Abstract: An electronic component is disclosed, and this component includes an element with an electrode section which is formed of upper electrode (74), lower electrode (72), piezoelectric unit (70) placed between upper electrode (74) and lower electrode (72), and adhesive layer (76) layered between upper electrode (74) and piezoelectric unit (70). Piezoelectric unit (70) includes piezoelectric layer (80) made of piezoelectric material containing lead, and adhesive layer (76) includes a tungsten layer made of tungsten-based material. Piezoelectric layer (80) and the tungsten layer are layered together. The structure discussed above allows preventing a piezoelectric constant from lowering and a base-point voltage from varying. The lowering and the varying have been caused by a temperature-rise.

Abstract: An upper adhesion layer 35 formed between a piezoelectricity layer 32 and an upper electrode layer 34 so as to abut on the piezoelectricity layer 32 and the upper electrode layer 34 is included. The upper adhesion layer 35 includes a first tungsten layer 47 made of tungsten in which an ? phase and a ? phase coexist and a second tungsten layer 48 made of ?-phase tungsten. The first tungsten layer 47 is configured so as to abut on the piezoelectricity layer 32. It is possible to obtain a piezoelectric device which is capable of improving the adhesion property of both the piezoelectricity layer and the electrode layer and reducing a basic point voltage fluctuation at the time of high-temperature operation so as to improve reliability.

Abstract: An angular velocity sensor has a stable characteristic in which a vibration element has a small variation in the driving efficiency even when carbon dioxide gas is generated by the reaction with oxygen gas in a package including therein the vibration element. To realize this, the angular velocity sensor has a mixed gas of inert gas and oxygen gas in the package so that the mixed gas in the package has a pressure higher than the atmospheric pressure.

Abstract: Upper adhesion layer 35 formed between piezoelectricity layer 32 and upper electrode layer 34 so as to abut on piezoelectricity layer 32 and upper electrode layer 34 is included. Upper adhesion layer 35 includes first tungsten layer 47 made of tungsten in which an ? phase and a ? phase coexist and second tungsten layer 48 made of ?-phase tungsten. First tungsten layer 47 is configured so as to abut on piezoelectricity layer 32. It is possible to obtain a piezoelectric device which is capable of improving the adhesion property of both the piezoelectricity layer and the electrode layer and reducing a basic point voltage fluctuation at the time of high-temperature operation so as to improve reliability.

Abstract: An electronic component is disclosed, and this component includes an element with an electrode section which is formed of upper electrode (74), lower electrode (72), piezoelectric unit (70) placed between upper electrode (74) and lower electrode (72), and adhesive layer (76) layered between upper electrode (74) and piezoelectric unit (70). Piezoelectric unit (70) includes piezoelectric layer (80) made of piezoelectric material containing lead, and adhesive layer (76) includes a tungsten layer made of tungsten-based material. Piezoelectric layer (80) and the tungsten layer are layered together. The structure discussed above allows preventing a piezoelectric constant from lowering and a base-point voltage from varying. The lowering and the varying have been caused by a temperature-rise.

Abstract: The present invention provides an angular velocity sensor having a stable characteristic in which a vibration element has a small variation in the driving efficiency even when carbon dioxide gas is generated by the reaction with oxygen gas in a package including therein the vibration element. To realize this, the angular velocity sensor of the present invention provides mixed gas of inert gas and oxygen gas in the package so that the mixed gas in the package has a pressure higher than the atmospheric pressure.

Abstract: An angular velocity sensor includes a tuning-fork-shaped substrate (1), drivers (110) that are provided on the arms forming a tuning fork and vibrate the arms; monitors (150) for detecting vibrations generated by the drivers (110); and detectors (120) for detecting displacement of vibrations made in application of an angular velocity. The drivers (110), the monitors (150), and the detectors (120) are made of a lower electrode layer, a piezoelectric thin film, and an upper electrode layer formed on the arms. The outer peripheral edge of the piezoelectric thin film is shaped like a step having at least one flat portion. The flat portion along the outer peripheral edge has no upper electrode layer formed thereon. This structure prevents short circuits between the lower electrode layer and the upper electrode layer.

Abstract: An electronic circuit is manufactured by the following method. Elements are formed on a front surface of a substrate, and then, a recess is formed around each of the elements in the front surface of the substrate. Then, a portion of the substrate is removed from a back surface of the substrate until reaching the bottom of the recess. In the method, the elements are separated at once by removing the portion of the substrate from the back surface, and thus, the elements are manufactured efficiently.

Abstract: An angular velocity sensor, which is able to reduce the variations of driving resonance frequency of the vibrator and to improve the reliability of the sensitivity of detection signal with respect to the angular velocity applied, is provided. The angular velocity sensor comprises a vibrator, and a tuning-fork as the vibrator is formed of a silicone substrate with crystal orientation (100) as its main face, and a side face nearly perpendicular to the driving direction (X direction) of the arm of the tuning-fork corresponds to a crystal orientation where the elastic modulus is less dependent on azimuth angle.

Abstract: An angular velocity sensor includes a tuning-fork-shaped substrate (1), drivers (110) that are provided on the arms forming a tuning fork and vibrate the arms; monitors (150) for detecting vibrations generated by the drivers (110); and detectors (120) for detecting displacement of vibrations made in application of an angular velocity. The drivers (110), the monitors (150), and the detectors (120) are made of a lower electrode layer, a piezoelectric thin film, and an upper electrode layer formed on the arms. The outer peripheral edge of the piezoelectric thin film is shaped like a step having at least one flat portion. The flat portion along the outer peripheral edge has no upper electrode layer formed thereon. This structure prevents short circuits between the lower electrode layer and the upper electrode layer.

Abstract: An angular velocity sensor, which is able to reduce the variations of driving resonance frequency of the vibrator and to improve the reliability of the sensitivity of detection signal with respect to the angular velocity applied, is provided. The angular velocity sensor comprises an vibrator, and a tuning-fork as the vibrator is formed of a silicone substrate with crystal orientation (100) as its main face, and a side face nearly perpendicular to the driving direction (X direction) of the arm of the tuning-fork corresponds to a crystal orientation where elastic modulus is less dependent on azimuth angle.

Abstract: An electronic circuit is manufactured by the following method. Elements are formed on a front surface of a substrate, and then, a recess is formed around each of the element in the front surface of the substrate. Then, a portion of the substrate is removed from a back surface of the substrate until reaching the bottom of the recess. In the method, the elements are separated at once by removing the portion of the substrate from the back surface, and thus, the elements are manufactured efficiently.

Abstract: The present invention relates to a method of manufacturing a piezoelectric device of high sensitivity using direct bonded quartz plate. To achieve this object, the invented method comprises the steps of covalently bonding a plurality of quartz plates, dry etching the bonded quartz plates with plasma from one side of its surfaces down to a bonded plane, and dry etching with plasma thereafter from the other side of the surfaces.

Abstract: The present invention relates to a method of manufacturing a piezoelectric device of high sensitivity using direct bonded quartz plate. To achieve this object, the invented method comprises the steps of covalently bonding a plurality of quartz plates, dry etching the bonded quartz plates with plasma from one side of its surfaces down to a bonded plane, and dry etching with plasma thereafter from the other side of the surfaces.

Abstract: A driving current control circuit capable of controlling the logarithmic base current of two transistors in a current driver to control a drive current for a motor. This control circuit controls the current of the current regulator depending on a control signal, thereby controlling the driving current for the transistors in the current driver. The control circuit includes an output current mirror composed of two output-side transistors and a single input-side transistor. The two output-side transistors control the inflow and outflow of the driving current for the current driver. A single phase compensating condenser is connected to the input-side transistor. This arrangement makes the entire circuit simple and compact and causes an improved controlling characteristic.

Abstract: A motor controlling circuit used for controlling the drive of a motor, and particularly to improvements of the control characteristics of the amplifier. A current setting transistor for setting an amount of current flowing from a differential amplifier to a predetermined value is disposed on the downstream side of the differential amplifier. The amount of current flowing across this current setting transistor is varied in response to the level of an input signal to the amplifier, so that the current outputting capability of the differential amplifier is proportional to the level of the input signal. Accordingly, when the level of the input signal is small, the gain of the amplifier is made small, and a gain for an amount of ripple at that time is also made small. Hence, it is possible to control an adverse effect of the ripple carried on the input signal when the level of the input signal is small.