Patents by Inventor Michihiro Shirakawa

Michihiro Shirakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11281103
    Abstract: A composition for forming an upper layer film is applied onto a resist film formed using an actinic ray-sensitive or radiation-sensitive resin composition, and includes a resin X and a compound A having a radical trapping group. A pattern forming method includes applying an actinic ray-sensitive or radiation-sensitive resin composition onto a substrate to form a resist film, applying the composition for forming an upper layer film onto the resist film to form an upper layer film on the resist film, exposing the resist film having the upper layer film formed thereon, and developing the exposed resist film using a developer including an organic solvent to form a pattern.
    Type: Grant
    Filed: September 11, 2017
    Date of Patent: March 22, 2022
    Assignee: FUJIFILM Corporation
    Inventors: Naoya Hatakeyama, Naoki Inoue, Naohiro Tango, Michihiro Shirakawa, Akiyoshi Goto
  • Publication number: 20220082938
    Abstract: An actinic ray-sensitive or radiation-sensitive resin composition including one or more specific compounds selected from the group consisting of a compound represented by General Formula (1), a compound represented by General Formula (2), and a compound represented by General Formula (3), and an acid-decomposable resin.
    Type: Application
    Filed: November 28, 2021
    Publication date: March 17, 2022
    Applicant: FUJIFILM Corporation
    Inventors: Aina USHIYAMA, Masafumi KOJIMA, Akiyoshi GOTO, Michihiro SHIRAKAWA, Keita KATO, Hironori OKA
  • Patent number: 11249395
    Abstract: One embodiment of the present invention provides a pattern forming method including a step for forming an actinic ray-sensitive or radiation-sensitive film on a substrate using an actinic ray-sensitive or radiation-sensitive resin composition, a step for forming an upper layer film on the actinic ray-sensitive or radiation-sensitive film using a composition for forming an upper layer film, a step for exposing a laminate film including the actinic ray-sensitive or radiation-sensitive film and the upper layer film, and a step for developing the exposed laminate film using a developer including an organic solvent. The composition for forming an upper layer film contains a resin (XA), a resin (XB) containing fluorine atoms, a basic compound (XC), and a solvent (XD), and the resin (XA) is a resin not containing fluorine atoms, or in a case where the resin (XA) contains fluorine atoms, the resin (XA) is a resin having a lower content of fluorine atoms than that in the resin (XB), based on a mass.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: February 15, 2022
    Assignee: FUJIFILM Corporation
    Inventors: Naoki Inoue, Naohiro Tango, Michihiro Shirakawa, Akiyoshi Goto
  • Publication number: 20210318616
    Abstract: According to the present invention, an actinic ray-sensitive or radiation-sensitive resin composition including a resin P having a repeating unit represented by General Formula (P1) and a compound that generates an acid having a pKa of ?1.40 or more upon irradiation with actinic rays or radiation; and a resist film, a pattern forming method, and a method for manufacturing an electronic device, each using the composition, are provided. Mp represents a single bond or a divalent linking group. Lp represents a divalent linking group. Xp represents O, S, or NRN1. RN1 represents a hydrogen atom or a monovalent organic group. Rp represents a monovalent organic group.
    Type: Application
    Filed: June 11, 2021
    Publication date: October 14, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Daisuke ASAKAWA, Takashi KAWASHIMA, Akiyoshi GOTO, Michihiro SHIRAKAWA, Kei YAMAMOTO
  • Publication number: 20210286263
    Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes a resin A having polarity that increases by an action of an acid; one or more resins B selected from the group consisting of a resin B1 including a fluorine atom and having polarity that increases by the action of an acid, a resin B2 including a fluorine atom and having polarity that increases by the action of an alkali, and a resin B3 including a fluorine atom and having polarity that increases by any of an action of an acid and an action of an alkali; and a compound that generates an acid upon irradiation with actinic rays or radiation, in which the compound that generates an acid upon irradiation with actinic rays or radiation includes one or more selected from the group consisting of a compound (I) to a compound (III), provided that the resin B1 to the resin B3 include no repeating unit including an ion-bonding group.
    Type: Application
    Filed: May 14, 2021
    Publication date: September 16, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Naohiro TANGO, Masafumi KOJIMA, Minoru UEMURA, Akiyoshi GOTO, Michihiro SHIRAKAWA, Kei YAMAMOTO
  • Publication number: 20210286264
    Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes a resin and a compound that generates an acid upon irradiation with actinic rays or radiation, in which an A value determined by Formula (1) is 0.130 or more, and the compound that generates an acid upon irradiation with actinic rays or radiation includes one or more selected from the group consisting of a compound (I) to a compound (III).
    Type: Application
    Filed: May 17, 2021
    Publication date: September 16, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Akihiro Kaneko, Masafumi Kojima, Minoru Uemura, Akiyoshi Goto, Michihiro Shirakawa
  • Publication number: 20210200098
    Abstract: A pattern forming method includes: preparing a laminate having a substrate, an inorganic base layer, and a resist layer; exposing the resist layer; and developing the laminate using a developer including an organic solvent to form a negative tone pattern, in which a surface energy ?A of the resist layer and a surface energy ?B of the inorganic base layer after irradiation of the laminate with ultraviolet rays having a wavelength of 13.5 nm from the resist layer side with an integrated light quantity of 40 mJ/cm2, followed by heating of the laminate at 110° C. for 60 seconds are 60 mJ/m2 or more and 55 mJ/m2 or more, respectively, and a difference ?AB in surface energies that is defined by Formula (A) is 5.0 mJ/m2 or less: ?AB=?A??B (Formula (A)).
    Type: Application
    Filed: March 15, 2021
    Publication date: July 1, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Wataru NIHASHI, Michihiro SHIRAKAWA
  • Publication number: 20210011377
    Abstract: A photosensitive composition for EUV light includes a predetermined resin and a photoacid generator, or includes a predetermined resin having a repeating unit having a photoacid generating group, and satisfies Requirements 1 to 3, Requirement 1: The A value determined by Formula (1) is 0.14 or more, A=([H]×0.04+[C]×1.0+[N]×2.1+[0]×3.6+[F]×5.6+[S]×1.5+[I]×39.5)/([H]×1+[C]×12+[N]×14+[0]×16+[F]×19+[S]×32+[I]×127)??Formula (1): Requirement 2: The concentration of solid contents in the photosensitive composition for EUV light is 5.0% by mass or less, Requirement 3: The content of the photoacid generator is 5% to 50% by mass with respect to the total solid content in the photosensitive composition for EUV light.
    Type: Application
    Filed: September 29, 2020
    Publication date: January 14, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Michihiro SHIRAKAWA, Hajime FURUTANI, Hironori OKA
  • Publication number: 20210011380
    Abstract: The present invention provides a negative tone photosensitive composition for EUV light, capable of forming a pattern, in which occurrence of missing defects is suppressed and pattern collapse is suppressed. The present invention also provides a pattern forming method and a method for manufacturing an electronic device. The negative tone photosensitive composition for EUV light of an embodiment of the present invention includes a resin A having a repeating unit having an acid-decomposable group with a polar group being protected with a protective group that is eliminated by the action of an acid, and a photoacid generator, in which a ClogP value of the resin after elimination of the protective group from the resin A is 1.4 or less, a value x calculated by Expression (1) is 1.2 or more, and the value x calculated by Expression (1) and a value y calculated by Expression (2) satisfy a relationship of Expression (3).
    Type: Application
    Filed: September 29, 2020
    Publication date: January 14, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Wataru NIHASHI, Michihiro SHIRAKAWA, Michihiro OGAWA
  • Publication number: 20200401045
    Abstract: An object of the present invention is to provide an actinic ray-sensitive or radiation-sensitive resin composition which is capable of forming a pattern having an excellent pattern line width roughness (LWR). In addition, another object of the present invention is to provide: a resist film, a pattern forming method, and a method for manufacturing an electronic device, each of which uses the actinic ray-sensitive or radiation-sensitive resin composition.
    Type: Application
    Filed: August 25, 2020
    Publication date: December 24, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Daisuke ASAKAWA, Hironori OKA, Kyohei SAKITA, Michihiro SHIRAKAWA, Akiyoshi GOTO
  • Publication number: 20200393756
    Abstract: The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition with which a pattern having an excellent pattern collapse suppressing property and excellent LWR performance can be obtained. In addition, the present invention also provides a resist film, a pattern forming method, and a method for manufacturing an electronic device, each regarding the actinic ray-sensitive or radiation-sensitive resin composition. The actinic ray-sensitive or radiation-sensitive resin composition of the present invention includes a resin whose solubility in a developer is changed by the action of an acid, a photoacid generator represented by General Formula (b1), and a solvent, in which the photoacid generator represented by General Formula (b1) is a compound that generates an acid having a pka of 1.
    Type: Application
    Filed: August 26, 2020
    Publication date: December 17, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Keita KATO, Michihiro SHIRAKAWA, Akiyoshi GOTO, Takashi KAWASHIMA, Masafumi KOJIMA
  • Patent number: 10859914
    Abstract: A method for producing an electronic device includes the pattern forming method, and an actinic ray-sensitive or radiation-sensitive resin composition for organic solvent development. Specifically, provided is a pattern forming method, including a film forming step of forming a film by an actinic ray-sensitive or radiation-sensitive resin composition, an exposure step of irradiating the film, and a development step of developing the film using a developer containing an organic solvent, in which the composition contains a resin containing a repeating unit having an Si atom and a repeating unit having an acid-decomposable group and a compound capable of generating an acid upon irradiation with actinic rays or radiation, the content of Si atoms in the resin is 1.0 to 30 mass %, and the content of the resin in the total solid content of the composition is 20 mass % or more.
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: December 8, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Naoya Hatakeyama, Akiyoshi Goto, Michihiro Shirakawa, Keita Kato, Keiyu Ou
  • Patent number: 10852637
    Abstract: Provided are a pattern forming method including a step of applying a composition for forming an upper layer film, containing a resin having a C log P(Poly) of 3.0 or more and at least one compound selected from the group consisting of (A1) to (A4) described in the specification onto a resist film to form an upper layer film, a step of exposing the resist film, and a step of developing the exposed resist film with a developer including an organic solvent; a resist pattern formed by the pattern forming method; a method for manufacturing an electronic device, including the pattern forming method; and the composition for forming an upper layer film.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: December 1, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Naoki Inoue, Naohiro Tango, Kei Yamamoto, Michihiro Shirakawa, Akiyoshi Goto
  • Patent number: 10802399
    Abstract: The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition which is capable of forming a pattern having a low LWR and is further suppressed in the collapse of the formed pattern, a resist film, a pattern forming method, and a method for manufacturing an electronic device. The actinic ray-sensitive or radiation-sensitive resin composition of the present invention contains a photoacid generator represented by General Formula (1) or a resin having a residue obtained by removing one hydrogen atom from the photoacid generator represented by General Formula (1).
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: October 13, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Ryo Nishio, Masafumi Kojima, Akiyoshi Goto, Tomotaka Tsuchimura, Michihiro Shirakawa, Keita Kato
  • Publication number: 20200319551
    Abstract: The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition that can provide a resist film with excellent sensitivity and a pattern with excellent LER performance, and can suppress pattern collapse during pattern formation. In addition, the present invention also provides a resist film, a pattern forming method, a mask blank with a resist film, a method for producing a photomask, and a method for manufacturing an electronic device, each using the actinic ray-sensitive or radiation-sensitive resin composition.
    Type: Application
    Filed: June 18, 2020
    Publication date: October 8, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Tomotaka Tsuchimura, Takashi Kawashima, Akihiro Kaneko, Michihiro Ogawa, Michihiro Shirakawa, Hajime Furutani, Kyohei Sakita
  • Patent number: 10761424
    Abstract: The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition which is capable of forming a pattern having a low LWR and is further suppressed in the collapse of the formed pattern, a resist film, a pattern forming method, and a method for manufacturing an electronic device. The actinic ray-sensitive or radiation-sensitive resin composition of the present invention contains a photoacid generator represented by General Formula (1) or a resin having a residue obtained by removing one hydrogen atom from the photoacid generator represented by General Formula (1).
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: September 1, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Ryo Nishio, Masafumi Kojima, Akiyoshi Goto, Tomotaka Tsuchimura, Michihiro Shirakawa, Keita Kato
  • Publication number: 20200192220
    Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes a resin having a repeating unit having a group in which a phenolic hydroxyl group is protected with an acid-leaving group; a first photoacid generator that generates an acid having a pKa of ?2.00 to 2.00, in which in a case where the acid thus generated is a carboxylic acid, a pKa of the carboxylic acid is ?2.00 or more and less than 1.00; and a second photoacid generator that generates a carboxylic acid having a pKa of 1.00 or more.
    Type: Application
    Filed: February 21, 2020
    Publication date: June 18, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Kazunari YAGI, Takashi KAWASHIMA, Tomotaka TSUCHIMURA, Hajime FURUTANI, Michihiro SHIRAKAWA
  • Patent number: 10578968
    Abstract: The present invention has an object to provide a pattern forming method capable of providing good DOF and EL, a resist pattern formed by the pattern forming method, and a method for manufacturing an electronic device, including the pattern forming method. The pattern forming method of the present invention includes a step a of coating an active-light-sensitive or radiation-sensitive resin composition onto a substrate to form a resist film, a step b of coating a composition for forming an upper layer film onto the resist film to form an upper layer film on the resist film, a step c of exposing the resist film having the upper layer film formed thereon, and a step d of developing the exposed resist film using a developer to form a pattern, in which the active-light-sensitive or radiation-sensitive resin composition contains a hydrophobic resin.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: March 3, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Kei Yamamoto, Naohiro Tango, Naoki Inoue, Michihiro Shirakawa, Akiyoshi Goto
  • Publication number: 20200050106
    Abstract: A photosensitive composition for EUV light includes a predetermined resin and a photoacid generator, or includes a predetermined resin having a repeating unit having a photoacid generating group, and satisfies Conditions 1 and 2, Condition 1: The A value determined by Formula (1) is 0.14 or more, A=([H]×0.04+[C]×1.0+[N]×2.1+[O]×3.6+[F]×5.6+[S]×1.5+[I]×39.5)/([H]×1+[C]×12+[N]×14+[O]×16+[F]×19+[S]×32+[I]×127)??Formula (1): Condition 2: The concentration of the solid content in the photosensitive composition for EUV light is 2.5% by mass or less.
    Type: Application
    Filed: October 17, 2019
    Publication date: February 13, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Michihiro SHIRAKAWA, Hajime FURUTANI, Mitsuhiro FUJITA, Tomotaka TSUCHIMURA, Takashi KAWASHIMA, Michihiro OGAWA, Akihiro KANEKO, Hironori OKA, Yasuharu SHIRAISHI
  • Publication number: 20190258168
    Abstract: An object of the present invention is to provide a treatment liquid for patterning a resist film and a pattern forming method, each of which can accomplish suppression of generation of defects on a pattern and reduction in bridge defects of the pattern at the same time. The pattern forming method of an embodiment of the present invention is a pattern forming method by forming a resist film on a substrate using a resist composition including at least a resin whose polarity increases by the action of an acid, a photoacid generator, and a solvent, exposing the resist film, and then treating the exposed resist film with a treatment liquid to form a pattern, in which the treatment liquid includes two or more organic solvents, a boiling point of at least one organic solvent of the two or more organic solvents is 120° C. to 155° C., a content of the organic solvent having a boiling point of 120° C. to 155° C.
    Type: Application
    Filed: April 29, 2019
    Publication date: August 22, 2019
    Applicant: FUJIFILM Corporation
    Inventors: Tetsuya KAMIMURA, Michihiro SHIRAKAWA, Tadashi OOMATSU