Patents by Inventor Michiharu Honda
Michiharu Honda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 7236158Abstract: The present invention provides a trackball and an in-vehicle device controller using the trackball. The trackball provides a stable operational feel and is easy to operate even in an environment in a vehicle where vibration and movement are present. The trackball includes a ball made of a non-magnetic material and having embedded therein bar members made of a magnetic material and arranged on three axes orthogonal to one another, a case enclosing the ball such that at least an upper portion of the ball is exposed, magnetic members fixed to the case on two axes penetrating through the center of the ball and orthogonal to each other so as to allow magnetic coupling to ends of the bar members, and another magnetic member fixed to the case on an axis penetrating through the center of the ball and orthogonal to the two axes so as to allow magnetic coupling to an end of one of the bar members.Type: GrantFiled: September 23, 2003Date of Patent: June 26, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Atsushi Iisaka, Kiyomi Sakamoto, Atsushi Yamashita, Michiharu Honda, Takatoshi Ono, Takefumi Inoue, Kiyotaka Sasanouchi
-
Patent number: 6861294Abstract: A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.Type: GrantFiled: September 30, 2003Date of Patent: March 1, 2005Assignee: Renesas Technology Corp.Inventors: Shigeharu Tsunoda, Junichi Saeki, Isamu Yoshida, Kazuya Ooji, Michiharu Honda, Makoto Kitano, Nae Yoneda, Shuji Eguchi, Kunihiko Nishi, Ichiro Anjoh, Kenichi Otsuka
-
Publication number: 20040063272Abstract: A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.Type: ApplicationFiled: September 30, 2003Publication date: April 1, 2004Applicant: HITACHI, LTD.Inventors: Shigeharu Tsunoda, Junichi Saeki, Isamu Yoshida, Kazuya Ooji, Michiharu Honda, Makoto Kitano, Nae Yoneda, Shuji Eguchi, Kunihiko Nishi, Ichiro Anjoh, Kenichi Otsuka
-
Publication number: 20040056842Abstract: The present invention provides a trackball and an in-vehicle device controller using the trackball. The trackball provides a stable operational feel and are easy to operate even in an environment in a vehicle where vibration and movement are present. A trackball 2 includes a ball 21 made of a non-magnetic material and having embedded therein bar members 26 to 28 made of a magnetic material and arranged on three axes orthogonal to one another, a case 22 enclosing the ball 21 such that at least an upper portion of the ball 21 is exposed, magnetic members 31 to 34 fixed to the case 22 on two axes penetrating through the center of the ball 21 and orthogonal to each other so as to allow magnetic coupling to ends of the bar members, and a magnetic member 35 fixed to the case 22 on an axis penetrating through the center of the ball 21 and orthogonal to the two axes so as to allow magnetic coupling to an end 28B of the bar member 28.Type: ApplicationFiled: September 23, 2003Publication date: March 25, 2004Inventors: Atsushi Iisaka, Kiyomi Sakamoto, Atsushi Yamashita, Michiharu Honda, Takatoshi Ono, Takefumi Inoue, Kiyotaka Sasanouchi
-
Patent number: 6686226Abstract: A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold, which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.Type: GrantFiled: May 2, 2000Date of Patent: February 3, 2004Assignee: Hitachi, Ltd.Inventors: Shigeharu Tsunoda, Junichi Saeki, Isamu Yoshida, Kazuya Ooji, Michiharu Honda, Makoto Kitano, Nae Yoneda, Shuji Eguchi, Kunihiko Nishi, Ichiro Anjoh, Kenichi Otsuka
-
Patent number: 6460755Abstract: There are disclosed a solder bump forming method and an apparatus therefor, which achieve a high reliability, and an electronic part, produced by this method and this apparatus, is also disclosed. For each of the step of arraying solder balls, the step of supplying a flux, and the step of mounting the solder balls on a board, it is checked whether or not any solder ball is omitted, and the process is conducted while confirming the condition of the operation, thereby enhancing the reliability and also preventing defective products from being produced.Type: GrantFiled: March 7, 1997Date of Patent: October 8, 2002Assignees: Hitachi, Ltd., Hitachi Seiko Ltd.Inventors: Kosuke Inoue, Takamichi Suzuki, Hitoshi Odashima, Katsuhiro Iwashita, Tatsuya Yoneda, Michiharu Honda, Katuhisa Tanaka, Tsuyoshi Yamaguchi, Tetsuo Murakami, Asahi Tsuchiya, Yoshitatsu Naito, Mitsuhiro Suzuki, Izumi Hata, Kouji Sajiki
-
Patent number: 6448646Abstract: A semiconductor device-mounting construction including a semiconductor device having a plurality of electrodes formed on one main surface thereof. A printed circuit board having a writing pattern formed on one main surface thereof and a plurality of solder bumps interposed between the plurality of electrodes and the writing pattern to electrically connect the semiconductor device and the printed circuit board together. All of the voids, which are present in an interface of each of those of the plurality of solder bumps which are disposed closest to an outer peripheral edge of the semiconductor device, joined to the semiconductor device, are fine, and generally uniform in size.Type: GrantFiled: September 7, 2000Date of Patent: September 10, 2002Assignee: Hitachi, Ltd.Inventors: Makoto Kitano, Michiharu Honda
-
Patent number: 6122177Abstract: In order to reduce a strain, developing in solder bumps in a BGA-type semiconductor device-mounting construction, so as to enhance a thermal fatigue life, voids, present in each solder bump joint portion of a BGA-type semiconductor device, are limited to a predetermined size, and a void of a large size, which would increase a strain to be produced, is eliminated.Type: GrantFiled: March 27, 1998Date of Patent: September 19, 2000Assignee: Hitachi, Ltd.Inventors: Makoto Kitano, Michiharu Honda
-
Patent number: 6114192Abstract: A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.Type: GrantFiled: July 14, 1998Date of Patent: September 5, 2000Assignee: Hitachi, Ltd.Inventors: Shigeharu Tsunoda, Junichi Saeki, Isamu Yoshida, Kazuya Ooji, Michiharu Honda, Makoto Kitano, Nae Yoneda, Shuji Eguchi, Kunihiko Nishi, Ichiro Anjoh, Kenichi Otsuka
-
Patent number: 5914531Abstract: A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.Type: GrantFiled: February 25, 1997Date of Patent: June 22, 1999Assignee: Hitachi, Ltd.Inventors: Shigeharu Tsunoda, Junichi Saeki, Isamu Yoshida, Kazuya Ooji, Michiharu Honda, Makoto Kitano, Nae Yoneda, Shuji Eguchi, Kunihiko Nishi, Ichiro Anjoh, Kenichi Otsuka
-
Patent number: 5390079Abstract: A tape carrier package has a base film and leads formed on one side of the base film. The base film defines a device hole therein, while the leads have outer portions to be bonded to a substrate and inner lead portions extending into the device hole. The tape carrier package can be mounted on a substrate by applying a high-frequency electromagnetic field to a portion of each lead which is to be bonded to the substrate, whereby solder applied to the lead or substrate in advance is heated and melted to bond the package to the substrate.Type: GrantFiled: September 9, 1992Date of Patent: February 14, 1995Assignee: Hitachi, Ltd.Inventors: Kokichi Aomori, Michiharu Honda, Toshihiro Okabe
-
Patent number: 5334875Abstract: There is a trend to increase that area of a device requiring a memory of large capacity, which is occupied by a semiconductor memory. This trend obstructs reduction of the size of the device. The present invention contemplates to provide a memory which can have a high integration, a high density and a large capacity while minimizing the mounting area. In order to achieve this memory, the TAB (Tape Automated Bonding) of the prior art is mounted on an electrically conductive connector, and a plurality of structures composed of the TAB and the connector are stacked. Moreover, the connector mounting the TAB thereon is constructed such that the independent terminals of the stacked TABs may not be shorted.Type: GrantFiled: March 2, 1993Date of Patent: August 2, 1994Assignees: Hitachi, Ltd., Hitachi Tobu Semiconductor, Ltd.Inventors: Toshio Sugano, Kohji Nagaoka, Seiichiro Tsukui, Yoshiaki Wakashima, Michio Tanimoto, Masayuki Watanabe, Suguru Sakaguchi, Kunihiko Nishi, Aizo Kaneda, Kohji Serizawa, Michiharu Honda, Tohru Yoshida, Takeshi Komaru, Atsushi Nakamura
-
Patent number: 5315482Abstract: A semiconductor apparatus comprises a heat diffusing plate and a surface installing printed board. A semiconductor device of a high heat generation is installed on the heat diffusing plate. A surface installing package and chip parts are installed on both surfaces of the printed board. A through hole is formed at the center of the printed board so that the semiconductor device is located at the center. The heat diffusing plate on which the semiconductor device has been installed and the surface installing printed board are connected and integrated.Type: GrantFiled: October 15, 1992Date of Patent: May 24, 1994Assignee: Hitachi, Ltd.Inventors: Akira Tanaka, Hiroichi Shinohara, Kazuji Yamada, Takao Ohba, Akira Yamagiwa, Hitoshi Yoshidome, Yuji Shirai, Toshio Hatada, Munehisa Kishimoto, Michiharu Honda
-
Patent number: 5198888Abstract: There is a trend to increase that area of a device requiring a memory of large capacity, which is occupied by a semiconductor memory. This trend obstructs reduction of the size of the device. The present invention contemplates to provide a memory which can have a high integration, a high density and a large capacity while minimizing the mounting area. In order to achieve this memory, the TAB (Tape Automated Bonding) of the prior art is mounted on an electrically conductive connector, and a plurality of structures composed of the TAB and the connector are stacked. Moreover, the connector mounting the TAB thereon is constructed such that the independent terminals of the stacked TABs may not be shorted.Type: GrantFiled: December 20, 1990Date of Patent: March 30, 1993Assignees: Hitachi, Ltd., Hitachi Tobu Semiconductor, Ltd.Inventors: Toshio Sugano, Kohji Nagaoka, Seiichiro Tsukui, Yoshiaki Wakashima, Michio Tanimoto, Masayuki Watanabe, Suguru Sakaguchi, Kunihiko Nishi, Aizo Kaneda, Kohji Serizawa, Michiharu Honda, Tohru Yoshida, Takeshi Komaru, Atsushi Nakamura
-
Patent number: 5028986Abstract: There is a trend to increase that area of a device requiring a memory of large capacity, which is occupied by a semiconductor memory. This trend obstructs reduction of the size of the device. The present invention contemplates to provide a memory which can have a high integration, a high density and a large capacity while minimizing the mounting area. In order to achieve this memory, the TAB (Tape Automated Bonding) of the prior art is mounted on an electrically conductive connector, and a plurality of structures composed of the TAB and the connector are stacked. Moreover, the connector mounting the TAB thereon is constructed such that the independent terminals of the stacked TABs may not be shorted.Type: GrantFiled: December 23, 1988Date of Patent: July 2, 1991Assignees: Hitachi, Ltd., HitachiTobu Semiconductor, Ltd.Inventors: Toshio Sugano, Kohji Nagaoka, Seiichiro Tsukui, Yoshiaki Wakashima, Michio Tanimoto, Masayuki Watanabe, Suguru Sakaguchi, Kunihiko Nishi, Aizo Kaneda, Kohji Serizawa, Michiharu Honda, Tohru Yoshida, Takeshi Komaru, Atsushi Nakamura