Patents by Inventor Miharu Ota

Miharu Ota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150368413
    Abstract: The present invention aims to provide a film having a high dielectric constant and a low dissipation factor. The high dielectric film of the present invention includes a vinylidene fluoride/tetrafluoroethylene copolymer (A) with a mole ratio (vinylidene fluoride)/(tetrafluoroethylene) of 95/5 to 80/20. The film includes an ?-crystal structure and a ?-crystal structure. The ratio of the ?-crystal structure is 50% or more.
    Type: Application
    Filed: October 16, 2013
    Publication date: December 24, 2015
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Mayuko TATEMICHI, Miharu OTA, Kouji YOKOTANI, Nobuyuki KOMATSU, Hisako NAKAMURA, Fumiko SHIGENAI, Takeshi HAZAMA, Masakazu KINOSHITA, Meiten KOH, Takuji ISHIKAWA, Takashi IGUCHI, Kazunobu UCHIDA, Tomoyuki FUKATANI, Takahiro KITAHARA, Tetsuhiro KODANI
  • Publication number: 20150332855
    Abstract: The present invention aims to provide a multilayer film which can increase the capacitance. The present invention relates to a multilayer film including a first electrode layer, a resin substrate, a second electrode layer, and a dielectric layer stacked in the order set forth. The dielectric layer includes a vinylidene fluoride/tetrafluoroethylene copolymer (A). The copolymer (A) satisfies a mole ratio (vinylidene fluoride)/(tetrafluoroethylene) of 97/3 to 60/40.
    Type: Application
    Filed: November 14, 2013
    Publication date: November 19, 2015
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Meiten KOH, Nobuyuki KOMATSU, Takeshi HAZAMA, Hisako NAKAMURA, Kouji YOKOTANI, Miharu OTA, Fumiko SHIGENAI, Mayuko TATEMICHI, Masakazu KINOSHITA
  • Patent number: 8934216
    Abstract: The present invention provides a high dielectric film for a film capacitor obtained by molding a film forming composition for a film capacitor comprising a thermoplastic resin (A) and surface-treated high dielectric inorganic particles (B) obtained by treating the surfaces of high dielectric inorganic particles (b1) having a dielectric constant (20° C., 1 kHz) of 100 or more with a low dielectric compound (b2) having a dielectric constant (20° C., 1 kHz) of 10 or less. This high dielectric film for a film capacitor can restrain the decrease of electrical insulating property, in spite of the high dielectric inorganic particles being dispersed at a high filling rate.
    Type: Grant
    Filed: December 21, 2009
    Date of Patent: January 13, 2015
    Assignee: Daikin Industries, Ltd.
    Inventors: Kouji Yokotani, Miharu Ota, Mayuko Tatemichi, Nobuyuki Komatsu, Eri Mukai, Meiten Koh
  • Patent number: 8675345
    Abstract: There is provided a thin highly dielectric film for a film capacitor being excellent in mechanical strength, in which highly dielectric inorganic particles can be blended to a dielectric resin at high ratio, and rubber particles (B) and preferably highly dielectric inorganic particles (C) are dispersed in a thermoplastic resin (A).
    Type: Grant
    Filed: December 21, 2009
    Date of Patent: March 18, 2014
    Assignee: Daikin Industries, Ltd.
    Inventors: Mayuko Tatemichi, Miharu Ota, Kouji Yokotani, Nobuyuki Komatsu, Eri Mukai, Meiten Koh
  • Patent number: 8576540
    Abstract: The present invention provides a nonporous highly dielectric film which can improve withstanding voltage, insulating property and dielectric constant, especially can decrease a dielectric loss at high temperatures and can be made thin, and a coating composition for forming the highly dielectric film comprising (A) a vinylidene fluoride resin, (B) a cellulose resin and (C) a solvent.
    Type: Grant
    Filed: March 17, 2009
    Date of Patent: November 5, 2013
    Assignee: Daikin Industries, Ltd.
    Inventors: Meiten Koh, Mayuko Tatemichi, Eri Mukai, Miharu Ota, Kouji Yokotani, Nobuyuki Komatsu
  • Publication number: 20120293909
    Abstract: The present invention provides a high dielectric film comprising: a film-forming resin (A); and inorganic particles (B), wherein the film-forming resin (A) contains a vinylidene fluoride resin (a1), an amount of the inorganic particles (B) is not less than 0.01 parts by mass and less than 10 parts by mass for each 100 parts by mass of the film-forming resin (A), and the inorganic oxide particles (B) is at least one selected from the group consisting of: (B1) inorganic oxide particles of a metallic element of Group 2, 3, 4, 12, or 13 of the Periodic Table, or inorganic oxide composite particles of these; (B2) inorganic composite oxide particles represented by formula (1): M1a1Nb1Oc1 wherein M1 represents a metallic element of Group 2, N represents a metallic element of Group 4, a1 represents 0.9 to 1.1, b1 represents 0.9 to 1.1, c1 represents 2.8 to 3.
    Type: Application
    Filed: January 11, 2011
    Publication date: November 22, 2012
    Applicant: Daikin Industries, Ltd.
    Inventors: Mayuko Tatemichi, Nanako Takano, Miharu Ota, Kouji Yokotani, Nobuyuki Komatsu, Eri Mukai, Meiten Koh
  • Publication number: 20110255210
    Abstract: There is provided a thin highly dielectric film for a film capacitor being excellent in mechanical strength, in which highly dielectric inorganic particles can be blended to a dielectric resin at high ratio, and rubber particles (B) and preferably highly dielectric inorganic particles (C) are dispersed in a thermoplastic resin (A).
    Type: Application
    Filed: December 21, 2009
    Publication date: October 20, 2011
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Mayuko Tatemichi, Miharu Ota, Kouji Yokotani, Nobuyuki Komatsu, Eri Mukai, Meiten Koh
  • Publication number: 20110249374
    Abstract: The present invention provides a high dielectric film for a film capacitor obtained by molding a film forming composition for a film capacitor comprising a thermoplastic resin (A) and surface-treated high dielectric inorganic particles (B) obtained by treating the surfaces of high dielectric inorganic particles (b1) having a dielectric constant (20° C., 1 kHz) of 100 or more with a low dielectric compound (b2) having a dielectric constant (20° C., 1 kHz) of 10 or less. This high dielectric film for a film capacitor can restrain the decrease of electrical insulating property, in spite of the high dielectric inorganic particles being dispersed at a high filling rate.
    Type: Application
    Filed: December 21, 2009
    Publication date: October 13, 2011
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Kouji Yokotani, Miharu Ota, Mayuko Tatemichi, Nobuyuki Komatsu, Eri Mukai, Meiten Koh
  • Publication number: 20110013343
    Abstract: The present invention provides a nonporous highly dielectric film which can improve withstanding voltage, insulating property and dielectric constant, especially can decrease a dielectric loss at high temperatures and can be made thin, and a coating composition for forming the highly dielectric film comprising (A) a vinylidene fluoride resin, (B) a cellulose resin and (C) a solvent.
    Type: Application
    Filed: March 17, 2009
    Publication date: January 20, 2011
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Meiten Koh, Mayuko Tatemichi, Eri Mukai, Miharu Ota, Kouji Yokotani, Nobuyuki Komatsu