Abstract: A multilayer printed wiring board including insulating layers, conductor layers stacked alternately over the insulating layers, respectively, and viaholes formed in the insulation layers and electrically connecting the conductor layers through the insulation layers. The viaholes include a first group of viaholes and a second group of viaholes. The viaholes in the first group are tapered toward the viaholes in the second group, and the viaholes in the second group are tapered toward the viaholes in the first group. The viaholes in the first group and the the viaholes in the second group are formed in the insulating layers, respectively, and the viaholes are formed by plating openings formed after lamination of respective ones of the insulating layers, and each of the insulating layers is about 100 ?m or less in thickness.

Abstract: A flex-rigid wiring board includes a first rigid substrate, a second rigid substrate arranged at a distance from the first rigid substrate to provide a space between the first and second rigid substrates and a flexible substrate. The flexible substrate includes a first tip portion connected to the first rigid substrate, and a second tip portion connected to the second rigid substrate such that the first and second rigid substrates are connected to each other by way of the flexible substrate. At least one bending portion is formed between the first and second tip portions of the flexible substrate, each of the at least one bending portions is provided in the space between the first and second rigid substrates.

Abstract: A method of forming a circuit board which includes generating laser light with a carbon dioxide laser and making a hole through an insulating substrate by irradiating the insulating substrate with the laser light. The hole includes a top opening in a top surface of the insulating substrate, a bottom opening in a bottom surface of the insulating substrate, and an inner wall extending from the top opening to the bottom opening along a thickness direction of the insulating substrate, the inner wall including a bulge which extends in a direction generally orthogonal to the thickness direction. A via hole is formed in the insulating substrate by providing metal in the hole such that the metal extends from the top opening to the bottom opening along the inner wall, and completely closes each of the top and bottom openings.

Abstract: A wiring board assembly and a method of making a wiring board assembly. The wiring board assembly includes a first wiring board having a first substrate, a non-pliable second substrate having a smaller mounting area than a mounting area of the first substrate and a base substrate laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate. At least one via formed in at least one of the first substrate or the second substrate. A second wiring board includes a pliable member connecting the first wiring board to the second wiring board.

Abstract: A printed wiring board includes a first substrate having a recess portion and multiple conductors, a second substrate having multiple conductors and inserted in the recess portion of the first substrate such that the first substrate has a surface exposing at least a portion of a surface of the second substrate. The multiple conductors in the first substrate is electrically connected to the multiple conductors in the second substrate, and the second substrate has density of the conductors which is higher than density of the conductors of the first substrate.

Abstract: A multilayered printed circuit board or a substrate for mounting a semiconductor device includes a semiconductor device, a first resin insulating layer accommodating the semiconductor device, a second resin insulating layer provided on the first resin insulating layer, a conductor circuit provided on the second resin insulating layer, and via holes for electrically connecting the semiconductor device to the conductor circuit, wherein the semiconductor device is accommodated in a recess provided in the first resin insulating layer, and a metal layer for placing the semiconductor device is provided on the bottom face of the recess. A multilayered printed circuit board in which the installed semiconductor device establishes electrical connection through the via holes is provided.

Abstract: A multilayer wiring board includes a multilayer wiring substrate having a concave portion which accommodates an electronic component. The multilayer wiring substrate has multiple insulation layers, multiple conductive circuits, multiple vias and an electromagnetic shielding layer. The conductive circuits are separated by the insulation layers and electrically connected through the vias. The electromagnetic shielding layer has a roughened surface and formed along one of a bottom surface and side surfaces of the concave portion in the multilayer wiring substrate.

Abstract: A multilayered printed circuit board or a substrate for mounting a semiconductor device includes a semiconductor device, a first resin insulating layer accommodating the semiconductor device, a second resin insulating layer provided on the first resin insulating layer, a conductor circuit provided on the second resin insulating layer, and via holes for electrically connecting the semiconductor device to the conductor circuit, wherein the semiconductor device is accommodated in a recess provided in the first resin insulating layer, and a metal layer for placing the semiconductor device is provided on the bottom face of the recess. A multilayered printed circuit board in which the installed semiconductor device establishes electrical connection through the via holes is provided.

Abstract: A method for manufacturing a flex-rigid wiring board including forming a rigid substrate including a rigid base material, a separator provided over the rigid base material, and insulation layers laminated over the rigid base material after the separator is provided, removing the separator together with a portion of the insulation layers after the laminating of the insulation layers, and forming a recessed portion configured to accommodate an electronic component according to a shape of the separator on a surface of the rigid substrate.

Abstract: A method for manufacturing a flex-rigid wiring board, including preparing a flexible wiring board having a flexible base material and having a conductive layer over the flexible base material, making a cut in the flexible wiring board to form a cut portion, and folding at least one portion of the flexible wiring board using the cut portion to form one or more folding portions such that the flexible wiring board is extended in length, and connecting the flexible wiring board to a rigid wiring board including a rigid base material and having a conductive layer over the rigid base material.

Abstract: A multilayered printed circuit board or a substrate for mounting a semiconductor device includes a semiconductor device, a first resin insulating layer accommodating the semiconductor device, a second resin insulating layer provided on the first resin insulating layer, a conductor circuit provided on the second resin insulating layer, and via holes for electrically connecting the semiconductor device to the conductor circuit, wherein the semiconductor device is accommodated in a recess provided in the first resin insulating layer, and a metal layer for placing the semiconductor device is provided on the bottom face of the recess. A multilayered printed circuit board in which the installed semiconductor device establishes electrical connection through the via holes is provided.

Abstract: A wiring board including a main substrate including a base material and having an opening portion, and a flex-rigid printed wiring board connected to the main substrate in the opening portion of the main substrate and including a rigid substrate and a flexible substrate, the rigid substrate including a non-flexible base material, the flexible substrate including a flexible base material.

Abstract: A wiring board has a base substrate, a conductive pattern formed on the base substrate, an insulation layer formed on the conductive pattern and the base substrate and including a resin-impregnated inorganic cloth, a conductive pattern formed on the insulating layer, a via formed in the insulation layer and connecting the conductive pattern formed on the base substrate and the conductive pattern formed on the insulating layer, and a through-hole connected to the conductive pattern formed on the base substrate, penetrating through the base substrate and having a hole diameter in a range of 10 ?m to 150 ?m.

Abstract: A method for manufacturing a multilayer printed wiring board including forming a multilayer printed wiring board structure comprising first and second buildup portions, the first buildup portion including insulating layers, conductor layers and first viaholes electrically connecting the conductor layers through the insulation layers such that the first viaholes are formed in the insulating layers, respectively, the second buildup portion including insulating layers, conductor layers and second viaholes electrically connecting the conductor layers through the insulation layers such that the first viaholes are tapered toward the second viaholes, and the second via holes are tapered toward the first viaholes. The viaholes are formed by plating openings formed after lamination of respective ones of the insulating layers of the buildup portions, and each insulating layer in the buildup portions is about 100 ?m or less in thickness.

Abstract: A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer covering the flexible board and the non-flexible substrate and exposing one or more portions of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer.

Abstract: A method for manufacturing a multilayered printed circuit board including forming a first insulating resin substrate having a metal layer substantially corresponding to dimensions of a semiconductor device, forming a second insulating resin substrate, forming a recess extending to the metal layer of the first insulating resin substrate such that a surface of the metal layer is exposed, accommodating the semiconductor device in the recess such that the semiconductor device is mounted on the surface of the metal layer, and forming a resin insulating layer on the first insulating resin substrate such that the semiconductor device accommodated in the recess is covered.

Abstract: A method for manufacturing a multilayered printed circuit board including forming a first insulating resin substrate having a metal layer substantially corresponding to dimensions of a semiconductor device, forming a second insulating resin substrate, forming a recess extending to the metal layer of the first insulating resin substrate such that a surface of the metal layer is exposed, accommodating the semiconductor device in the recess such that the semiconductor device is mounted on the surface of the metal layer, and forming a resin insulating layer on the first insulating resin substrate such that the semiconductor device accommodated in the recess is covered.

Abstract: A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer covering the flexible board and the non-flexible substrate and exposing one or more portions of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer.

Abstract: A method of manufacturing a wiring board including forming a first wiring board, the forming of the first board including forming a substrate, forming a first insulation layer on a surface of the substrate and a second insulating layer on the opposite surface of the substrate, forming a via in one of the layers, and cutting the first layer in a first area and cutting the second layer in a second area offset from the first area to form a first substrate laminated to a second substrate with the substrate interposed therebetween, the second substrate having a smaller mounting area than that of the first substrate such that the first substrate extends beyond edge of the second substrate, connecting a pliable member to the substrate, and connecting the member to a second wiring board to connect the first and second boards. One or more insulation layers are a non-pliable layer.

Abstract: A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer covering the flexible board and the non-flexible substrate and exposing one or more portions of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer.