Patents by Inventor Miho Onodera

Miho Onodera has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230036115
    Abstract: A prepreg and an integrally molded article are described, the prepreg including a thermoplastic resin existing on one face of a layer in which reinforcing fibers are impregnated with a thermosetting resin, wherein the prepreg exhibits, in injection molding or press molding, thermal weldability with a member containing a thermoplastic resin, and wherein the thermosetting resin has a specific peak on a loss tangent (tan ?) curve obtained by dynamic mechanical analysis (DMA), so that the prepreg exhibits suitable flexibility and adhesiveness, excellent formability on a complicated mold face, and adhesion to a mold face, causes no positional shift, and can be efficiently reinforced and stiffened at an intended position.
    Type: Application
    Filed: November 6, 2020
    Publication date: February 2, 2023
    Applicant: Toray Industries, Inc.
    Inventors: Miho Onodera, Yoshiki Takebe, Daisuke Konishi, Yuta Naito, Yoshifumi Nakayama, Masato Honma
  • Publication number: 20220204710
    Abstract: An object of the present invention is to provide a prepreg and a laminate for producing a laminate suitable as a structural material, which have excellent joining strength and can be firmly integrated with another structural member by welding. The present invention provides a prepreg including the following structural components: [A] reinforcing fibers, [B] a thermosetting resin, and [C] a thermoplastic resin, wherein [A] has a surface free energy, measured by a Wilhelmy method, of 10 to 50 mJ/m2, [C] is present on a surface of the prepreg, and the reinforcing fibers [A] are present, which are included in a resin area including [B] and a resin area including [C] across an interface between the two resin areas.
    Type: Application
    Filed: May 15, 2020
    Publication date: June 30, 2022
    Applicant: Toray Industries, Inc.
    Inventors: Yoshihumi Nakayama, Miho Onodera, Masato Honma