A microelectronic device includes a die having an active surface and a non-active surface. To assemble the microelectronic device, the active surface of the die is placed on a substrate. A first material is dispensed between the active surface of the die and the substrate. A second material is dispensed on at least a portion of the non-active surface of the die. The second material is different than the first material and the first material and the second material are simultaneously cured.

Abstract: A microelectronic device includes a die having an active surface and a non-active surface. To assemble the microelectronic device, the active surface of the die is placed on a substrate. A first material is dispensed between the active surface of the die and the substrate. A second material is dispensed on at least a portion of the non-active surface of the die. The second material is different than the first material and the first material and the second material are simultaneously cured.