Patents by Inventor Michael Shane Thompson

Michael Shane Thompson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and systems for reducing adhesive strength and associated pull-off stresses
    Patent number: 12215253
    Abstract: Methods and systems for adhesively bonding a first substrate to a second substrate to reduce pull-off stress during separation of the first and second substrates include applying a first adhesive to a first bonding region of a bonding area of the first substrate, applying a second adhesive, which has an adhesive strength that is lower than an adhesive strength of the first adhesive, to a second bonding region of the bonding area of the first substrate, pressing the first and second substrates against each other to form an adhesive bondline, and curing the first and second adhesives for a predetermined period of time to form a cured adhesive bondline between the first and second substrates.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: February 4, 2025
    Assignee: LORD Corporation
    Inventors: Timothy Fornes, Anurodh Tripathi, Michael Shane Thompson
  • METHODS AND SYSTEMS FOR REDUCING ADHESIVE STRENGTH AND ASSOCIATED PULL-OFF STRESSES
    Publication number: 20220315803
    Abstract: Methods and systems for adhesively bonding a first substrate to a second substrate to reduce pull-off stress during separation of the first and second substrates include applying a first adhesive to a first bonding region of a bonding area of the first substrate, applying a second adhesive, which has an adhesive strength that is lower than an adhesive strength of the first adhesive, to a second bonding region of the bonding area of the first substrate, pressing the first and second substrates against each other to form an adhesive bondline, and curing the first and second adhesives for a predetermined period of time to form a cured adhesive bondline between the first and second substrates.
    Type: Application
    Filed: July 31, 2020
    Publication date: October 6, 2022
    Inventors: Timothy Fornes, Anurodh Tripathi, Michael Shane Thompson