Patents by Inventor Michiaki Sugiyama
Michiaki Sugiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20080272197Abstract: An antenna connection function for a noncontact interface is provided by suppressing a modification in a pin arrangement and a pin shape of a memory card that does not correspond to the noncontact interface. Two antenna connecting pins having the memory card are divided into two areas in which a size of one potential supply pin is the largest and used as a split pin arranged at intervals. Because a size of the two antenna connecting pins is at maximum as large as the size of the potential supply pin, the two antenna connecting pins are provided and the memory card that corresponds to the noncontact interface is obtained by devoting a pin area having the size of the one potential supply pin to the memory card that does not correspond to the noncontact interface. Accordingly, the pin area of the memory card that corresponds to the noncontact interface can be formed without departing from the pin area of the memory card that does not correspond to the noncontact interface.Type: ApplicationFiled: December 16, 2007Publication date: November 6, 2008Inventors: Hirotaka NISHIZAWA, Akira Higuchi, Kenji Osawa, Junichiro Osako, Tamaki Wada, Michiaki Sugiyama
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Publication number: 20080257967Abstract: To realize compatibility with an SIM card and adaptation to a high-speed memory access in an IC card module having a microcomputer and a memory card controller. An IC card module includes a plurality of first external connecting terminals and a plurality of second external connecting terminals both exposed to one surface of a card substrate, a microcomputer connected to the first external connecting terminals, a memory controller connected to the second external connecting terminals, and a volatile memory connected to the memory controller. The shape of the card substrate and the layout of the first external connecting terminals are based on a standard of plug-in UICC of ETSI TS 102 221 V4.4.0 (2001-10) or have compatibility. The second external connecting terminals are disposed outside the minimum range of the terminal layout based on the standard for the first external connecting terminals.Type: ApplicationFiled: October 18, 2007Publication date: October 23, 2008Inventors: Hirotaka Nishizawa, Takashi Totsuka, Kenji Osawa, Junichiro Osako, Tamaki Wada, Michiaki Sugiyama
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Publication number: 20080254574Abstract: By preparing a package substrate which has a plurality of lands of NSMD structure, and the output wiring and dummy wiring which were connected to each of the lands, and have been arranged mutually in the location of 180° symmetry, and printing solder by a printing method to the lands after the package assembly, the variation in the height of the solder coat between lands can be reduced, and improvement in the mountability of LGA (semiconductor device) is achieved.Type: ApplicationFiled: June 17, 2008Publication date: October 16, 2008Inventors: Takashi KIKUCHI, Koichi Kanemoto, Michiaki Sugiyama, Hiroshi Kawakukbo
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Publication number: 20080173995Abstract: There is a need to provide a large capacity memory card for a portable communication device. A memory card 1 includes: a wiring board 2 mainly composed of a glass epoxy resin; multiple semiconductor chips (3C and 3F) mounted on a main surface of the memory card 1; and a mold resin 4 for encapsulating the wiring board 2 and the semiconductor chips (3C and 3F). The mold resin 4 is made of a thermosetting epoxy resin containing quartz filler. A back surface of the wiring board 2 is not covered with the mold resin 4 and is exposed to a back surface of the memory card 1. The back surface of the wiring board 2 is used to form multiple external connection terminals 7 electrically connected to the semiconductor chips (3C and 3F) . When the memory card 1 is attached to a card slot of a mobile phone, the external connection terminals 7 contact with a connector terminal contained in the card slot. This makes it possible to exchange signals between the memory card 1 and the mobile phone or to supply the power.Type: ApplicationFiled: September 12, 2007Publication date: July 24, 2008Inventors: Bunshi Kuratomi, Fukumi Shimizu, Michiaki Sugiyama, Atsushi Fujishima, Tamaki Wada
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Patent number: 7399694Abstract: By preparing a package substrate which has a plurality of lands of NSMD structure, and the output wiring and dummy wiring which were connected to each of the lands, and have been arranged mutually in location of 180° symmetry, and printing solder by a printing method to the lands after the package assembly, the variation in the height of the solder coat between lands can be reduced, and improvement in the mountability of LGA (semiconductor device) is achieved.Type: GrantFiled: July 10, 2006Date of Patent: July 15, 2008Assignee: Renesas Technology Corp.Inventors: Takashi Kikuchi, Koichi Kanemoto, Michiaki Sugiyama, Hiroshi Kawakukbo
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Publication number: 20080153205Abstract: A semiconductor device comprising a first wiring board having a plurality of external connection terminals on one side, semiconductor chips mounted on the other side of the first wiring board and electrically connected to the first wiring board by a plurality of wires, a sealing resin for sealing the semiconductor chips and the wires, and a second wiring board having a plurality of contact points on one side and bonded to the top surface of the sealing resin on the other side, wherein the upper end portions of the loops of the plurality of wires for electrically connecting the first wiring board to the semiconductor chips are exposed from the top surface of the sealing resin and electrically connected to the second wiring board.Type: ApplicationFiled: February 26, 2008Publication date: June 26, 2008Inventors: Hirotaka NISHIZAWA, Tamaki Wada, Kenji Osawa, Junichiro Osako, Michiaki Sugiyama
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Patent number: 7352588Abstract: A semiconductor device comprising a first wiring board having a plurality of external connection terminals on one side, semiconductor chips mounted on the other side of the first wiring board and electrically connected to the first wiring board by a plurality of wires, a sealing resin for sealing the semiconductor chips and the wires, and a second wiring board having a plurality of contact points on one side and bonded to the top surface of the sealing resin on the other side, wherein the upper end portions of the loops of the plurality of wires for electrically connecting the first wiring board to the semiconductor chips are exposed from the top surface of the sealing resin and electrically connected to the second wiring board.Type: GrantFiled: March 10, 2006Date of Patent: April 1, 2008Assignee: Renesas Technology Corp.Inventors: Hirotaka Nishizawa, Tamaki Wada, Kenji Osawa, Junichiro Osako, Michiaki Sugiyama
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Publication number: 20080073436Abstract: The present invention provides a memory card equipped with an interface controller connected to external connecting terminals, a memory connected to the interface controller, and a security controller connected to the interface controller. A second external connecting terminal capable of supplying an operating power supply to the security controller is provided aside from a first external connecting terminal which supplies an operating power supply to the interface controller and the memory. An interface unit of the interface controller connected to the security controller receives the operating power supply from the second external connecting terminal and thereby enables a stop of the supply of the operating power supply from the first external connecting terminal. Even if the supply of the operating power supply to the interface controller is cut off, the output of the interface unit is not brought to an indefinite state.Type: ApplicationFiled: November 27, 2007Publication date: March 27, 2008Inventors: Hirotaka NISHIZAWA, Akira HIGUCHI, Kenji OSAWA, Tamaki WADA, Michiaki SUGIYAMA, Junichiro OSAKO
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Patent number: 7341198Abstract: An IC card 1CD includes a frame member portion 1CB1, and an IC card main body 15 held in a state of being hung by a connecting portion 1CB2 in a frame thereof. The IC card main body 15 is made to constitute a card type information medium having a high functional performance having both of a function as a so-to-speak IC card and a function as a so-to-speak memory card having a capacity larger than that of the IC card and a function higher than that of the IC card capable of executing a security processing. An outer shape of the IC card main body 15 is formed in compliance with RS-MMC outer shape standard. A surface of a cap portion 1CB3 of the IC card main body 15 is printed with a desired character, pattern, diagram and photograph or the like by a printing method used in steps of fabricating a general IC card, and the IC card 15 is provided with higher acknowledgement performance, security performance and outlook.Type: GrantFiled: February 20, 2004Date of Patent: March 11, 2008Assignee: Renesas Technology Corp.Inventors: Hirotaka Nishizawa, Junichiro Osako, Kenji Osawa, Tamaki Wada, Michiaki Sugiyama
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Patent number: 7325746Abstract: An antenna connection function for a noncontact interface is provided by suppressing a modification in a pin arrangement and a pin shape of a memory card that does not correspond to the noncontact interface. Two antenna connecting pins having the memory card are divided into two areas in which a size of one potential supply pin is the largest and used as a split pin arranged at intervals. Because a size of the two antenna connecting pins is at maximum as large as the size of the potential supply pin, the two antenna connecting pins are provided and the memory card that corresponds to the noncontact interface is obtained by devoting a pin area having the size of the one potential supply pin to the memory card that does not correspond to the noncontact interface.Type: GrantFiled: October 12, 2004Date of Patent: February 5, 2008Assignee: Renesas Technology Corp.Inventors: Hirotaka Nishizawa, Akira Higuchi, Kenji Osawa, Junichiro Osako, Tamaki Wada, Michiaki Sugiyama
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Publication number: 20080025003Abstract: This invention is to provide an ultra-miniaturized, thin-sized memory card provided with a mechanism for preventing a wrong insertion to a memory card slot. A multi-function memory card is composed of a card body and a cap for housing the card body. The card body is made of mold resin that encapsulates plural semiconductor chips mounted on a main surface of a wiring substrate. The card body is housed into the cap with the back face of the wiring substrate facing outward. Guide channels are provided at both side faces of the cap for preventing that the card is inserted upside down. Further, a convex section is provided at the trailing edge of the cap for preventing that the card is inserted in the wrong direction.Type: ApplicationFiled: September 28, 2007Publication date: January 31, 2008Inventors: Hirotaka Nishizawa, Kenji Osawa, Junichiro Osako, Tamaki Wada, Michiaki Sugiyama, Takashi Totsuka
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Patent number: 7308588Abstract: The present invention provides a memory card equipped with an interface controller connected to external connecting terminals, a memory connected to the interface controller, and a security controller connected to the interface controller. A second external connecting terminal capable of supplying an operating power supply to the security controller is provided aside from a first external connecting terminal which supplies an operating power supply to the interface controller and the memory. An interface unit of the interface controller connected to the security controller receives the operating power supply from the second external connecting terminal and thereby enables a stop of the supply of the operating power supply from the first external connecting terminal. Even if the supply of the operating power supply to the interface controller is cut off, the output of the interface unit is not brought to an indefinite state.Type: GrantFiled: August 6, 2004Date of Patent: December 11, 2007Assignee: Renesas Technology Corp.Inventors: Hirotaka Nishizawa, Akira Higuchi, Kenji Osawa, Tamaki Wada, Michiaki Sugiyama, Junichiro Osako
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Patent number: 7296754Abstract: An IC card module includes first external connecting terminals and second external connecting terminals both exposed to one surface of a card substrate, a microcomputer connected to the first external connecting terminals, a memory controller connected to the second external connecting terminals, and a volatile memory connected to the memory controller. The shape of the card substrate and the layout of the first external connecting terminals are based on a standard of plug-in UICC of ETSI TS 102 221 V4.4.0 (2001-10). The second external connecting terminals are disposed outside the minimum range of the terminal layout based on the standard for the first external connecting terminals. The first and second external connecting terminals include signal terminals electrically separated from one another.Type: GrantFiled: May 10, 2005Date of Patent: November 20, 2007Assignee: Renesas Technology Corp.Inventors: Hirotaka Nishizawa, Takashi Totsuka, Kenji Osawa, Junichiro Osako, Tamaki Wada, Michiaki Sugiyama
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Patent number: 7291903Abstract: This invention is to provide an ultra-miniaturized, thin-sized memory card provided with a mechanism for preventing a wrong insertion to a memory card slot. A multi-function memory card is composed of a card body and a cap for housing the card body. The card body is made of mold resin that encapsulates plural semiconductor chips mounted on a main surface of a wiring substrate. The card body is housed into the cap with the back face of the wiring substrate facing outward. Guide channels are provided at both side faces of the cap for preventing that the card is inserted upside down. Further, a convex section is provided at the trailing edge of the cap for preventing that the card is inserted in the wrong direction.Type: GrantFiled: April 25, 2005Date of Patent: November 6, 2007Assignee: Renesas Technology Corp.Inventors: Hirotaka Nishizawa, Kenji Osawa, Junichiro Osako, Tamaki Wada, Michiaki Sugiyama, Takashi Totsuka
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Publication number: 20070194454Abstract: This invention is to provide a nonvolatile memory device that enhances a size reduction and mass productivity while ensuring reliability and signal transmission performance. A nonvolatile memory chip having a first side formed with no pads and a second side formed with pads is mounted on a mounting substrate. A control chip for controlling the nonvolatile memory chip is mounted on the nonvolatile memory chip. The control chip has a first pad row corresponding to the pads of the nonvolatile memory chip. The first pad row is mounted adjacent to the first side of the nonvolatile memory chip. The first pad row of the control chip and a first electrode row formed on the mounting substrate are connected via a first wire group. The pads of the nonvolatile memory chip and a second electrode row formed on the mounting substrate are connected via a second wire group. The first electrode row and the second electrode row are connected through wirings formed in the mounting substrate.Type: ApplicationFiled: January 23, 2007Publication date: August 23, 2007Inventors: Kazuko HANAWA, Takashi Kikuchi, Koichi Kanemoto, Michiaki Sugiyama, Chikako Imura
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Patent number: D552098Type: GrantFiled: November 18, 2005Date of Patent: October 2, 2007Assignees: Renesas Technology Corporation, Sony Kabushiki KaishaInventors: Hirotaka Nishizawa, Kenji Osawa, Junichiro Osako, Tamaki Wada, Michiaki Sugiyama, Takashi Totsuka, Yoshitaka Aoki, Keiichi Tsutsui
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Patent number: D552099Type: GrantFiled: November 18, 2005Date of Patent: October 2, 2007Assignees: Renesas Technology Corporation, Sony Kabushiki KaishaInventors: Hirotaka Nishizawa, Kenji Osawa, Junichiro Osako, Tamaki Wada, Michiaki Sugiyama, Takashi Totsuka, Yoshitaka Aoki, Keiichi Tsutsui
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Patent number: D552612Type: GrantFiled: November 18, 2005Date of Patent: October 9, 2007Assignee: Renesas Technology CorporationInventors: Hirotaka Nishizawa, Kenji Osawa, Junichiro Osako, Tamaki Wada, Michiaki Sugiyama, Takashi Totsuka
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Patent number: D556764Type: GrantFiled: May 22, 2007Date of Patent: December 4, 2007Assignees: Renesas Technology Corporation, Sony Kabushiki KaishaInventors: Hirotaka Nishizawa, Kenji Osawa, Junichiro Osako, Tamaki Wada, Michiaki Sugiyama, Takashi Totsuka, Yoshitaka Aoki, Keiichi Tsutsui
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Patent number: D581932Type: GrantFiled: May 17, 2007Date of Patent: December 2, 2008Assignees: Renesas Technology Corp., Sony Kabushiki KaishaInventors: Hirotaka Nishizawa, Kenji Osawa, Junichiro Osako, Tamaki Wada, Michiaki Sugiyama, Takashi Totsuka, Yoshitaka Aoki, Keiichi Tsutsui