Patents by Inventor Miki HORIKAWA

Miki HORIKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THERMOSETTING RESIN COMPOSITION, FILM ADHESIVE, PREPREG, AND PRODUCTION METHOD THEREOF
    Publication number: 20220017698
    Abstract: The present invention provides a thermosetting resin composition characterized by comprising a bismaleimide compound and a triazine compound having a diaminotriazine structure.
    Type: Application
    Filed: November 26, 2019
    Publication date: January 20, 2022
    Applicant: TEIJIN LIMITED
    Inventors: Miki HORIKAWA, Takaya SUZUKI, Hiroaki KUWAHARA
  • Method for producing composite material
    Publication number: 20210347096
    Abstract: A prepreg consisting cf a fiber reinforcement material and a resin composition containing a bismaleimide resin is molded through a first heating step in which the prepreg is held at a temperature (T1) equal to or higher than a temperature at which the resin composition exhibits a viscosity of 100 (Pa·s) and equal to or lower than a temperature at which the resin composition exhibits the minimum viscosity for 30 minutes or more, followed by being held at a temperature equal to or higher than a curing temperature of the bismaleimide resin.
    Type: Application
    Filed: April 27, 2021
    Publication date: November 11, 2021
    Applicant: TEIJIN LIMITED
    Inventors: Miki HORIKAWA, Takaya Suzuki