Abstract: Provided are a silver powder that can reduce line resistance and a method of producing the same. The silver powder has a diameter at a cumulative value of 50% of 3 ?m or more and a ratio of particles of 10 ?m or larger of 10% or less. The silver powder includes flake-like particles having a major axis of 6 ?m or more and irregularly shaped particles having a major axis of less than 6 ?m, an average aspect ratio that is a ratio of average major axis relative to average thickness of the flake-like particles is 8 or more, and a shape factor that is a ratio of area of a circle having average maximum length of the irregularly shaped particles as a diameter relative to average particle area of the irregularly shaped particles is 1.7 to 1.9. Ignition loss is 0.1 wt % to 0.4 wt %.

Abstract: In a bonding material of a metal paste containing metal particles, a solvent and a dispersant, the metal particles containing first metal particles having an average primary particle diameter of 1 to 40 nm, second metal particles having an average primary particle diameter of 41 to 110 nm, and third metal particles having an average primary particle diameter of 120 nm to 10 ?m, the weight percentages of the first, second and third metal particles being 1.4 to 49% by weight, 36% by weight or less, and 50 to 95% by weight, respectively, with respect to the total 100% by weight of the metal particles, and the weight ratio of the first metal particles to the second metal particles being 14/36 or more.

Abstract: A method for producing a silver nanowire ink, includes mixing urethane resin particles having an average particle diameter of 200 nm or less, containing a urethane resin having a degree of elongation of less than 500%, with a silver nanowire dispersion liquid. The urethane resin may have an average value of 100% modulus (100% Mo), for example, 6.0 MPa or more. The content of the urethane resin colloid or the urethane resin emulsion may be from 0.01 to 2.0 mass % based on the total amount of the silver nanowire ink. The content of silver is preferably from 0.01 to 2.0 mass % based on the total amount of the silver nanowire ink. The content of the viscosity modifier is preferably from 0.01 to 2.0 mass % based on the total amount of the silver nanowire ink. The nanowires have high industrial practicability and a conductive film has high transparency and high conductivity.

Abstract: There are provided a bonding material, which is easily printed on a metal substrate, such as a copper substrate, and which can satisfactorily bond an Si chip to the metal substrate by preventing voids from being generated in a metal bonding layer and/or on the boundary between the metal bonding layer and the Si chip or metal copper substrate even if no pre-burning is carried out when the Si chip is bonded to the metal substrate, and a bonding method using the same. In a bonding material of a metal paste containing metal particles, a solvent and a dispersant, the metal particles containing first metal particles (small particles) having an average primary particle diameter of 1 to 40 nm, second metal particles (medium particles) having an average primary particle diameter of 41 to 110 nm, and third metal particles (large particles) having an average primary particle diameter of 120 nm to 10 ?m, the weight percentages of the first, second and third metal particles being 1.