Abstract: A method of forming an electronic component includes laminating ceramic green sheets on a support film to obtain a ceramic green sheet laminate, forming through holes through the ceramic green sheet laminate at positions where via hole electrodes are to be located, applying conductive material into the through holes so as to fill the through holes and so as to be located on the upper surface of the ceramic green sheet laminate to form via hole electrodes, and sintering the ceramic green sheet laminate to form a substrate and so as to form protruding portions of the via hole electrodes which protrude upward from the upper surface of the substrate.

Abstract: An electronic component has a substantially reduced size and is adapted to be produced at low costs without variation in superior quality of the component because of the ease of achieving electrical connection between a piezoelectric element and a electrode pattern on a substrate supporting the piezoelectric element. The piezoelectric element has a lower electrode formed on the lower surface thereof and an upper electrode formed on the upper surface thereof. The piezoelectric element is fixed to the substrate such that the lower electrode is bonded to an electrode provided on the substrate by a conductive adhesive. A conductive wire is fixed to the upper electrode of the piezoelectric element. A metallic cap is bonded to the substrate so as to cover and seal the piezoelectric element on the substrate. The cap is contacted at its inner surface by the wire, whereby an electrical connection is achieved between the cap and the upper electrode of the piezoelectric element.

Abstract: An electronic component includes a package member; a via hole electrode extending through the package member and protruding from a first surface of the package member; an electronic component located on the first surface of the package member with a space located between the package member and the electronic component. The space between the electronic component and the first surface of the package member is provided by a protruding portion of the via hole electrode which extends from the surface of the package member and a joining member joining the electronic component with the via hole electrode.

Abstract: An electronic component includes a package member; a via hole electrode extending through the package member and protruding from a first surface of the package member; an electronic component located on the first surface of the package member with a space located between the package member and the electronic component. The space between the electronic component and the first surface of the package member is provided by a protruding portion of the via hole electrode which extends from the surface of the package member and a joining member joining the electronic component with the via hole electrode.

Abstract: A method for applying a sealant to a component, in which the sealant is applied to a part of or the entirety of a sealing surface of the component, comprises the steps of: disposing in the sealant, an abutting member approximately in parallel to a surface of the sealant, which is a liquid, formed into a film of a specified thickness; pressing the sealing surface of the component to the abutting member in the sealant formed into the film; and transferring the sealant to the sealing surface of the component by pulling the component apart from the sealant.

Abstract: An electronic component has a substantially reduced size and is adapted to be produced at low costs without variation in superior quality of the component because of the ease of achieving electrical connection between a piezoelectric element and a electrode pattern on a substrate supporting the piezoelectric element. The piezoelectric element has a lower electrode formed on the lower surface thereof and an upper electrode formed on the upper surface thereof. The piezoelectric element is fixed to the substrate such that the lower electrode is bonded to an electrode provided on the substrate by a conductive adhesive. A conductive wire is fixed to the upper electrode of the piezoelectric element. A metallic cap is bonded to the substrate so as to cover and seal the piezoelectric element on the substrate. The cap is contacted at its inner surface by the wire, whereby an electrical connection is achieved between the cap and the upper electrode of the piezoelectric element.

Abstract: A sealing structure and a sealing method for an electronic component achieves desired sealing properties and heat resistance. An electronic component element is mounted on a substrate having an electrode pattern disposed thereon, and is sealed by bonding a cap for covering the electronic component element on the substrate. An adhesive structure used to join the cap on the substrate includes a high-glass-transition-point adhesive partially coated on the cap bonded portion of the substrate, and a low-glass-transition-point adhesive coated over an entire periphery of the opening of the cap. The opening of the cap is pressed on a mounting portion of the substrate, and the adhesives are then cured to bond and seal the substrate and the cap.

Abstract: A sealing structure and a sealing method for an electronic component achieves desired sealing properties and heat resistance. An electronic component element is mounted on a substrate having an electrode pattern disposed thereon, and is sealed by bonding a cap for covering the electronic component element on the substrate. An adhesive structure used to join the cap on the substrate includes a high-glass-transition-point adhesive partially coated on the cap bonded portion of the substrate, and a low-glass-transition-point adhesive coated over an entire periphery of the opening of the cap. The opening of the cap is pressed on a mounting portion of the substrate, and the adhesives are then cured to bond and seal the substrate and the cap.

Abstract: An electronic component has a substantially reduced size and is adapted to be produced at low costs without variation in superior quality of the component because of the ease of achieving electrical connection between a piezoelectric element and a electrode pattern on a substrate supporting the piezoelectric element. The piezoelectric element has a lower electrode formed on the lower surface thereof and an upper electrode formed on the upper surface thereof. The piezoelectric element is fixed to the substrate such that the lower electrode is bonded to an electrode provided on the substrate by a conductive adhesive. A conductive wire is fixed to the upper electrode of the piezoelectric element. A metallic cap is bonded to the substrate so as to cover and seal the piezoelectric element on the substrate. The cap is contacted at its inner surface by the wire, whereby an electrical connection is achieved between the cap and the upper electrode of the piezoelectric element.

Abstract: An electronic component suppresses stray capacitance and exhibits a high electromagnetic shielding effect, and eliminates flowing of a conductive agent into inappropriate areas and occurrence of a poor electrical connection. Electronic-component devices are mounted on an insulating substrate having input and output electrodes and a ground electrode. Then, a metallic cap is bonded and sealed onto the substrate via an insulating layer having holes formed therein so as to cover the electronic-component devices. A conductive layer connected to the ground electrode is disposed on part of the cap-mounting portion of the substrate and positioned at a level higher than the insulating layer so that the metallic cap is electrically connected via the conductive layer to the ground electrode.

Abstract: An electronic component suppresses stray capacitance and exhibits a high electromagnetic shielding effect, and eliminates flowing of a conductive agent into inappropriate areas and occurrence of a poor electrical connection. Electronic-component devices are mounted on an insulating substrate having input and output electrodes and a ground electrode. Then, a metallic cap is bonded and sealed onto the substrate via an insulating layer to cover the electronic-component devices. A conductive layer connected to the ground electrode is disposed on part of the cap-mounting portion of the substrate and positioned at a level higher than the insulating layer so that the metallic cap is electrically connected via the conductive layer to the ground electrode.

Abstract: The present invention relates to capacitors utilizing an electric double layer formed in the interface of polarizable electrodes and an electrolyte. By using as the primary material of the polarizable electrodes an activated carbon in which the difference in titration value between the cases where sodium carbonate is used for neutralization titration of the activated carbon and where sodium hydrogencarbonate is used therefor is 0.195 meq/g or more to the weight of the activated carbon, the quantity of presence of the acidic functional group II (carboxyl group present as lactone) on the surface of the activated carbon is increased and, as a result, the affinity between the polarizable electrodes and the electrolyte is enhanced, thus providing electric double-layer capacitors low in variation with time and yet large in capacity.

Abstract: An electric double-layer capacitor has at least one or two elements. Each element includes a charge storage part, a pair of collectors arranged to hold the charge storage part, and a gasket enclosing the charge storage part and being arranged between the collectors to be thermally adhered to the collectors. Each collector is formed from a conductive polyethylene sheet which is provided with conductivity by a carbon material and has a multi-layer structure including polyethylene materials of different density levels.

Abstract: An electric double-layer capacitor comprises a gasket encircling a pair of polarizable electrodes provided on opposite sides of a separator, and a pair of collectors provided on outer sides of the polarizable electrodes and sealed to the gasket. The gasket is formed of a base of vulcanized rubber and resin layers obtained by fusion-welding polyolefin resin on both surfaces of the base, and the collectors are heat-sealed to the gasket.

Abstract: An electric double layer capacitor comprises a pair of insulating gaskets having through-holes which are superposed and on opposite sides of a separator, and polarizable electrodes received in the through-holes. The method comprises steps of applying adhesive to a surface region of an insulating gasket enclosing a through-hole thereof, adhering a separator sheet to the gasket by the adhesive, and cutting the separator sheet in a portion outside the inner peripheral edge of the region applied with the adhesive to enclose the through-hole, thereby to obtain a separator integrated with the gasket.

Abstract: A molded carbonaceous material which is a molded mixture comprising a carbonaceous powder and a binder, particles of said carbonaceous powder particles being bound together by means of said binder with the surface of said carbonaceous powder being not wholly covered with said binder.

Abstract: An electric double layer capacitor which comprises a separator of electrically insulative material having ion permeability and polarizable electrodes of solid carbonaceous material being opposite to each other through the separator, which are sealed in a case. The separator and at least one of the polarizable electrodes are adhered or stuck to each other by adhesive or cohesive layers partially in a region in which the said polarizable electrode faces the separator.

Abstract: A method of manufacturing an electrolytic double-layer capacitor comprises steps of forming a laminated intermediate member in which an insulating gasket defines a central space containing a carbonaceous compact having a recess portion; and the insulating gasket is interposed between a separator, having a region provided with no liquid column of an electrolytic solution in a position corresponding to the recess portion, and a conductive sheet; and dripping the electrolytic solution from above the above mentioned region of the separator and then deforming the conductive sheet by negative pressure so as to cause the electrolytic solution to impregnate the compact.