Patents by Inventor Ming Cheng

Ming Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240067796
    Abstract: A fluorine-containing elastomer composition includes a curable fluorine-containing polymer comprising at least one fluorinated cure site monomer having a cure site; an group IIIB element-containing reinforcing additive in an amount of 8 to 15 weight parts with respect to 100 weight parts of the curable fluorine-containing polymer; and a curative configured for curing the at least one fluorinated cure site monomer.
    Type: Application
    Filed: August 24, 2022
    Publication date: February 29, 2024
    Inventors: CHUNG-MING HUANG, REN-GUAN DUAN, CHEN-HSIANG LU, TIEN-CHIH CHENG
  • Publication number: 20240071850
    Abstract: The present disclosure provides a semiconductor structure and a method of manufacturing a semiconductor structure. The semiconductor structure includes a substrate, semiconductor structures, an isolation layer, an adhesive layer, a metal layer, a metal nitride layer, a semiconductor layer, a profile modifier layer, and a disconnection structure. The semiconductor structures are disposed on the substrate. The isolation layer is disposed between the semiconductor structures. The metal layer is disposed on an adhesive layer. The metal nitride layer is disposed on the metal layer. The semiconductor layer is disposed on the metal nitride layer. The profile modifier layer is disposed on the semiconductor layer. The disconnection structure is disposed and extending from the profile modifier layer to the isolation layer. A first width of the disconnection structure in the profile modifier layer is substantially the same as a second width of the disconnection structure in the isolation layer.
    Type: Application
    Filed: August 29, 2022
    Publication date: February 29, 2024
    Inventors: FU-MING HSU, MING-JIE HUANG, ZHEN-CHENG WU, YUNG-CHENG LU
  • Patent number: 11916115
    Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a field plate. A gate structure overlies a substrate between a source region and a drain region. A drift region is disposed laterally between the gate structure and the drain region. A first dielectric layer overlies the substrate. A field plate is disposed within the first dielectric layer between the gate structure and the drain region. A conductive wire overlies the first dielectric layer and contacts the field plate. At least a portion of the conductive wire directly overlies a first sidewall of the drift region.
    Type: Grant
    Filed: August 19, 2021
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Cheng Ho, Ming-Ta Lei, Yu-Chang Jong
  • Patent number: 11916084
    Abstract: A transparent display panel with driving electrode regions, circuit wiring regions, and optically transparent regions is provided. The driving electrode regions are arranged into an array in a first direction and a second direction. An average light transmittance of the circuit wiring regions is less than ten percent, and an average light transmittance of the optically transparent regions is greater than that of the driving electrode regions and the circuit wiring regions. The first direction intersects the second direction. The circuit wiring regions connect the driving electrode regions at intervals, such that each optically transparent region spans among part of the driving electrode regions. The transparent display panel includes first signal lines and second signal lines extending along the circuit wiring regions, and each circuit wiring region is provided with at least one of the first signal lines and at least one of the second signal lines.
    Type: Grant
    Filed: August 24, 2022
    Date of Patent: February 27, 2024
    Assignee: AUO Corporation
    Inventors: Chun-Yu Lin, Kun-Cheng Tien, Jia-Long Wu, Ming-Lung Chen, Shu-Hao Huang
  • Patent number: 11916155
    Abstract: An optoelectronic package and a method for producing the optoelectronic package are provided. The optoelectronic package includes a carrier, a photonic device, a first encapsulant and a second encapsulant. The photonic device is disposed on the carrier. The first encapsulant covers the carrier and is disposed around the photonic device. The second encapsulant covers the first encapsulant and the photonic device. The first encapsulant has a topmost position and a bottommost position, and the topmost position is not higher than a surface of the photonic device.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: February 27, 2024
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Chien-Hsiu Huang, Bo-Jhih Chen, Kuo-Ming Chiu, Meng-Sung Chou, Wei-Te Cheng, Kai-Chieh Liang, Yun-Ta Chen, Yu-Han Wang
  • Patent number: 11908136
    Abstract: A respiratory status classifying method is for classifying as one of at least two respiratory statuses and includes an original physiological parameter inputting step, an original chest image inputting step, a characteristic physiological parameter generating step, a characteristic chest image generating step, a training step and a classifier generating step. The characteristic chest image generating step includes processing at least a part of the original chest images, segmenting images of a left lung, a right lung and a heart from each of the original chest images that are processed, and enhancing image data of the images being segmented, so as to generate a plurality of characteristic chest images. The training step includes training two respiratory status classifiers using a plurality of characteristic physiological parameters and the characteristic chest images by at least one machine learning algorithm.
    Type: Grant
    Filed: September 27, 2022
    Date of Patent: February 20, 2024
    Assignees: TAICHUNG VETERANS GENERAL HOSPITAL, TUNGHAI UNIVERSITY
    Inventors: Ming-Cheng Chan, Kai-Chih Pai, Wen-Cheng Chao, Yu-Jen Huang, Chieh-Liang Wu, Min-Shian Wang, Chien-Lun Liao, Ta-Chun Hung, Yan-Nan Lin, Hui-Chiao Yang, Ruey-Kai Sheu, Lun-Chi Chen
  • Patent number: 11897447
    Abstract: A method of operating a vehicle includes generating initial state of charge and vehicle velocity profiles for a travel route, for each initial velocity setpoint defining the vehicle velocity profile, generating a plurality of updated state of charge setpoints, for each of the initial velocity setpoints, selecting one of the updated state of charge setpoints to define an updated state of charge profile, for each of the updated state of charge setpoints that defines the updated state of charge profile, generating a plurality of updated velocity setpoints, for each of the updated state of charge setpoints that defines the updated state of charge profile, selecting one of the updated velocity setpoints to define an updated velocity profile, and controlling operation of an electric machine and engine according to the updated state of charge profile and updated velocity profile over the travel route.
    Type: Grant
    Filed: December 1, 2020
    Date of Patent: February 13, 2024
    Assignee: Ford Global Technologies, LLC
    Inventors: Ming Cheng, Bokai Chen, Yousaf Rahman, Ming Lang Kuang
  • Patent number: 11901261
    Abstract: A reusable holding component is provided. The reusable holding component may comprise a frame with a fastener receiving opening extending from a first surface of the frame to a second surface of the frame, and at least two pins disposed on and extending away from the second surface of the frame, wherein each of the at least two pins includes a head portion, at least one elongated segment connected to a portion of the head portion, and a hook disposed on the at least one elongated segment. A heat transfer device and an electronic device with a heatsink are also provided.
    Type: Grant
    Filed: October 4, 2019
    Date of Patent: February 13, 2024
    Assignee: Illinois Tool Works Inc.
    Inventor: Ming-Cheng Lin
  • Patent number: 11903157
    Abstract: A reusable holding component is provided. The reusable holding component may comprise a frame with a fastener receiving opening extending from a first surface of the frame to a second surface of the frame, and at least one pin disposed on and extending away from the second surface of the frame, wherein the at least one pin includes at least two elongated segments with hooks disposed on a head portion of each of the at least two elongated segments. A heat transfer device and an electronic device with a heatsink are also provided.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: February 13, 2024
    Assignee: Illinois Tool Works Inc.
    Inventor: Ming-Cheng Lin
  • Publication number: 20240049433
    Abstract: A heat-dissipating net structure disposed in a vapor chamber unit includes latitudinal strand units and longitudinal strand units crossing each other. Each latitudinal strand unit has a single latitudinal strand extending in a first direction. Each longitudinal strand unit has at least two longitudinal strands extending in a second direction different from the first direction, with the longitudinal strands passing over and under the latitudinal strand units and twisting densely in the second direction to form a plurality of crossing points between the longitudinal strands because of the twisting arrangement. The twisting arrangement of the longitudinal strands prevents unnecessary spaces formed between any two adjacent longitudinal strand units, improves the capillary phenomenon of working fluid within the vapor chamber unit, and facilitates the phase transition of the working fluid, thereby attaining the effect of dissipating heat quickly.
    Type: Application
    Filed: August 3, 2022
    Publication date: February 8, 2024
    Inventor: MING-CHENG CHEN
  • Publication number: 20240040751
    Abstract: A heat conducting member is provided. The heat conducting member provided in this application includes a substrate and a heat conducting layer. The substrate includes a heat conducting surface. The heat conducting layer includes a transition layer and a protective layer. The transition layer is disposed on the heat conducting surface, and the protective layer is disposed on a surface that is of the transition layer and that is away from the heat conducting surface. Roughness Ra of the protective layer is less than or equal to 0.4. The transition layer can provide a hardness transition function between the substrate and the protective layer, to facilitate improving overall hardness of the heat conducting member. The protective layer may ensure surface hardness, to prevent an undesirable situation such as a scratch.
    Type: Application
    Filed: October 11, 2023
    Publication date: February 1, 2024
    Inventors: Ming CHENG, Buping YUAN, Chengpeng YANG, Yuping HONG, Qinghe ZHANG
  • Publication number: 20240030838
    Abstract: A power generation device and method based on the time-varying magductance principle relate to the field of energy conversion, and in particular relate to an electromagnetic induction power generation device. The power generation device includes an electric energy generation unit, a power conversion unit and an electric energy storage unit. The electric energy generation unit includes a time-varying magductance component configured to form a closed conductor loop in a magnetic circuit with constant magnetic flux. By changing a magductance parameter of the time-varying magductance component, the time-varying magductance component generates induced current. The power conversion unit consists of a switching device and a circuit. The electric energy generated by the time-varying magductance component can be stored into the electric energy storage unit through controlling the switching device.
    Type: Application
    Filed: July 27, 2022
    Publication date: January 25, 2024
    Inventors: Ming CHENG, Wei QIN, Xinkai ZHU, Zheng WANG, Wei HUA
  • Publication number: 20240028170
    Abstract: A touch device includes a display panel, a conductive layer, and a first touch substrate. The display panel includes a first substrate. The conductive layer is disposed on a first surface of the first substrate. The first touch substrate is disposed on the conductive layer and includes a first touch electrode.
    Type: Application
    Filed: June 19, 2023
    Publication date: January 25, 2024
    Applicant: Innolux Corporation
    Inventors: Ming-Cheng Hsieh, Tsan-Po Weng
  • Publication number: 20240019491
    Abstract: A die-level electrical parameter extraction method includes: obtaining electrical parameters of a plurality of transistor types; obtaining measurement results of a plurality of logic blocks; estimating a mapping relationship between the electrical parameters of the plurality of transistor types and the measurement results of the plurality of logic blocks; and regarding a specific die of a wafer, obtaining die-level measurement of the plurality of logic blocks, and generating die-level electrical parameters of the plurality of transistor types according to the mapping relationship and the die-level measurement results.
    Type: Application
    Filed: June 7, 2023
    Publication date: January 18, 2024
    Applicant: MEDIATEK INC.
    Inventors: Jia-Horng Shieh, Po-Chao Tsao, Ming-Cheng Lee, Tung-Hsing Lee, Chi-Ming Lee, Yi-Ju Ting
  • Publication number: 20240014136
    Abstract: A semiconductor device includes: first and second active regions (ARs) included correspondingly in abutting first and second analog cell regions, a region where the first and second analog cell regions abut (analog-cell-boundary (ACB) region) extending from about a top boundary of the first AR to about a bottom boundary of the second AR; via-to-PGBM_1st-segment contact structures (VBs) correspondingly being under the first or second ARs, a long axis of each VB and a short axis of each of the first and second ARs having about a same length; and a PG segment in a first buried metallization layer (PGBM_1st segment) under the VBs, the PGBM_1st segment underlapping a majority of each of the VBs, and a Y-midline of the PGBM_1st segment being at or proximal to where the first and second analog cell regions abut and thus being at or proximal to a middle of the ACB region.
    Type: Application
    Filed: January 23, 2023
    Publication date: January 11, 2024
    Inventors: Ming-Cheng SYU, Yu-Tao YANG, Chung-Ting LU, Po-Zeng KANG, Amit KUNDU, Wen-Shen CHOU, Yung-Chow PENG
  • Patent number: 11867506
    Abstract: A scanning device applied to an optical coherence tomography system integrates a scanning lens group required by the coherence tomography system into a fundus imaging system, so that the coherence tomography system and the fundus imaging system can share the scanning lens group for focusing. The above-mentioned scanning device can shorten a response time of focusing and reduce the volume of the system. An optical coherence tomography system including the above-mentioned scanning device is also disclosed.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: January 9, 2024
    Assignee: MEDIMAGING INTEGRATED SOLUTION, INC.
    Inventors: Chu-Ming Cheng, Long-Sheng Liao
  • Publication number: 20240000241
    Abstract: A foldable infant carry cot including at least one cushion disposed on an interior side of the carry cot, the at least one cushion including a plurality of removably attachable fasteners for attaching the at least one cushion to a side wall of the carry cot; and a foldable frame allowing the carry cot to fold and collapse. The at least one cushion includes a shock-absorbing component that absorbs impact coming from any of the sides of the carry cot. The foldable frame comprises an upper frame, a lower frame, a flexible sidewall disposed between the upper frame and the lower frame, a rotating carrying handle, and a plurality of hinges disposed between the upper frame and the lower frame.
    Type: Application
    Filed: November 9, 2021
    Publication date: January 4, 2024
    Inventors: Chin-ming CHENG, Kwang-hao LIU
  • Patent number: 11862902
    Abstract: An electrical connector with electromagnetic shielding function includes a circuit board, a plurality of cables and a shielding component. The circuit board includes a plurality of conductive pads and a ground component. Each of cables includes a wire core and a shielding layer for covering the wire core. One end of the wire core is exposed from the shielding layer, and the wire cores of the cables are electrically connected to the conductive pads respectively. The shielding component is configured on the circuit board and electrically connected to the ground component. The shielding component forms a plurality of shielding grooves for covering the conductive pads and the cables. Each of the shielding grooves includes a contact portion configured to contact the shielding layer and a shielding portion configured to cover the exposed wire core of the cables to provide electromagnetic shielding to the cables.
    Type: Grant
    Filed: January 25, 2022
    Date of Patent: January 2, 2024
    Assignee: JESS-LINK PRODUCTS CO., LTD.
    Inventor: Chieh-Ming Cheng
  • Publication number: 20230416765
    Abstract: Agrobacterium rhizogenes are described herein along with methods of transforming cells and methods of using Agrobacterium rhizogenes and/or transformed cells. Also described herein are plants, such as plants in the Rubus family, including a modified nucleic acid, optionally wherein the plants are transgene-free and include a modified nucleic acid.
    Type: Application
    Filed: November 23, 2021
    Publication date: December 28, 2023
    Inventors: Fang-Ming Lai, Eric Dean, Ming Cheng, Joel Reiner, Qingchun Shi, David Schwark, Sharon Leigh Guffy, Aaron Hummel
  • Publication number: 20230420387
    Abstract: A chip package includes a semiconductor substrate, a first light-transmissive sheet, a second light-transmissive sheet, a first antenna layer, and a redistribution layer. The first light-transmissive sheet is disposed over the semiconductor substrate, and has a top surface facing away from semiconductor substrate and an inclined sidewall adjacent to the top surface. The second light-transmissive sheet is disposed over the first light-transmissive sheet. The first antenna layer is disposed between the first light-transmissive sheet and the second light-transmissive sheet. The redistribution layer is disposed on the inclined sidewall of the first light-transmissive sheet, and is in contact with an end of the first antenna layer.
    Type: Application
    Filed: September 7, 2023
    Publication date: December 28, 2023
    Inventors: Chia-Ming CHENG, Shu-Ming CHANG