Abstract: The pressure-sensitive adhesive layer forming organopolysiloxane composition of this disclosure is hydrosilylation reaction curable, wherein 1 mass % or more of a resin component is (b2) an organopolysiloxane resin having a weight average molecular weight (Mw) as measured in terms of standard polystyrene by GPC using toluene that is less than 4000, and the value obtained by dividing Tg+120(° C.) of the pressure-sensitive adhesive layer obtained by curing by Tg?+120(° C.) of the composition (pressure-sensitive adhesive layer), in which component (b2) is substituted by a resin with Mw 4000 or higher is less than 1.0. When used as a pressure-sensitive adhesive layer and when a specific resin component/polymer component ratio is selected to achieve a pressure-sensitive adhesive strength, the glass transition temperature (Tg) of the pressure-sensitive adhesive layer can be further reduced, resulting in a strong pressure-sensitive adhesive force and a low Tg at the same time.

Abstract: A curing-reactive organopolysiloxane composition is provided. The composition generally forms a pressure-sensitive adhesive layer which is curable by a hydrosilylation reaction, has excellent adhesiveness and handleability, and is capable of maintaining high transparency over an extended period of time without developing problems such as discoloration or coloration, even when subjected to long-term aging at a high temperature and even when exposed to high-energy rays such as UV rays over an extended period of time. The curing-reactive organopolysiloxane composition can be cured via hydrosilylation reaction. A content of platinum-based metal among a solid content is in the range of from 0.1 to 50 ppm. An adhesive force of a cured layer with a thickness of 50 ?m obtained by curing the composition is not less than 0.02N/25 mm. A pressure-sensitive adhesive layer obtained by curing the composition, and an electronic part or a display device using the same, are also provided.

Abstract: A method for producing a silicone-based adhesive is disclosed. The method comprises: (1) applying a silicone composition (I) to one surface of a peelable substrate, and then forming a silicone layer (I) by curing or drying the silicone composition (I); and (2) applying a silicone composition (II) to a surface of the silicone layer (I), and then forming the silicone-based adhesive by curing the silicone composition (II). The silicone composition (I) contains a silicone resin. The silicone composition (II) either does not contain the silicone resin or if contained, its content amount is lower than that in the silicone composition (I). The method is useful for producing a silicone-based adhesive with low peel resistance from a peelable substrate even with a low modulus.

Abstract: A photocurable liquid silicone composition, having a low viscosity that facilitates injection into a small gap, having a refractive index (pre-cure) that is high not only in a visible region but also in an infrared region, and that is particularly useful as a material for a device using an infrared LED light source, is provided. The composition comprises: (A): (A1) an organosilane or organopolysiloxane having 1 to 5 silicon atoms, having an alkenyl group, and having at least one monovalent functional group selected from aromatic groups and aralkyl groups, and/or (A2) an organopolysiloxane having 2 to 5 silicon atoms, having an alkenyl group, and not having a monovalent functional group selected from aromatic groups and aralkyl groups; (C) a compound having at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation reaction catalyst. Pre-cure, the refractive index of the entire liquid composition is ?1.47, and the viscosity is ?500 mPa·s.

Abstract: Provided is a curing reactive organopolysiloxane composition that forms a pressure-sensitive adhesive layer having a high shear storage elastic modulus and stress at 500% strain and having excellent adhesive strength. The organopolysiloxane composition comprises: (A) a chain organopolysiloxane having an alkenyl group; (B) an organopolysiloxane resin having 9 mol % or less of hydroxyl groups and the like, and being a mixture of (b1) an organopolysiloxane resin having a (Mw) of 4500 or more and (b2) an organopolysiloxane resin having a (Mw) of less than 4500; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst. A mass ratio of a resin component to a chain siloxane component is within a range of 1.4 to 3.0 A pressure-sensitive adhesive layer obtained by curing the composition has a shear storage elastic modulus G? at 25° C. of 3.5 MPa or more, and a stress at 500% strain of 0.25 MPa or more.

Abstract: Provided is a curing reactive organopolysiloxane composition that forms a pressure-sensitive adhesive layer having practically sufficient curability and pressure-sensitive adhesive strength, and a relatively high shear storage elastic modulus and tensile stress at 500% strain. The organopolysiloxane composition comprises: (A) a chain organopolysiloxane having a content of vinyl portions in alkenyl groups within a range of 0.02 to 0.30 mass %; (B) an organopolysiloxane resin having a content of hydroxyl groups and the like of 9 mol % or less, and a molecular weight of 4500 or more; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst. A mass ratio of a resin component to a chain siloxane component is within a range of 1.4 to 3.0. A pressure-sensitive adhesive layer obtained by curing the organopolysiloxane composition has a shear storage elastic modulus G? at 25° C. of 1.0 MPa or more and a stress at 500% strain of 0.50 MPa or more.

Abstract: Provided is a curing reactive organopolysiloxane composition that forms a pressure-sensitive adhesive layer having excellent curing properties, a wide range of designable viscoelastic properties such as storage elastic modulus (G?) and the like, and practically sufficient pressure-sensitive adhesive strength and tensile adhesive strength. The organopolysiloxane composition comprises: (A) an organopolysiloxane having an alkenyl group; (B) an organopolysiloxane resin with 9 mol % or less of hydroxyl groups or the like relative to all silicon atoms in a molecule or resin mixture thereof; (C) an organohydrogenpolysiloxane; (D) an organic silicon compound having an alkenyl group; and (E) a hydrosilylation reaction catalyst. A ratio (molar ratio) of the substance amount of SiH groups in component (C) relative to the sum of alkenyl groups in components (A), (B) and (D) is 1.0 or less.

Abstract: Provided is a curable silicone composition for a release agent which can form a release film having a silicone adhesive with a low release force even when thin and which does not reduce the adhesive strength of the silicone adhesive to other substrates upon releasing the release film. A release film and laminate are also provided. The curable silicone composition comprises: (A) a fluorine-containing organopolysiloxane mixture obtained by mixing the following components (A1) and (A2) at a mass ratio of 1/99 to 45/55: (A1) a fluoro(poly)ether modified organopolysiloxane having at least two alkenyl groups per molecule along with a fluoro(poly)ether-containing organic group; (A2) a fluoroalkyl group-containing organopolysiloxane having at least two alkenyl groups per molecule along with a fluoroalkyl group having 1 to 12 carbon atoms; (B) an organopolysiloxane having at least three silicon atom-bonded hydrogen atoms per molecule; (C) a hydrosilylation reaction catalyst; and (D) an organic solvent.

Abstract: Provided is a curable silicone composition for a release agent which can form a release film having a silicone adhesive with a low release force even when thin and which does not reduce the adhesive strength of the silicone adhesive to other substrates upon releasing the release film. Also provided is a release film, laminate, and method of manufacture.

Abstract: Provided is a curable silicone composition for a release agent which can release a release film from a silicone adhesive with low release force without reducing the adhesive strength of the silicone adhesive to other substrates upon releasing the release film. A release film or laminate having the small release force of the silicone adhesive is also provided. The curable silicone composition comprises: (A) a mixture of two or more fluoroalkyl group-containing organopolysiloxanes having a fluoroalkyl group and at least two alkenyl groups per molecule, wherein the contents of the fluoroalkyl groups differ from each other, and the two or more fluoroalkyl group-containing organopolysiloxanes are a combination of those which are not completely compatibilized at 25° C. when mixed in the absence of a solvent; (B) an organopolysiloxane having at least three silicon-bonded hydrogen atoms per molecule; (C) an effective amount of a hydrosilylation reaction catalyst; and (D) an organic solvent.

Abstract: Disclosed is an adhesive film. The adhesive film has a silicone adhesive layer on one surface or both surfaces of a substrate film. A silicone adhesive material is used to form the silicone adhesive layer. The silicone adhesive material has 120 to 380% of an elongation at break (tensile speed of 300 mm/min, temperature of 25° C.) specified in JIS K 6251, and 1.8×105 to 4.5×105 Pa of a shear storage modulus (frequency of 10 Hz, temperature of 25° C.). The adhesive film generally has good wettability to the surface of an adherend and in general can be easily attached without creating air bubbles, to the extent that, even if air bubbles are created, the air bubbles can be easily dissipated. Further, even though the adhesive film is generally not easily peeled, peeling is generally possible with a small adhesive force during high speed peeling.

Abstract: Provided is a curable silicone composition, a cured product thereof, a laminate body, a manufacturing method thereof, and an optical device or optical display exhibiting excellent performance for use as a member where transparency is required such as for an optical display, a touch panel, or the like. A curable silicone composition, comprises: (A) an organopolysiloxane having in a molecule at least 2 alkenyl groups with 2 to 12 carbon atoms; (B) an organohydrogenpolysiloxane having at least 2 silicon-bonded hydrogen atoms per molecule; and (C) a hydrosilylation reaction catalyst. Component (B) is present in an amount such that the silicon-bonded hydrogen atoms in component (B) are 0.5 to 2 mol per mol of aliphatic unsaturated carbon-carbon bonds in component (A), and 2 to 17.5 mol % of the silicon-bonded organic groups in the curable silicone composition are aryl groups.

Abstract: Provided is a curable silicone composition, a cured product thereof, a laminate body, a manufacturing method thereof, and an optical device or optical display exhibiting excellent performance for use as a member where transparency is required such as for an optical display, a touch panel, or the like. A curable silicone composition, comprises: (A) an organopolysiloxane having an alkenyl group, (B) an organohydrogenpolysiloxane, (C) a hydrosilylation reaction catalyst, and (D) an organic compound having two or more alkoxysilyl groups per molecule. The amount of a polyether compound/epoxy group and organic compound having an alkoxysilyl group is 0.1 mass % or less.

Abstract: Provided is: a resin sheet having excellent characteristics as an optical member and exhibiting excellent performance when used in a light emitting device or the like; and a manufacturing method thereof. A curable silicone composition, comprises: (A) (a1) a straight chain or partially branched organopolysiloxane having an alkenyl group, and (a2) an organopolysiloxane having an alkenyl group, including an organopolysiloxane resin having an alkenyl group, comprising a certain amount of branched siloxane units; (B) (b1) a straight chain or partially branched organohydrogenpolysiloxane having a silicon-bonded hydrogen atom at an end of a molecular chain, (b2) an organohydrogenpolysiloxane, including a organohydrogenpolysiloxane resin, having a certain amount of branched siloxane units; and (C) a hydrosilylation reaction catalyst.

Abstract: Disclosed is an adhesive film. The adhesive film has a silicone adhesive layer on one surface or both surfaces of a substrate film. A silicone adhesive material is used to form the silicone adhesive layer. The silicone adhesive material has 120 to 380% of an elongation at break (tensile speed of 300 mm/min, temperature of 25° C.) specified in JIS K 6251, and 1.8×105 to 4.5×105 Pa of a shear storage modulus (frequency of 10 Hz, temperature of 25° C.). The adhesive film generally has good wettability to the surface of an adherend and in general can be easily attached without creating air bubbles, to the extent that, even if air bubbles are created, the air bubbles can be easily dissipated. Further, even though the adhesive film is generally not easily peeled, peeling is generally possible with a small adhesive force during high speed peeling.

Abstract: A curable organopolysiloxane composition is provided which forms a pressure sensitive adhesive (PSA) layer capable of a wide range of storage elastic modulus (G?) at low temperatures, and with excellent curability and adhesion. A PSA layer-forming organopolysiloxane composition comprises: (A) a chain organopolysiloxane having alkenyl groups; (B) an organopolysiloxane resin which has a content of 9 moles or less of hydroxyl groups and the like and is a mixture of (b1) an organopolysiloxane resin having a weight average molecular weight (Mw) of 4500 or more and (b2) an organopolysiloxane resin having a Mw of less than 4500; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst. The mass ratio of component (B) to component (A) is within a range of 0.9 to 3.0, and the shear storage elastic modulus G? at ?20° C. of a PSA pressure sensitive adhesive layer obtained by curing the composition is within a range of 0.77 to 50.00 MPa.

Abstract: A curable organopolysiloxane composition is provided which forms a pressure sensitive adhesive (PSA) layer having a low storage elastic modulus (G?), excellent curability, and sufficient adhesion, along with applications thereof. A PSA layer-forming organopolysiloxane composition comprises: (A) a chain organopolysiloxane having alkenyl groups; (B) an organopolysiloxane resin wherein the weight average molecular weight (Mw) thereof is less than 4500 and the sum of the content of hydroxyl groups, etc. is 9 mole % or less; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst; and optionally, (A?) a chain organopolysiloxane which does not contain a carbon-carbon double bond-containing reactive group in the molecule. The mass ratio of the organopolysiloxane resin (B) to the chain organopolysiloxane (A) is within a specific range and the shear storage elastic modulus G? at ?20° C. of a PSA layer obtained by curing the composition is within a range of 0.01 to 1.0 MPa.

Abstract: A curable organopolysiloxane composition is provided which forms a pressure sensitive adhesive (PSA) layer having a relatively low storage elastic modulus (G?) at low temperatures, excellent curability, and sufficient adhesion for practical use. A PSA layer-forming organopolysiloxane composition comprises: (A) a chain organopolysiloxane having alkenyl groups; (B) an organopolysiloxane resin which has a content of 9 moles or less of hydroxyl groups and the like is a mixture of (b1) an organopolysiloxane resin having a weight average molecular weight (Mw) of 4500 or more and (b2) an organopolysiloxane resin having a Mw of less than 4500; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst. The mass ratio of component (B) to component (A) is within a range of 0.9 to 2.0, and the shear storage elastic modulus G? at ?20° C. of a PSA layer obtained by curing the composition is within a range of 0.01 to 0.75 MPa.

Abstract: Disclosed is a curable silicone composition. The composition comprises: (A) an organopolysiloxane having at least two alkenyl groups and at least one aryl group in each molecule; (B) a polyoxyalkylene compound represented by the general formula: XO—(C2H4O)p(CnH2nO)q(YO)r—X, wherein, each X represents a hydrogen atom, an alkyl group, an alkenyl group, an aryl group, an acryl group, or a methacryl group, provided that at least one X in each molecule is the alkenyl group, the acryl group, or the methacryl group, Y represents a divalent hydrocarbon group, n represents an integer of 3 to 6, p and q are integers satisfying: 2?p?100 and 0?q?50, and r represents 0 or 1; (C) an organopolysiloxane having at least two silicon bonded hydrogen atoms in each molecule; and (D) a catalyst for a hydrosilylation reaction. The composition forms a cured product having improved properties.

Abstract: A method for producing a silicone-based adhesive is disclosed. The method comprises: (1) applying a silicone composition (I) to one surface of a peelable substrate, and then forming a silicone layer (I) by curing or drying the silicone composition (I); and (2) applying a silicone composition (II) to a surface of the silicone layer (I), and then forming the silicone-based adhesive by curing the silicone composition (II). The silicone composition (I) contains a silicone resin. The silicone composition (II) either does not contain the silicone resin or if contained, its content amount is lower than that in the silicone composition (I). The method is useful for producing a silicone-based adhesive with low peel resistance from a peelable substrate even with a low modulus.