Patents by Inventor Mikael Tuominen

Mikael Tuominen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200253050
    Abstract: A component carrier with an electrically insulating layer structure has opposed main surfaces, a through-hole, and an electrically conductive bridge structure connecting opposing sidewalls delimiting the through-hole. The sidewalls have a first tapering portion extending from a first main surface and a second tapering portion extending from a second main surface. A first demarcation surface faces the first main surface and a second demarcation surface faces the second main surface. A central bridge plane extends parallel to the first main surface and the second main surface and is at a vertical center between a lowermost point of the first demarcation surface and an uppermost point of the second demarcation surface. A first intersection point is between the central bridge plane and one of the sidewalls delimiting the through hole. A length of a shortest distance from the first intersection point to the first demarcation surface is at least 8 ?m.
    Type: Application
    Filed: January 23, 2020
    Publication date: August 6, 2020
    Inventor: Mikael Tuominen
  • Publication number: 20200253054
    Abstract: A component carrier with a stack including at least one electrically insulating layer structure and at least one electrically insulating structure has a tapering blind hole formed in the stack and an electrically conductive plating layer extending along at least part of a horizontal surface of the stack outside of the blind hole and along at least part of a surface of the blind hole. A minimum thickness of the plating layer at a bottom of the blind hole is at least 8 ?m.
    Type: Application
    Filed: January 28, 2020
    Publication date: August 6, 2020
    Inventor: Mikael Tuominen
  • Publication number: 20200236781
    Abstract: A component carrier is provided, which includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; a component on the stack; and stress propagation suppressing particles in at least part of the stack suppressing propagation of stress through the component carrier.
    Type: Application
    Filed: April 8, 2020
    Publication date: July 23, 2020
    Inventors: Artan Baftiri, Mikael Tuominen
  • Publication number: 20200163205
    Abstract: A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; a component embedded in the stack so that a gap of less than 100 ?m, in particular less than 60 ?m, remains between at least one sidewall of the component and a sidewall of an adjacent one of the layer structures or a further component embedded in the stack; and a filler medium including filler particles, wherein the filler medium at least partially fills the gap. In addition, a method of manufacturing a component carrier is provided.
    Type: Application
    Filed: November 12, 2019
    Publication date: May 21, 2020
    Inventors: Seok Kim Tay, Mikael Tuominen
  • Publication number: 20200163211
    Abstract: A component carrier is provided, which includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; a component on the stack; and stress propagation suppressing particles in at least part of the stack suppressing propagation of stress through the component carrier.
    Type: Application
    Filed: November 12, 2019
    Publication date: May 21, 2020
    Inventors: Artan Baftiri, Mikael Tuominen
  • Publication number: 20200163223
    Abstract: A method of manufacturing first and second component carriers includes: i) providing a separation component comprising a first separation surface and a second separation surface being opposed to the first separation surface, ii) coupling a first base structure having a first cavity with the first separation surface, iii) coupling a second base structure having a second cavity with the second separation surface, iv) placing a first electronic component in the first cavity, v) connecting the first base structure with the first electronic component to form the first component carrier, vi) placing a second electronic component in the second cavity, vii) connecting the second base structure with the second electronic component to form the second component carrier, viii) separating the first component carrier from the first separation surface of the separation component, and ix) separating the second component carrier from the second separation surface of the separation component.
    Type: Application
    Filed: November 19, 2019
    Publication date: May 21, 2020
    Inventors: Jeesoo Mok, Seok Kim Tay, Mikael Tuominen, Yu-Hui Wu
  • Publication number: 20200163206
    Abstract: An electronic package having a base structure; a layer stack formed over the base structure; and a component embedded at least partially within the base structure and/or within the layer stack. The layer stack has a decoupling layer structure, the decoupling layer structure with a decoupling material having a Young Modulus being smaller than 1 GPa.
    Type: Application
    Filed: November 18, 2019
    Publication date: May 21, 2020
    Inventors: Mikael Tuominen, Seok Kim Tay
  • Publication number: 20200154558
    Abstract: A component carrier, wherein the component carrier includes: i) a layer stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, ii) a bendable portion which forms at least a part of the layer stack, and iii) a metal layer which forms at least a part of the bendable portion. Hereby, the metal layer extends over at least 75% of the area of the bendable portion.
    Type: Application
    Filed: September 9, 2019
    Publication date: May 14, 2020
    Inventors: Nick Xin, Mikael Tuominen
  • Patent number: 10653009
    Abstract: A component carrier is provided, which includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; a component on the stack; and stress propagation suppressing particles in at least part of the stack suppressing propagation of stress through the component carrier.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: May 12, 2020
    Assignee: AT&S (China) Co., Ltd.
    Inventors: Artan Baftiri, Mikael Tuominen
  • Patent number: 10651215
    Abstract: The present invention relates to a sensor system. The sensor system comprises a component carrier and a sensor having a control unit and a sensor unit. At least a part of the sensor unit is located within the component carrier.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: May 12, 2020
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventor: Mikael Tuominen
  • Patent number: 10643953
    Abstract: An electronic device having an electronic component with electric terminals and a component carrier in which the electronic component is packaged. The component carrier includes a shielding cage surrounding all sides of the electronic component at least partially.
    Type: Grant
    Filed: November 30, 2016
    Date of Patent: May 5, 2020
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Mikael Tuominen, Christian Vockenberger, Wolfgang Schrittwieser
  • Patent number: 10643928
    Abstract: An electronic device includes first and second component carrier packages having respective embedded electronic components and at least one respective external terminal. The second component carrier package is mounted on the first component carrier package by electrically and mechanically connecting the at least one respective external terminals. The first component carrier package further includes an electromagnetic radiation shielding structure formed as an electrically conductive coating and being configured for at least partially shielding electromagnetic radiation from propagating between an exterior and an interior of the first component carrier package.
    Type: Grant
    Filed: November 30, 2016
    Date of Patent: May 5, 2020
    Assignee: AT&S (China) Co. Ltd.
    Inventor: Mikael Tuominen
  • Publication number: 20200100358
    Abstract: A component carrier includes a stack comprising at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, a component embedded in the stack, and at least one stress relief opening formed in each of the at least one electrically conductive layer structure arranged in the stack on one side of the component so that a portion of the stack extending from an exterior main surface of the component carrier up to a main surface of the component on said side and including the at least one stress relief opening is free of electrically conductive material.
    Type: Application
    Filed: September 26, 2019
    Publication date: March 26, 2020
    Inventors: Mikael Tuominen, Artan Baftiri, Nick Xin
  • Patent number: 10595414
    Abstract: A component carrier includes a first level stack of first plural of electrically conductive layer structures and/or first electrically insulating layer structures; a first component aligned within a first through hole cut out in the first level stack such that one of an upper or a lower surface of the first component is substantially flush with an respective upper or a lower surface of the first level stack second electrically conductive layer structures and/or second electrically insulating layer structures attached onto the upper and the lower surface of the first level stack thereby covering the first component at the upper and the lower surface of the first component and pressed to form a second level stack. A second component is aligned within a second through hole cut out in the second level stack such that one of upper or a lower surface of the second component is substantially flush with an upper or a lower surface of the second level stack.
    Type: Grant
    Filed: April 1, 2018
    Date of Patent: March 17, 2020
    Assignee: AT&S (China) Co. Ltd.
    Inventor: Mikael Tuominen
  • Publication number: 20190326188
    Abstract: A packaged integrated circuit includes a core structure with a cavity therein; a component accommodated in the cavity; an electrically insulating structure formed over the core structure and the component; a partially electrically insulating carrier structure formed below the core structure and the component; and an electrically conducting redistribution arrangement formed at least partially within the carrier structure. The redistribution arrangement includes conductor structures each having a first element extending through the carrier structure and electrically connecting a contact of the component and a second element below the carrier structure. A part of the second element is a contact pad for electrically connecting the redistribution arrangement with external circuitry. The carrier structure includes a polyimide layer and an adhesive layer.
    Type: Application
    Filed: March 21, 2019
    Publication date: October 24, 2019
    Inventors: Mikael Tuominen, Christian Vockenberger
  • Publication number: 20190254169
    Abstract: A component carrier includes a core having a recess, an electronic component arranged in the recess, a laminated electrically insulating sheet covering at least part of the core and of the electronic component and filling a gap between a lateral surface of the electronic component and a lateral surface of the core in the recess, and a further electrically insulating layer structure laminated on top of the sheet.
    Type: Application
    Filed: March 28, 2017
    Publication date: August 15, 2019
    Inventors: Annie TAY, Mikael TUOMINEN
  • Publication number: 20190116671
    Abstract: A component carrier includes a core having a recess, at least one electronic component arranged in the recess, wherein a vertical thickness of the at least one electronic component is larger than a vertical thickness of the core, and an electrically insulating sheet covering at least part of a top main surface of the core, covering at least part of the at least one electronic component and filling a gap between a lateral surface of the at least one electronic component and a lateral surface of the core in the recess.
    Type: Application
    Filed: March 29, 2017
    Publication date: April 18, 2019
    Inventors: Annie TAY, Mikael TUOMINEN
  • Publication number: 20180358302
    Abstract: An electronic device having an electronic component with electric terminals and a component carrier in which the electronic component is packaged. The component carrier includes a shielding cage surrounding all sides of the electronic component at least partially.
    Type: Application
    Filed: November 30, 2016
    Publication date: December 13, 2018
    Inventors: Mikael Tuominen, Christian Vockenberger, Wolfgang Schrittwieser
  • Publication number: 20180350725
    Abstract: An electronic device includes first and second component carrier packages having respective embedded electronic components and at least one respective external terminal. The second component carrier package is mounted on the first component carrier package by electrically and mechanically connecting the at least one respective external terminals. The first component carrier package further includes an electromagnetic radiation shielding structure formed as an electrically conductive coating and being configured for at least partially shielding electromagnetic radiation from propagating between an exterior and an interior of the first component carrier package.
    Type: Application
    Filed: November 30, 2016
    Publication date: December 6, 2018
    Inventor: Mikael Tuominen
  • Publication number: 20180343751
    Abstract: A component carrier includes a plurality of low density layer structures, and a plurality of high density layer structures having a higher density of electrically conductive structures than the plurality of low density layer structures,—where the low density layer structures and the high density layer structures are alternatingly vertically stacked.
    Type: Application
    Filed: October 29, 2016
    Publication date: November 29, 2018
    Inventor: Mikael Tuominen