Patents by Inventor Michihiro Inoue

Michihiro Inoue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200105499
    Abstract: A charged particle beam irradiation apparatus according to an embodiment includes: an optical column; a stage; a mount supporting the stage; a chamber provided on the mount and supporting the optical column; a detector configured to detect movement of the stage; actuator units each including a curved plate, a piezoelectric element, and a connector connected configured to transmit a first force generated by a change of the curvature of the curved plate to the mount; and an actuator control circuit configured to control the voltage applied to the piezoelectric element of each of the actuator units based on movement information, so that the first force is transmitted from the actuator units to the mount against a second force acting on the mount due to the movement of the stage.
    Type: Application
    Filed: September 27, 2019
    Publication date: April 2, 2020
    Applicant: NuFlare Technology, Inc.
    Inventors: Michihiro KAWAGUCHI, Kiminobu AKENO, Keita IDENO, Kota IWASAKI, Keisuke GOTO, Kiyoshi NAKASO, Shintaro YAMAMOTO, Hitoshi MATSUSHITA, Ryota INOUE, Yuki FUKUDA
  • Patent number: 10607810
    Abstract: The vibration control system configured to control vibration of a vibration-controlled object is disclosed. The vibration control system comprises: (i) actuator units each including a piezoelectric element configured to expand and contract; (ii) a drive power source configured to supply drive voltages to the piezoelectric elements of the actuator units for causing the piezoelectric elements to expand and contract; (iii) a vibration detector configured to detect a status of vibration of the vibration-controlled object; and (iv) a vibration controller configured to control the vibration of the vibration-controlled object by controlling the voltages supplied by the drive power source to the piezoelectric elements of the actuator units based on the status of vibration detected by the vibration detector, respectively.
    Type: Grant
    Filed: January 2, 2019
    Date of Patent: March 31, 2020
    Assignee: NuFlare Technology, Inc.
    Inventors: Michihiro Kawaguchi, Kiminobu Akeno, Kiyoshi Nakaso, Keita Ideno, Shintaro Yamamoto, Keisuke Goto, Hitoshi Matsushita, Hirokazu Yoshioka, Ryouta Inoue, Yuuki Fukuda
  • Patent number: 10578968
    Abstract: The present invention has an object to provide a pattern forming method capable of providing good DOF and EL, a resist pattern formed by the pattern forming method, and a method for manufacturing an electronic device, including the pattern forming method. The pattern forming method of the present invention includes a step a of coating an active-light-sensitive or radiation-sensitive resin composition onto a substrate to form a resist film, a step b of coating a composition for forming an upper layer film onto the resist film to form an upper layer film on the resist film, a step c of exposing the resist film having the upper layer film formed thereon, and a step d of developing the exposed resist film using a developer to form a pattern, in which the active-light-sensitive or radiation-sensitive resin composition contains a hydrophobic resin.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: March 3, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Kei Yamamoto, Naohiro Tango, Naoki Inoue, Michihiro Shirakawa, Akiyoshi Goto
  • Publication number: 20190333789
    Abstract: Provided is an assembling apparatus for a semiconductor manufacturing apparatus. The assembling apparatus includes: a body; lift attached to the body and configured to move a reaction tube having an opening at a lower end portion thereof vertically, thereby allowing a gas supply pipe to be installed inside the reaction tube through the opening while the reaction tube is held by the lift; gas supply source configured to supply a gas into the reaction tube through the gas supply pipe while the reaction tube is held by the lift; and an exhaust mechanism including a pump configured to exhaust an inside of the reaction tube through the opening, thereby performing a leakage test of the reaction tube while the reaction tube is held by the lift.
    Type: Application
    Filed: April 25, 2019
    Publication date: October 31, 2019
    Inventors: Hisashi Inoue, Masahiro Kobayashi, Michihiro Takahashi, Tamotsu Hatakeyama, Harunari Hasegawa, Hiroshi Kikuchi, Yoshihisa Kumagai
  • Publication number: 20190316495
    Abstract: Provided is a mechanical lash adjuster including a plunger, a housing put into thread engagement with the plunger in an axial direction to form a thread engagement portion, the plunger engaging member fixed and retained in a circumferential direction of the thread engagement portion, and a coil spring urging the plunger in a direction opposite to a urging-force acting direction of a coil spring. A lead and flank angles of threads forming the thread engagement portion are set such that when an axial load acts on the plunger in either of a plunger extension and contraction directions, the plunger is made self-sustaining, and when the plunger swings by an amount corresponding to a backlash due to a lateral load, the plunger slides and rotates at the thread engagement portion to move in an axial-load acting direction.
    Type: Application
    Filed: June 17, 2016
    Publication date: October 17, 2019
    Inventors: Michihiro KAMEDA, Hiroyuki OZAWA, Masaaki INOUE
  • Publication number: 20190214224
    Abstract: The vibration control system configured to control vibration of a vibration-controlled object is disclosed. The vibration control system comprises: (i) actuator units each including a piezoelectric element configured to expand and contract; (ii) a drive power source configured to supply drive voltages to the piezoelectric elements of the actuator units for causing the piezoelectric elements to expand and contract; (iii) a vibration detector configured to detect a status of vibration of the vibration-controlled object; and (iv) a vibration controller configured to control the vibration of the vibration-controlled object by controlling the voltages supplied by the drive power source to the piezoelectric elements of the actuator units based on the status of vibration detected by the vibration detector, respectively.
    Type: Application
    Filed: January 2, 2019
    Publication date: July 11, 2019
    Applicant: NuFlare Technology, Inc.
    Inventors: Michihiro Kawaguchi, Kiminobu Akeno, Kiyoshi Nakaso, Keita Ideno, Shintaro Yamamoto, Keisuke Goto, Hitoshi Matsushita, Hirokazu Yoshioka, Ryouta Inoue, Yuuki Fukuda
  • Patent number: 10304675
    Abstract: A semiconductor manufacturing system has a series of steps, from manufacturing of a semiconductor on a wafer until packaging, that can be easily linked. A semiconductor chip manufacturing device manufactures a semiconductor chip, and a semiconductor packaging device packages the semiconductor chip by attaching the semiconductor chip to a package substrate which is larger than the wafer. The semiconductor chip manufacturing device includes a PLAD system for loading the wafer into and out of the semiconductor chip manufacturing device through a shuttle which is capable of housing the wafer. The semiconductor packaging device includes a PLAD system capable of loading the package substrate into and out of the semiconductor packaging device through a shuttle which is capable of housing the package substrate. The shuttles have container bodies of a same shape.
    Type: Grant
    Filed: November 16, 2015
    Date of Patent: May 28, 2019
    Assignee: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Michihiro Inoue, Shiro Hara, Fumito Imura, Arami Saruwatari, Sommawan Khumpuang
  • Patent number: 10163674
    Abstract: An object of the present invention is to provide a circular support substrate that allows for positioning based solely on its outer periphery shape. As a means for solving the problems, a circular support substrate is provided that has at least three chords along its circumference, wherein the chords are provided at positions where they do not run linearly symmetrical to the straight line passing through the center axis of the circular support substrate.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: December 25, 2018
    Assignee: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Shiro Hara, Sommawan Khumpuang, Fumito Imura, Michihiro Inoue, Arami Saruwatari
  • Patent number: 10163819
    Abstract: A method for manufacturing a surface-mount type package whose face parallel with the semiconductor chip surface has a circular cross-section, is characterized by including at least the following steps in this order: a first step in which a semiconductor chip is bonded onto a circular support substrate; a second step in which the semiconductor chip is sealed with resin; a third step in which the resin covering the pads of the semiconductor chip is removed; a fourth step in which a rewiring layer is formed; and a fifth step in which bumps are formed. The method can provide a surface-mount type package for semiconductor chips which is resistant to failures caused by thermal stress.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: December 25, 2018
    Assignee: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Shiro Hara, Sommawan Khumpuang, Fumito Imura, Michihiro Inoue, Arami Saruwatari
  • Publication number: 20180025994
    Abstract: An object of the present invention is to provide a surface-mount type package for semiconductor chips which is resistant to failures caused by thermal stress. As a means for achieving the object, a method for manufacturing a surface-mount type package whose face parallel with the semiconductor chip surface has a circular cross-section, is provided, wherein such method is characterized in that it comprises at least the following steps in this order. A first step in which a semiconductor chip is bonded onto a circular support substrate. A second step in which the semiconductor chip is sealed with resin. A third step in which the resin covering the pads of the semiconductor chip is removed. A fourth step in which a rewiring layer is formed. A fifth step in which bumps are formed.
    Type: Application
    Filed: November 24, 2015
    Publication date: January 25, 2018
    Inventors: Shiro HARA, Sommawan KHUMPUANG, Fumito IMURA, Michihiro INOUE, Arami SARUWATARI
  • Publication number: 20170352570
    Abstract: An object of the present invention is to provide a circular support substrate that allows for positioning based solely on its outer periphery shape. As a means for solving the problems, a circular support substrate is provided that has at least three chords along its circumference, wherein the chords are provided at positions where they do not run linearly symmetrical to the straight line passing through the center axis of the circular support substrate.
    Type: Application
    Filed: November 24, 2015
    Publication date: December 7, 2017
    Applicant: National Institute of Advanced Industrial Science and Technology
    Inventors: Shiro HARA, Sommawan KHUMPUANG, Fumito IMURA, Michihiro INOUE, Arami SARUWATARI
  • Publication number: 20170330741
    Abstract: A semiconductor manufacturing system has a series of steps, from manufacturing of a semiconductor on a wafer until packaging, that can be easily linked. A semiconductor chip manufacturing device manufactures a semiconductor chip, and a semiconductor packaging device packages the semiconductor chip by attaching the semiconductor chip to a package substrate which is larger than the wafer. The semiconductor chip manufacturing device includes a PLAD system for loading the wafer into and out of the semiconductor chip manufacturing device through a shuttle which is capable of housing the wafer. The semiconductor packaging device includes a PLAD system capable of loading the package substrate into and out of the semiconductor packaging device through a shuttle which is capable of housing the package substrate. The shuttles have container bodies of a same shape.
    Type: Application
    Filed: November 16, 2015
    Publication date: November 16, 2017
    Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Michihiro INOUE, Shiro HARA, Fumito IMURA, Arami SARUWATARI, Sommawan KHUMPUANG
  • Patent number: 8692860
    Abstract: A light emitting device includes light emitting chips, a mount board on which the light emitting chips are mounted, and a buffer amplifier. Each of the light emitting chips includes light emitting elements and transfer elements. The transfer element sequentially specify, by sequentially entering an on-state, the light emitting elements as targets for control of illumination or non-illumination. Each of the transfer elements is provided for a corresponding one of the light emitting elements. The buffer amplifier is provided on the mount board, and outputs a transfer signal on the basis of an input transfer signal. The transfer signal is used to sequentially set the transfer elements, which are included in each of the light emitting chips, to be in the on-state.
    Type: Grant
    Filed: November 9, 2011
    Date of Patent: April 8, 2014
    Assignee: Fuji Xerox Co., Ltd.
    Inventor: Michihiro Inoue
  • Patent number: 8373893
    Abstract: An image forming apparatus includes a light emission element, a lighting signal generation section, a storage section, a communication line, a control section and an electromagnetic noise generation source. The storage section stores data used when the lighting signal generation section generates a lighting signal. The lighting signal generation section and the storage section transmit and receive the data therebetween through the communication line. The control section that controls the transmitting and receiving of the data between the lighting signal generation section and the storage section. The control section controls so as to start the transmitting and receiving of the data between the storage section and the lighting signal generation section in a state where a magnitude of the electromagnetic noise, at a position where the lighting signal generation section is disposed, generated by the electromagnetic noise generation source is smaller than a predetermined value.
    Type: Grant
    Filed: July 16, 2007
    Date of Patent: February 12, 2013
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Michihiro Inoue, Yasukazu Horii, Takayoshi Sato
  • Patent number: 8368734
    Abstract: An exposure device includes a plurality of light-emitting elements, a lighting driver, a first storage, a reader, a shading correction unit and a second storage. The lighting driver drives and lights up the light-emitting elements based on image data. The first storage stores light amount unevenness correction values of the respective light-emitting elements. The reader reads the light amount unevenness correction values stored in the first storage. The shading correction unit executes shading correction for the light amount unevenness correction values read by the reader. The second storage stores correction values obtained by having the shading correction unit to execute the shading correction for the light amount unevenness correction values. The lighting driver controls light power of the respective light-emitting elements based on the correction values stored in the second storage.
    Type: Grant
    Filed: August 27, 2009
    Date of Patent: February 5, 2013
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Ken Tsuchiya, Michio Taniwaki, Fumihiko Ogasawara, Toshio Hisamura, Osamu Yasui, Michihiro Inoue
  • Publication number: 20120256998
    Abstract: A light emitting device includes light emitting chips, a mount board on which the light emitting chips are mounted, and a buffer amplifier. Each of the light emitting chips includes light emitting elements and transfer elements. The transfer element sequentially specify, by sequentially entering an on-state, the light emitting elements as targets for control of illumination or non-illumination. Each of the transfer elements is provided for a corresponding one of the light emitting elements. The buffer amplifier is provided on the mount board, and outputs a transfer signal on the basis of an input transfer signal. The transfer signal is used to sequentially set the transfer elements, which are included in each of the light emitting chips, to be in the on-state.
    Type: Application
    Filed: November 9, 2011
    Publication date: October 11, 2012
    Applicant: FUJI XEROX CO., LTD.
    Inventor: Michihiro INOUE
  • Patent number: 8279249
    Abstract: A recording head including: a non-electrically conductive support member; a base board provided above the support member, the base board being provided with light emitting elements for forming an image on a recording medium, a drive section for causing the light emitting elements to emit light, a first earth connection member provided at an end portion of the base board, and a second earth connection member provided at a location of a connection member, having one end connected to a control section for controlling the drive section and another end connected to drive section; a conducting member provided at a predetermined place relative to the support member and connected to an earth; a first conduction section conducting between the conducting member and the first earth connection member; and a second conduction section conducting between the conducting member and the second earth connection member.
    Type: Grant
    Filed: September 9, 2010
    Date of Patent: October 2, 2012
    Assignee: Fuji Xerox Co., Ltd.
    Inventor: Michihiro Inoue
  • Patent number: 8022974
    Abstract: An exposure device includes plural light emitting elements that light in turn for exposure, plural driving elements that drive each of the light emitting elements and a time changing member that changes one time period of a switching signal to switch light emitting elements driven by the driving elements among the plurality of light emitting elements in turn from a reference time, depending on an image forming speed, wherein the time changing member changes the one time period from the reference time for some of the light emitting elements during one main scan, and maintains the one time period as the reference time for the remaining light emitting elements.
    Type: Grant
    Filed: September 28, 2009
    Date of Patent: September 20, 2011
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Fumihiko Ogasawara, Osamu Yasui, Michihiro Inoue, Ken Tsuchiya, Michio Taniwaki, Toshio Hisamura
  • Publication number: 20110205327
    Abstract: A recording head including: a non-electrically conductive support member; a base board provided above the support member, the base board being provided with light emitting elements for forming an image on a recording medium, a drive section for causing the light emitting elements to emit light, a first earth connection member provided at an end portion of the base board, and a second earth connection member provided at a location of a connection member, having one end connected to a control section for controlling the drive section and another end connected to drive section; a conducting member provided at a predetermined place relative to the support member and connected to an earth; a first conduction section conducting between the conducting member and the first earth connection member; and a second conduction section conducting between the conducting member and the second earth connection member.
    Type: Application
    Filed: September 9, 2010
    Publication date: August 25, 2011
    Applicant: FUJI XEROX CO., LTD.
    Inventor: Michihiro INOUE
  • Patent number: 7954917
    Abstract: An exposure device includes a circuit board, a light-emitting element member, a driving signal generating unit and a first voltage supply unit. The light-emitting element member is disposed on the circuit board. The light-emitting element includes plural light-emitting elements arranged in a line and plural switching elements disposed so as to correspond to the plural light-emitting elements. When the plural switching elements sequentially set the respective light-emitting elements to be in a state where the respective light-emitting elements can turn on, the respective light-emitting elements turn on sequentially. The driving signal generating unit is disposed on the circuit board. The driving signal generating unit generates driving signals for driving the respective light-emitting elements arranged in the light-emitting element member. The first voltage supply unit is disposed on the circuit board. The voltage supply unit supplies a first predetermined voltage to the light-emitting element member.
    Type: Grant
    Filed: April 16, 2007
    Date of Patent: June 7, 2011
    Assignee: Fuji Xerox Co., Ltd.
    Inventor: Michihiro Inoue