Patents by Inventor Mineo Tokunaga

Mineo Tokunaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor light emitting device
    Patent number: 7825421
    Abstract: A semiconductor light emitting device comprises an element that emits light and a substrate on a main surface of which the element is mounted. The main surface of the substrate composed of two areas, (i) a mount area which is rectangle and on which the element is mounted, and (ii) a pad area that is equipped with a pad for wire bonding. The pad area is contiguous to the mount area on one side of the mount area, and the pad area decreases in width continuously or stepwise in a direction away from the one side.
    Type: Grant
    Filed: September 21, 2004
    Date of Patent: November 2, 2010
    Assignee: Panasonic Corporation
    Inventors: Kunihiko Obara, Mineo Tokunaga, Hideo Nagai
  • Substrate support jig, circuit board production apparatus, and method of producing circuit board
    Patent number: 7517419
    Abstract: A substrate support jig, for removably holding a substrate when mounting electronic components on the substrate, includes a base member having a first surface and a second surface facing and substantially parallel to each other; and an adhesive layer with a predetermined shape and a predetermined thickness formed on the first surface side by applying an adhesive material with a predetermined unit tackiness to an adhesive region. In the adhesive region is formed a land section such that a surface of the land section protrudes from a surface of the adhesive layer by a predetermined amount. The tackiness between the adhesive material and the base member is lower than the tackiness between the adhesive material and the substrate.
    Type: Grant
    Filed: April 16, 2004
    Date of Patent: April 14, 2009
    Assignee: Panasonic Corporation
    Inventors: Tatsuki Nogiwa, Mitsuhiro Ikeda, Hiroshi Yamauchi, Mineo Tokunaga
  • SEMICONDUCTOR LIGHT EMITTING DEVICE
    Publication number: 20090053841
    Abstract: A semiconductor light emitting device comprises an element that emits light and a substrate on a main surface of which the element is mounted. The main surface of the substrate composed of two areas, (i) a mount area which is rectangle and on which the element is mounted, and (ii) a pad area that is equipped with a pad for wire bonding. The pad area is contiguous to the mount area on one side of the mount area, and the pad area decreases in width continuously or stepwise in a direction away from the one side.
    Type: Application
    Filed: November 5, 2008
    Publication date: February 26, 2009
    Inventors: Kunihiko Obara, Mineo Tokunaga, Hideo Nagai
  • Semiconductor light emitting device
    Publication number: 20070001180
    Abstract: A semiconductor light emitting device comprises an element that emits light and a substrate on a main surface of which the element is mounted. The main surface of the substrate composed of two areas, (i) a mount area which is rectangle and on which the element is mounted, and (ii) a pad area that is equipped with a pad for wire bonding. The pad area is contiguous to the mount area on one side of the mount area, and the pad area decreases in width continuously or stepwise in a direction away from the one side.
    Type: Application
    Filed: September 21, 2004
    Publication date: January 4, 2007
    Inventors: Kunihiko Obara, Mineo Tokunaga, Hideo Nagai
  • Substrate support jig, circuit board production apparatus, and method of producing circuit board
    Publication number: 20050230050
    Abstract: A substrate support jig, for removably holding a substrate when mounting electronic components on the substrate, includes a base member having a first surface and a second surface facing and substantially parallel to each other; and an adhesive layer with a predetermined shape and a predetermined thickness formed on the first surface side by applying an adhesive material with a predetermined unit tackiness to an adhesive region. In the adhesive region is formed a land section such that a surface of the land section protrudes from a surface of the adhesive layer by a predetermined amount. The tackiness between the adhesive material and the base member is lower than the tackiness between the adhesive material and the substrate.
    Type: Application
    Filed: April 16, 2004
    Publication date: October 20, 2005
    Inventors: Tatsuki Nogiwa, Mitsuhiro Ikeda, Hiroshi Yamauchi, Mineo Tokunaga