Abstract: A wireless device wherein a first reception block carries out carrier sensing operation to check a condition of interfering wave before a first transmission block transmits a signal, and the first reception block halts operation thereof and makes the first transmission block transmit the signal when the first reception block confirms that the condition of interfering wave is within a predetermined range, or executes retry operation for carrying out the career sensing operation again when it confirms that the condition of interfering wave is outside of the predetermined range as a result of the career sensing operation.

Abstract: A power supply controller includes a power supply section, a power supply controlling section connected to the power supply section, a starter switch being switched selectively to a first status and a second status, a o power switch being switched selectively to a first status and a second status, a controlling section connected to the power switch, and a function section operable to execute a predetermined operation. The power supply controlling section causes a power to be supplied from the power supply section to the controlling section when at least one of the power switch and the starter switch is in the first status. This power supply controller does not malfunction even when the starter switch malfunctions, thus preventing wasteful consumption of the power supply section.

Abstract: A wireless sensor system includes a wireless sensor, a wireless device, and a magnetic field generator connected to the wireless device. The wireless sensor includes an ambience sensor that detects status of an ambient environment to output ambient data depending on the detected status of the ambient environment, a magnetic sensor that senses a magnetic field, a radio-frequency (RF) transmitter that sends the ambient data to the wireless device using a radio wave, and a first controller that is connected to the ambience sensor, the magnetic sensor, and the RF transmitter. The wireless device includes an RF receiver that receives the radio wave sent from the RF transmitter; and a second controller that is connected to the RF receiver and that outputs a control signal for controlling the first controller. The magnetic field generator includes a coil for sending the control signal to the magnetic sensor using a magnetic field.

Abstract: A transmitter receiver unit of the present invention comprises a phase shifter connected between a transistor and a filter multiplexer for decreasing a reactance component of an impedance, as observed from the transistor toward the filter multiplexer, to a value close to zero in a third frequency band given as the sum or difference between the integer multiples of a second frequency band and a first frequency band. This structure decreases the impedance in the third frequency band of the filter multiplexer side as observed from the transistor, thereby making the transistor not liable to generate a signal voltage of the third frequency band.

Abstract: A module component in which mounting components and a conductive partition for dividing into a plurality of circuit blocks are mounted on a substrate. The circuit blocks are covered with a sealing member, which is further covered on its surface with a conductive film to electrically shield the circuit blocks individually. This module component can maintain bending strength, with little warpage by a sufficient shielding effect achieved without increasing the number of manufacturing processes.

Abstract: A balun is provided in which first balanced line and second balanced line are disposed on a nearly the same plane, first unbalanced line is disposed above first balanced line at a predetermined distance from first balanced line, second unbalanced line is disposed below second balanced line at the predetermined distance from second balanced line. With this configuration, the distance between first unbalanced line and second unbalanced line can be increased thereby greatly suppressing mutual cancellation of a current flowing in first unbalanced line and a current flowing in second unbalanced line.

Abstract: A balun is provided in which first balanced line and second balanced line are disposed on a nearly the same plane, first unbalanced line is disposed above first balanced line at a predetermined distance from first balanced line, second unbalanced line is disposed below second balanced line at the predetermined distance from second balanced line. With this configuration, the distance between first unbalanced line and second unbalanced line can be increased thereby greatly suppressing mutual cancellation of a current flowing in first unbalanced line and a current flowing in second unbalanced line.

Abstract: A module includes a first multilayer wiring board, a second multilayer wiring board having an upper surface facing a lower surface of the first multilayer wiring board, a component mounted on an upper surface of the first multilayer wiring board, a first terminal electrode provided on the lower surface of the first multilayer wiring board, a second terminal electrode provided on the upper surface of the second multilayer wiring board and connected to the first terminal electrode, and a terminal electrode provided on a lower surface of the second multilayer wiring board. This module is manufactured at a preferable yield rate.

Abstract: A transmitter receiver unit of the present invention comprises a phase shifter connected between a transistor and a filter multiplexer for decreasing a reactance component of an impedance, as observed from the transistor toward the filter multiplexer, to a value close to zero in a third frequency band given as the sum or difference between the integer multiples of a second frequency band and a first frequency band. This structure decreases the impedance in the third frequency band of the filter multiplexer side as observed from the transistor, thereby making the transistor not liable to generate a signal voltage of the third frequency band.

Abstract: A composite electronic component having a multi-layer wiring board, a first power terminal electrode, a second power terminal electrode, an external connection power supply terminal, a surface-mounted component, an insulator, and a power supply pattern. The first and the second power terminal electrodes are disposed on a first face of the multi-layer wiring board. The external connection power supply terminal is disposed on a second face opposite to the first face of the multi-layer wiring board and connected with the first power terminal electrode. The surface-mounted component is mounted on the first face of the multi-layer wiring board and connected with the first and the second power terminal electrodes at a first face thereof. The insulator covers at least a second face opposite to the first face of the surface-mounted component, the first power terminal electrode, and the second power terminal electrode with a first face thereof.

Abstract: A module component with a good shield effect and a low height including a circuit board having mounted thereon a mount device including an electronic part. The device is sealed with a sealing body having a metal film formed on the sealing body surface. A ground pattern is formed at the outer periphery of the principal surface of the circuit board. The metal film is conductively connected with the ground pattern.

Abstract: A module includes a component, a circuit board having the component mounted thereon, a first grounding pattern formed on an outermost periphery of a surface portion of the circuit board; a first sealer provided on the circuit board and having a dimension projected on the circuit board, and a metal film covering the sealer and connected to the grounding pattern. The dimension of the first dealer is smaller than an outside dimension of the circuit board. The first sealer is made of first resin and sealing the component. The module has a low profile and is adequately shielded.

Abstract: A module component in which mounting components and a conductive partition for dividing into a plurality of circuit blocks are mounted on a substrate. The circuit blocks are covered with a sealing member, which is further covered on its surface with a conductive film to electrically shield the circuit blocks individually. This module component can maintain bending strength, with little warpage by a sufficient shielding effect achieved without increasing the number of manufacturing processes.

Abstract: A composite electronic component having a multi-layer wiring board, a first power terminal electrode, a second power terminal electrode, an external connection power supply terminal, a surface-mounted component, an insulator, and a power supply pattern. The first and the second power terminal electrodes are disposed on a first face of the multi-layer wiring board. The external connection power supply terminal is disposed on a second face opposite to the first face of the multi-layer wiring board and connected with the first power terminal electrode. The surface-mounted component is mounted on the first face of the multi-layer wiring board and connected with the first and the second power terminal electrodes at a first face thereof. The insulator covers at least a second face opposite to the first face of the surface-mounted component, the first power terminal electrode, and the second power terminal electrode with a first face thereof.

Abstract: A module component is provided having a sufficient shield effect and fabricated low in height.

Abstract: A module includes a component, a circuit board having the component mounted thereon, a first grounding pattern formed on an outermost periphery of a surface portion of the circuit board; a first sealer provided on the circuit board and having a dimension projected on the circuit board, and a metal film covering the sealer and connected to the grounding pattern. The dimension of the first dealer is smaller than an outside dimension of the circuit board. The first sealer is made of first resin and sealing the component. The module has a low profile and is adequately shielded.

Abstract: A bias circuit is provided for attenuating harmonic distortions of a signal having a simple construction and which can be applied to a high-frequency amplifier used in a communication device, such as a mobile telephone. The circuit reduces a voltage drop therein and thus provides a high-frequency amplifier having reduced power consumption and an increased operating efficiency. The high-frequency amplifier includes an amplifier circuit, an output matching circuit, and the bias circuit. In the bias circuit, a parallel circuit including a first transmission line and a first capacitor has one end connected between the amplifier and the output matching circuit. The other end of the parallel circuit is connected to a power source and is grounded via a second capacitor. In the circuit, the bias circuit can be short-circuited in a desired frequency band while being an open circuit in a frequency band of a signal to be amplified, hence attenuating the harmonic distortions without using a low pass filter.

Abstract: A bias circuit is provided for attenuating harmonic distortions of a signal having a simple construction and which can be applied to a high-frequency amplifier used in a communication device, such as a mobile telephone. The circuit reduces a voltage drop therein and thus provides a high-frequency amplifier having reduced power consumption and an increased operating efficiency. The high-frequency amplifier includes an amplifier circuit, an output matching circuit, and the bias circuit. In the bias circuit, a parallel circuit including a first transmission line and a first capacitor has one end connected between the amplifier and the output matching circuit. The other end of the parallel circuit is connected to a power source and is grounded via a second capacitor. In the circuit, the bias circuit can be short-circuited in a desired frequency band while being an open circuit in a frequency band of a signal to be amplified, hence attenuating the harmonic distortions without using a low pass filter.

Abstract: A high frequency wireless circuit apparatus is formed by connecting a phase shifter between an antenna duplexer and a low noise amplifier, so that the impedance of the receiving terminal of the antenna duplexer at a transmission frequency and the input impedance of the low noise amplifier may not be matched in complex conjugates of each other. Therefore it prevents the transmission output passing through the receiving terminal of the antenna duplexer and the interference signal entered through the antenna from making the cross modulation in the low noise amplifier. Thus it improves the reception sensitivity and immunity to interference signals of the high frequency wireless circuit apparatus at the same time.

Abstract: A semiconductor device for a tuner capable of simultaneously satisfying a low noise factor, low third order distortion characteristics and low power consumption, and a tuner using this semiconductor device for a tuner and capable of reducing the size and eliminating labor during assembly. The semiconductor device is a variable gain amplification circuit comprising a gate grounded circuit using a transistor, and a differential amplification circuit including transistors and constant current sources. Transistors are used as variable resistance devices, and the gain of the gate grounded circuit can be varied by changing the gate voltage of a transistor. The gain of the differential amplification circuit can be varied by changing the gate voltage of another transistor. The overall gain of the circuit can be varied within a necessary range by simultaneously operating these gain controls, and the third order distortion can be improved monotonously with the decrease of the gain.