Patents by Inventor Michihiro Shirakawa

Michihiro Shirakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160349613
    Abstract: The actinic ray-sensitive or radiation-sensitive resin composition of the present invention contains a resin (P) including a repeating unit (i) having a group represented by the following General Formula (1), and a compound which generates an acid by irradiation with actinic ray or radiation, represented by a specific formula, a pattern forming method using the composition, a method for manufacturing an electronic device, and an electronic device.
    Type: Application
    Filed: August 9, 2016
    Publication date: December 1, 2016
    Applicant: FUJIFILM Corporation
    Inventors: Akiyoshi GOTO, Masafumi KOJIMA, Michihiro SHIRAKAWA, Keita KATO
  • Publication number: 20160347897
    Abstract: The actinic ray-sensitive or radiation-sensitive resin composition of the present invention contains a resin (P) including a repeating unit (i) having a group which decomposes by the action of an acid represented by the following General Formula (1), a pattern forming method using the composition, a method for manufacturing an electronic device, and an electronic device.
    Type: Application
    Filed: August 11, 2016
    Publication date: December 1, 2016
    Applicant: FUJIFILM Corporation
    Inventors: Akiyoshi GOTO, Masafumi KOJIMA, Michihiro SHIRAKAWA, Keita KATO, Keiyu OU
  • Publication number: 20160342083
    Abstract: A pattern formation method includes step (i) of forming a first negative type pattern on a substrate by performing step (i-1) of forming a first film on the substrate using an actinic ray-sensitive or radiation-sensitive resin composition, step (i-2) of exposing the first film and step (i-3) of developing the exposed first film in this order; step (iii) of forming a second film at least on the first negative type pattern using an actinic ray-sensitive or radiation-sensitive resin composition (2); step (v) of exposing the second film; and step (vi) of developing the exposed second film and forming a second negative type pattern at least on the first negative type pattern.
    Type: Application
    Filed: August 5, 2016
    Publication date: November 24, 2016
    Applicant: FUJIFILM Corporation
    Inventors: Ryosuke UEBA, Naoya IGUCHI, Tsukasa YAMANAKA, Naohiro TANGO, Michihiro SHIRAKAWA, Keita KATO
  • Publication number: 20160327866
    Abstract: A pattern forming method includes, in this order: a step (1) of forming a film on a substrate by using an actinic ray-sensitive or radiation-sensitive resin composition containing at least a resin having a group that is decomposed due to an action of an acid so as to generate a polar group; a step (2) of exposing the film; a step (3) of causing the exposed film to come into contact with a component that performs any one interaction of an ionic bond, a hydrogen bond, a chemical bond, and a dipole interaction with a polar group generated in the exposed film without substantially dissolving the exposed film; and a step (4) of forming a pattern by developing the exposed film by using a developer including an organic solvent and removing an area of the film having a small exposure amount.
    Type: Application
    Filed: July 22, 2016
    Publication date: November 10, 2016
    Applicant: FUJIFILM Corporation
    Inventors: Hajime FURUTANI, Michihiro SHIRAKAWA, Akiyoshi GOTO, Masafumi KOJIMA
  • Patent number: 9482947
    Abstract: A pattern forming method, includes: (i) a step of forming a film from an actinic ray-sensitive or radiation-sensitive resin composition containing (P) a resin having (a1) a repeating unit capable of decomposing by an action of an acid to produce a carboxyl group, represented by the following formula (I) as defined in the specification and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (ii) a step of exposing the film; and (iii) a step of performing a development by using a developer containing an organic solvent to form a negative pattern.
    Type: Grant
    Filed: September 24, 2013
    Date of Patent: November 1, 2016
    Assignee: FUJIFILM Corporation
    Inventors: Shuhei Yamaguchi, Hidenori Takahashi, Michihiro Shirakawa, Shohei Kataoka, Shoichi Saitoh, Fumihiro Yoshino
  • Publication number: 20160313645
    Abstract: The present invention relates to a pattern forming method including: forming a film using an actinic ray-sensitive or radiation-sensitive resin composition that includes a (A) resin which has an increase in the polarity by the action of an acid, and thus, has a decrease in the solubility in a developer containing an organic solvent, a (B) compound capable of generating an acid upon irradiation with specific actinic ray or radiation, and a (C) solvent, exposing the film, and developing the exposed film using a developer including an organic solvent, in which the resin (A) has a structure in which a polar group is protected with a leaving group which decomposes to leave by the action of an acid, and the leaving group is a group represented by the following General Formula (I).
    Type: Application
    Filed: July 1, 2016
    Publication date: October 27, 2016
    Applicant: FUJIFILM Corporation
    Inventors: Keita KATO, Keiyu OU, Michihiro SHIRAKAWA, Akiyoshi GOTO, Masafumi KOJIMA
  • Patent number: 9423689
    Abstract: A pattern forming method, includes: (i) a step of forming a film from an actinic ray-sensitive or radiation-sensitive resin composition containing (P) a resin having (a1) a repeating unit represented by the following formula (I) or (II) as defined in the specification in an amount of 20 mol % or more based on all repeating units in the resin (P) and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (ii) a step of exposing the film, so as to form an exposed film; and (iii) a step of developing the exposed film by using a developer containing an organic solvent to form a negative pattern.
    Type: Grant
    Filed: January 27, 2014
    Date of Patent: August 23, 2016
    Assignee: FUJIFILM Corporation
    Inventors: Shuhei Yamaguchi, Hidenori Takahashi, Michihiro Shirakawa, Fumihiro Yoshino
  • Patent number: 9417528
    Abstract: A pattern forming method contains: (i) a step of forming a first film on a substrate by using a first resin composition (I), (ii) a step of forming a second film on the first film by using a second resin composition (II) different from the resin composition (I), (iii) a step of exposing a multi-layered film having the first film and the second film, and (iv) a step of developing the first film and the second film in the exposed multi-layered film by using an organic solvent-containing developer to form a negative pattern.
    Type: Grant
    Filed: May 15, 2015
    Date of Patent: August 16, 2016
    Assignee: FUJIFILM Corporation
    Inventors: Michihiro Shirakawa, Keita Kato, Tadahiro Odani, Atsushi Nakamura, Hidenori Takahashi, Kaoru Iwato
  • Publication number: 20160223905
    Abstract: This active light-sensitive or radiation-sensitive resin composition contains a resin (A), a compound (B) capable of generating an acid upon irradiation with active light or radiation, and a compound (C) having at least one oxygen atom. The compound (C) does not include the resin (A) and the compound (B).
    Type: Application
    Filed: April 7, 2016
    Publication date: August 4, 2016
    Applicant: FUJIFILM Corporation
    Inventors: Keiyu OU, Keita KATO, Michihiro SHIRAKAWA, Akiyoshi GOTO, Sou KAMIMURA
  • Publication number: 20160195814
    Abstract: There is provided a pattern formation method comprising: a step (1) of forming a film using an actinic ray-sensitive or radiation-sensitive resin composition which contains a resin of which, due to a polarity being increased by an action of an acid, solubility decreases with respect to a developer which includes an organic solvent; a step (2) of exposing the film to an actinic ray or radiation; a step (3) of forming a target process pattern by developing the film using a developer which includes an organic solvent; and a step (4) of obtaining a processed pattern by applying a processing agent which includes a compound (x) which has at least one of a primary amino group and a secondary amino group with respect to the target process pattern.
    Type: Application
    Filed: March 14, 2016
    Publication date: July 7, 2016
    Applicant: FUJIFILM Corporation
    Inventors: Yuichiro ENOMOTO, Ryosuke UEBA, Michihiro SHIRAKAWA, Hajime FURUTANI, Akiyoshi GOTO, Masafumi KOJIMA
  • Patent number: 9316910
    Abstract: Provided is a pattern forming method that is excellent in roughness performance such as line width roughness and exposure latitude, and an actinic-ray-sensitive or radiation-sensitive resin composition and a resist film used for the pattern forming method. The pattern forming method includes (1) forming a film using an actinic-ray-sensitive or radiation-sensitive resin composition containing a resin that includes 65 mol % or more of a repeating unit having a group which generates a polar group by being degraded by the action of an acid based on all repeating units in the resin and at least one kind of repeating unit represented by the following General Formula (I) or (II), (2) exposing the film, and (3) developing the exposed film using a developer that contains an organic solvent.
    Type: Grant
    Filed: February 27, 2012
    Date of Patent: April 19, 2016
    Assignee: FUJIFILM Corporation
    Inventors: Shohei Kataoka, Hidenori Takahashi, Shuhei Yamaguchi, Shoichi Saitoh, Michihiro Shirakawa, Fumihiro Yoshino
  • Publication number: 20160070167
    Abstract: There is provided a pattern forming method comprising (i) a step of forming a film containing an actinic ray-sensitive or radiation-sensitive resin composition containing (A) a compound represented by the specific formula, (B) a compound different from the compound (A) and capable of generating an acid upon irradiation with an actinic ray or radiation, and (P) a resin that does not react with the acid generated from the compound (A) and is capable of decreasing the solubility for an organic solvent-containing developer by the action of the acid generated from the compound (B), (ii) a step of exposing the film, and (iii) a step of developing the exposed film by using an organic solvent-containing developer to form a negative pattern; the actinic ray-sensitive or radiation-sensitive resin composition above; a resist film using the composition.
    Type: Application
    Filed: August 31, 2015
    Publication date: March 10, 2016
    Applicant: FUJIFILM CORPORATION
    Inventors: Shohei KATAOKA, Akinori SHIBUYA, Toshiaki FUKUHARA, Hajime FURUTANI, Michihiro SHIRAKAWA
  • Publication number: 20160048082
    Abstract: A pattern-forming method includes forming a film on a substrate by using an actinic ray-sensitive or radiation-sensitive resin composition containing at least a resin that exhibits, due to an action of an acid, increase in polarity and decrease in solubility with respect to a developer including an organic solvent, and a compound that generates an acid by being irradiated with actinic rays or radiation; exposing the film; and forming a negative tone pattern by developing the exposed film with a developer including an organic solvent, in which the developer includes at least one compound A selected from the group consisting of an onium salt, a polymer having an onium salt, a nitrogen-containing compound including three or more nitrogen atoms, a basic polymer, and a phosphorus-based compound.
    Type: Application
    Filed: October 21, 2015
    Publication date: February 18, 2016
    Applicant: FUJIFILM CORPORATION
    Inventors: Masafumi KOJIMA, Akiyoshi GOTO, Michihiro SHIRAKAWA, Hajime FURUTANI, Akinori SHIBUYA
  • Patent number: 9250532
    Abstract: There is provided a pattern forming method comprising: (i) a step of forming a first film on a substrate by using a first resin composition (I), (ii) a step of forming a second film on the first film by using a second resin composition (II) different from the resin composition (I), (iii) a step of exposing a multi-layered film having the first film and the second film, and (iv) a step of developing the first film and the second film in the exposed multi-layered film by using an organic solvent-containing developer to form a negative pattern.
    Type: Grant
    Filed: December 27, 2013
    Date of Patent: February 2, 2016
    Assignee: FUJIFILM Corporation
    Inventors: Keita Kato, Michihiro Shirakawa, Tadahiro Odani, Atsushi Nakamura, Hidenori Takahashi, Kaoru Iwato
  • Publication number: 20160004157
    Abstract: A method of forming a pattern includes (a) forming a film of an actinic-ray- or radiation-sensitive resin composition, (b) exposing the film to light, and (c) developing the exposed film with a developer comprising an organic solvent to thereby form a negative pattern. The actinic-ray- or radiation-sensitive resin composition includes (A) a resin whose solubility in the developer comprising an organic solvent is lowered when acted on by an acid, which resin contains a repeating unit with any of lactone structures of general formula (1) below, and (B) a compound that when exposed to actinic rays or radiation, generates an acid.
    Type: Application
    Filed: September 14, 2015
    Publication date: January 7, 2016
    Applicant: FUJIFILM CORPORATION
    Inventors: Junichi ITO, Akinori SHIBUYA, Akiyoshi GOTO, Michihiro SHIRAKAWA, Kei YAMAMOTO, Fumihiro YOSHINO
  • Publication number: 20150331314
    Abstract: There is provided an actinic ray-sensitive or radiation-sensitive resin composition comprising: (A) a resin having a group capable of decomposing by an action of an acid to produce a polar group, (C1) a compound containing a group capable of generating a first acidic functional group upon irradiation with an actinic ray or radiation and a group capable of generating a second acidic functional group different from the first acidic functional group upon irradiation with an actinic ray or radiation, and (C2) at least one compound containing two or more groups selected from the group consisting of the groups capable of generating the structures represented by the specific formulae upon irradiation with an actinic ray or radiation.
    Type: Application
    Filed: July 29, 2015
    Publication date: November 19, 2015
    Applicant: FUJIFILM CORPORATION
    Inventors: Shuhei YAMAGUCHI, Takamitsu TOMIGA, Fumihiro YOSHINO, Hajime FURUTANI, Michihiro SHIRAKAWA, Mitsuhiro FUJITA
  • Patent number: 9140981
    Abstract: Provided are an actinic-ray-sensitive or a radiation-sensitive resin composition with greater residual film ratio and capable of suppressing pattern collapse and an occurrence of bridge defects after development, and a resist film, a pattern forming method, an electronic device manufacturing method, and an electronic device, each using the same. An actinic-ray-sensitive or radiation-sensitive resin composition includes a resin (P) having a repeating unit (a) represented by following General Formula (I), a compound (B) represented by any of following General Formulae (B-1) to (B-3), and a solvent, in General Formula (I), R0 represents a hydrogen atom or a methyl group, and R1, R2 and R3 each independently represent a straight chain or branched alkyl group.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: September 22, 2015
    Assignee: FUJIFILM Corporation
    Inventors: Kaoru Iwato, Hidenori Takahashi, Michihiro Shirakawa
  • Publication number: 20150253662
    Abstract: According to an exemplary embodiment of the present invention, there is provided an actinic ray-sensitive or radiation-sensitive resin composition includes an aromatic group and a resin (A) that may include (i) a repeating unit having a group capable of decomposing by the action of an acid to generate a polar group and (ii) a repeating unit having a polar group other than a phenolic hydroxyl group, wherein the total content of the repeating units (i) and (ii) is 51 mol % or more based on the entire repeating units in the resin (A).
    Type: Application
    Filed: May 26, 2015
    Publication date: September 10, 2015
    Applicant: FUJIFILM CORPORATION
    Inventors: Keita KATO, Michihiro SHIRAKAWA, Hidenori TAKAHASHI, Shoichi SAITOH, Fumihiro YOSHINO
  • Patent number: 9128376
    Abstract: A pattern forming method including: (i) forming a film using an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A) having a repeating unit having a group generating a polar group upon being decomposed by the action of an acid, and a repeating unit having an aromatic group, a compound (B) generating an acid upon irradiation with actinic rays or radiation, and a solvent (C); (ii) exposing the film; and (iii) developing the exposed film using a developer including an organic solvent to form a negative tone pattern, wherein the resin (A) is a resin having a repeating unit having a naphthyl group, and the like, and/or the actinic ray-sensitive or radiation-sensitive resin composition contains a compound (D) having a naphthalene ring, and the like.
    Type: Grant
    Filed: May 16, 2014
    Date of Patent: September 8, 2015
    Assignee: FUJIFILM Corporation
    Inventors: Keita Kato, Michihiro Shirakawa, Hidenori Takahashi, Sou Kamimura
  • Publication number: 20150248056
    Abstract: A pattern forming method contains: (i) a step of forming a first film on a substrate by using a first resin composition (I), (ii) a step of forming a second film on the first film by using a second resin composition (II) different from the resin composition (I), (iii) a step of exposing a multi-layered film having the first film and the second film, and (iv) a step of developing the first film and the second film in the exposed multi-layered film by using an organic solvent-containing developer to form a negative pattern.
    Type: Application
    Filed: May 15, 2015
    Publication date: September 3, 2015
    Applicant: FUJIFILM CORPORATION
    Inventors: Michihiro SHIRAKAWA, Keita KATO, Tadahiro ODANI, Atsushi NAKAMURA, Hidenori TAKAHASHI, Kaoru IWATO