Patents by Inventor Mika Koshino

Mika Koshino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240186172
    Abstract: Provided is a laminate that allows semiconductor elements to be transferred over a wide range of processing margins using lasers of various wavelengths, without damaging the elements or leaving behind any pasty residue. This laminate is a substrate in which a laser-transmitting substrate 1, a resin film, and a semiconductor element are laminated in the stated order. The absorbance of the resin film at a wavelength of 248 nm, 266 nm, or 355 nm expressed in terms of a film thickness of 1.0 ?m us 0.4-5.0, and the adhesive strength of the resin film with respect to the semiconductor elements is 0.02-0.3 N/cm.
    Type: Application
    Filed: March 23, 2022
    Publication date: June 6, 2024
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Yukari ARIMOTO, Risano NAKAJIMA, Mika KOSHINO, Hitoshi ARAKI, Masao TOMIKAWA, Takenori FUJIWARA, Kenta AOSHIMA
  • Publication number: 20240166556
    Abstract: Provided is a laminate that can be implemented with a wide processing margin and without adhesive residue or damage to a semiconductor element in the transfer of the semiconductor element using laser light of various wavelengths. The laminate is obtained by laminating a substrate 1 having laser permeability, a resin film 1 and a resin film 2 in this order, wherein the light absorbance of the resin film 1 calculated for a film thickness of 1.0 ?m at any wavelength of 200 nm to 1100 nm is 0.4-5.0, and the adhesive strength of the surface of the resin film 2 on the side opposite that of the resin film 1 side is 0.02-0.3 N/cm.
    Type: Application
    Filed: March 23, 2022
    Publication date: May 23, 2024
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Risano NAKAJIMA, Yukari ARIMOTO, Mika KOSHINO, Hitoshi ARAKI, Masao TOMIKAWA, Takenori FUJIWARA, Kenta AOSHIMA
  • Publication number: 20210198416
    Abstract: A photosensitive resin composition contains (A) an ethylenically unsaturated group- and carboxyl group-containing photoreactive resin, (B) an epoxy compound, (C) a polyfunctional epoxy compound, and (D) a photopolymerization initiator.
    Type: Application
    Filed: December 16, 2016
    Publication date: July 1, 2021
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Mika Koshino, Miki Nakamichi, Mitsuhito Suwa
  • Patent number: 10858509
    Abstract: Provided is a resin composition which contains a UV absorbent having high solubility in solvents, and imparts superior UV-cut performance and transparency, and good weather resistance, even when being formed as a thin film. The resin composition contains a UV absorbent (a) and a resin (b), wherein the UV absorbent (a) contains at least two compounds, i.e., a compound (a-1) having a global absorption maximum at less than 340 nm, and a compound (a-2) having a global absorption maximum at 340-380 nm, and the total content of (a-1) and (a-2) is 10-30 mass % of the total solid content.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: December 8, 2020
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Mika Koshino, Mitsuhito Suwa
  • Publication number: 20200379299
    Abstract: Provided is a substrate whereby diffusion of light toward a backlight can be suppressed and luminance of an image display device can be enhanced. A substrate having, on a transparent substrate, (a) a color conversion light-emitting layer and (b) a light diffusion prevention layer in this order from the transparent substrate side, the refractive index of the light diffusion prevention layer with respect to a wavelength of 550 nm being 1.20-1.35.
    Type: Application
    Filed: November 27, 2018
    Publication date: December 3, 2020
    Applicant: Toray Industries, Inc.
    Inventors: Toshiyasu Hibino, Mika Koshino, Masao Kamogawa, Mitsuhito Suwa
  • Publication number: 20190136034
    Abstract: Provided is a resin composition which contains a UV absorbent having high solubility in solvents, and imparts superior UV-cut performance and transparency, and good weather resistance, even when being formed as a thin film. The resin composition contains a UV absorbent (a) and a resin (b), wherein the UV absorbent (a) contains at least two compounds, i.e., a compound (a-1) having a global absorption maximum at less than 340 nm, and a compound (a-2) having a global absorption maximum at 340-380 nm, and the total content of (a-1) and (a-2) is 10-30 mass % of the total solid content.
    Type: Application
    Filed: May 18, 2017
    Publication date: May 9, 2019
    Applicant: Toray Industries, Inc.
    Inventors: Mika Koshino, Mitsuhito Suwa
  • Patent number: 9897915
    Abstract: The present invention provides a photosensitive resin composition which uses a polyimide precursor that has excellent solubility in organic solvents and is capable of reducing the viscosity of a resin composition obtained therefrom. The solution according to the present invention is a photosensitive resin composition which contains: an aromatic amide resin that has, as a main repeating unit, a specific structure having an amide group, a trifluoromethyl group and an aromatic ring; (b) a sensitizer; and (c) a solvent.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: February 20, 2018
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yusuke Komori, Mika Koshino, Kazuto Miyoshi
  • Publication number: 20150301453
    Abstract: The present invention provides a photosensitive resin composition which uses a polyimide precursor that has excellent solubility in organic solvents and is capable of reducing the viscosity of a resin composition obtained therefrom. The solution according to the present invention is a photosensitive resin composition which contains: an aromatic amide resin that has, as a main repeating unit, a specific structure having an amide group, a trifluoromethyl group and an aromatic ring; (b) a sensitizer; and (c) a solvent.
    Type: Application
    Filed: December 13, 2013
    Publication date: October 22, 2015
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Yusuke KOMORI, Mika KOSHINO, Kazuto MIYOSHI
  • Patent number: 8895676
    Abstract: The resin composition of the present invention is a resin composition characterized by including (a) a polyimide, a polybenzoxazole, a polyimide precursor or a polybenzoxazole precursor, (b) 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, or 2,3-dihydroxynaphthalene, and (c) a thermal cross-linking agent having a specific structure. By the use of the resin composition of the present invention, it is possible to reduce the transmittance in the visible region of a cured film while maintaining the transmittance of a resin film before curing.
    Type: Grant
    Filed: March 10, 2014
    Date of Patent: November 25, 2014
    Assignee: Toray Industries, Inc.
    Inventors: Kazuto Miyoshi, Mika Koshino, Masao Tomikawa
  • Publication number: 20140191222
    Abstract: The resin composition of the present invention is a resin composition characterized by including (a) a polyimide, a polybenzoxazole, a polyimide precursor or a polybenzoxazole precursor, (b) 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, or 2,3-dihydroxynaphthalene, and (c) a thermal cross-linking agent having a specific structure. By the use of the resin composition of the present invention, it is possible to reduce the transmittance in the visible region of a cured film while maintaining the transmittance of a resin film before curing.
    Type: Application
    Filed: March 10, 2014
    Publication date: July 10, 2014
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Kazuto MIYOSHI, Mika KOSHINO, Masao TOMIKAWA
  • Patent number: 8709552
    Abstract: The resin composition of the present invention is a resin composition characterized by including (a) a polyimide, a polybenzoxazole, a polyimide precursor or a polybenzoxazole precursor, (b) 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, or 2,3-dihydroxynaphthalene, and (c) a thermal cross-linking agent having a specific structure. By the use of the resin composition of the present invention, it is possible to reduce the transmittance in the visible region of a cured film while maintaining the transmittance of a resin film before curing.
    Type: Grant
    Filed: January 15, 2010
    Date of Patent: April 29, 2014
    Assignee: Toray Industries, Inc.
    Inventors: Kazuto Miyoshi, Mika Koshino, Masao Tomikawa
  • Publication number: 20110284855
    Abstract: The resin composition of the present invention is a resin composition characterized by including (a) a polyimide, a polybenzoxazole, a polyimide precursor or a polybenzoxazole precursor, (b) 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, or 2,3-dihydroxynaphthalene, and (c) a thermal cross-linking agent having a specific structure. By the use of the resin composition of the present invention, it is possible to reduce the transmittance in the visible region of a cured film while maintaining the transmittance of a resin film before curing.
    Type: Application
    Filed: January 15, 2010
    Publication date: November 24, 2011
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Kazuto Miyoshi, Mika Koshino, Masao Tomikawa