Patents by Inventor Ming-Chih Lai
Ming-Chih Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240088095Abstract: A method for forming a chip package structure. The method includes bonding first connectors over a front surface of a semiconductor wafer. The method also includes dicing the semiconductor wafer from a rear surface of the semiconductor wafer to form semiconductor dies and mounting first and second semiconductor dies in the semiconductor dies over a top surface of the interposer substrate. The method further forming an encapsulating layer over the top surface of the interposer substrate to cover the first semiconductor die and the second semiconductor die. A first sidewall of the first semiconductor die faces a second sidewall of the second semiconductor die, and upper portions of the first sidewall and the second sidewall have a tapered contour, to define a top die-to-die distance and a bottom die-to-die distance that is less than the top die-to-die distance.Type: ApplicationFiled: November 24, 2023Publication date: March 14, 2024Inventors: Chin-Hua WANG, Shin-Puu JENG, Po-Yao LIN, Po-Chen LAI, Shu-Shen YEH, Ming-Chih YEW, Yu-Sheng LIN
-
Patent number: 11146137Abstract: A coil insulation structure for a rotating machine provided in the present invention is based on a conventional insulation technology. In particular, tooth portions of an iron core in which coil windings are inserted have a straight tooth structure without a shoe portion, and a component with an insulation effect is further added at a position of an opening of a groove in which the coil winding is located, so that an insulation effect is improved, and at the same time an added insulation component is used to ensure a thickness and a size of an inner layer located at a position adjacent to an air gap of a motor when the coil winding is encapsulated, thereby improving product quality.Type: GrantFiled: June 3, 2019Date of Patent: October 12, 2021Assignee: HIWIN MIKROSYSTEM CORP.Inventors: Chia-Siang Lien, Cheng-Hsun Pan, Ming-Chih Lai
-
Publication number: 20200381971Abstract: A coil insulation structure for a rotating machine provided in the present invention is based on a conventional insulation technology. In particular, tooth portions of an iron core in which coil windings are inserted have a straight tooth structure without a shoe portion, and a component with an insulation effect is further added at a position of an opening of a groove in which the coil winding is located, so that an insulation effect is improved, and at the same time an added insulation component is used to ensure a thickness and a size of an inner layer located at a position adjacent to an air gap of a motor when the coil winding is encapsulated, thereby improving product quality.Type: ApplicationFiled: June 3, 2019Publication date: December 3, 2020Inventors: Chia-Siang LIEN, Cheng-Hsun PAN, Ming-Chih LAI
-
Publication number: 20190243079Abstract: The present invention is a flip-chip photodetector, comprising a carrier and a back-illuminated chip having a central portion and a peripheral portion, wherein the central portion has a greater thickness than the peripheral portion; the peripheral portion is provided with a plurality of metal pillars connected to the carrier, and the back illuminated chip is connected to the carrier by the plurality of metal pillars; further, the plurality of the metal pillars are provided on the back-illuminated chip by electroless plating.Type: ApplicationFiled: June 19, 2018Publication date: August 8, 2019Inventors: Kuo-Hao LEE, Tsung-Chi HSU, Ming-Chih LAI
-
Patent number: 10283652Abstract: The present invention provides an electrode stack structure capable of preventing moisture from entering a photodiode, comprising: a semiconductor layer; an inner electrode layer provided on the semiconductor layer; a dielectric layer coating a sidewall of the semiconductor layer; an intermediate metal layer provided on, bonded to, and in electrical conduction with the inner electrode layer, wherein the intermediate metal layer has a bottom side extending over and covering a portion of the dielectric layer to provide airtightness; and an anti-reflection layer coating on an outer side of the semiconductor layer, an outer side of the intermediate metal layer, and an outer side of the dielectric layer, with a groove formed in the anti-reflection layer by leaving a predetermined area of a top side of the intermediate metal layer uncoated or by removing a portion of the anti-reflection layer that coats the predetermined area of the top side of the intermediate metal layer, and an outer electrode layer plated on thType: GrantFiled: June 19, 2018Date of Patent: May 7, 2019Assignee: LUXNET CORPORATIONInventors: Kuo-Hao Lee, Tsung-Chi Hsu, Ming-Chih Lai
-
Publication number: 20160141928Abstract: A rotor structure of interior-permanent-magnet motor includes an iron core member and multiple permanent magnets embedded in the iron core member in the form of a spoke. One end of each magnet near the curvature center of the iron core member is positioned in the space of a corresponding end socket. The space of the end socket restricts the path of the magnetic lines of the magnet and concentrates the magnetic lines to increase the magnetic flux density and enhance the counter potential, whereby the thrust is increased.Type: ApplicationFiled: November 13, 2014Publication date: May 19, 2016Inventors: Ming-Chih LAI, Chia-Hsiang LIEN
-
Patent number: 9086199Abstract: A lighting device installation method includes the following steps. Firstly, a holder including a first stopping structure and a first engaging structure is fixed on an installation surface. Then, a lighting device including a second stopping structure and a third stopping structure is provided. The second stopping structure and the third stopping structure are collaboratively defined as a second engaging structure. Then, the second engaging structure of the lighting device is stopped by the first stopping structure of the holder, so that the lighting device is supported by the lower portion of the holder. Then, electrical connection between the lighting device and a power source is established. Afterwards, the second engaging structure of the lighting device is engaged with the first engaging structure of the holder, so that the lighting device is supported by the upper portion of the holder.Type: GrantFiled: August 29, 2013Date of Patent: July 21, 2015Assignee: Lite-On Technology CorporationInventors: Shih-Chang Wang, Po-Chang Li, Ming-Chun Wu, Pin-Hao Hsu, Ming-Chih Lai
-
Patent number: 9062865Abstract: A housing of light emitting device including a first part for accommodating a light emitting diode module and providing a space for heat dissipation is disclosed. The first part includes an outline casing forming an enclosed room and at least one heat conductive structure disposed inside the enclosed room. The heat conductive structure couples to a heat dissipating side and a light emitting side of the outline casing.Type: GrantFiled: December 27, 2012Date of Patent: June 23, 2015Assignee: Lite-On Technology CorporationInventors: Shih-Chang Wang, Po-Chang Li, Ming-Chih Lai, Pin-Hao Hsu
-
Patent number: 9052073Abstract: An assembly structure of light-guiding cover is used in a lighting device. The lighting device comprises a light-emitting element. The assembly structure comprises a casing and a light-guiding cover. The casing has a receiving recess and a first engaging groove and a second engaging groove opposite to the first engaging groove, the light-emitting element is disposed within the receiving recess, and the first engaging groove and the second engaging groove are located at opposite two sides of the receiving recess. The light-guiding cover covers the receiving recess and has at least one aperture corresponding to the light-emitting element, wherein the light-guiding cover comprises a first engaging sheet and a second engaging sheet. The first engaging sheet is engaged with the first engaging groove. The second engaging sheet is disposed opposite to the first engaging sheet and engaged with the second engaging groove.Type: GrantFiled: May 3, 2013Date of Patent: June 9, 2015Assignee: Lite-On Technology CorporationInventors: Shih-Chang Wang, Po-Chang Li, Ming-Chih Lai, Pin-Hao Hsu
-
Publication number: 20150062932Abstract: A lighting device installation method includes the following steps. Firstly, a holder including a first stopping structure and a first engaging structure is fixed on an installation surface. Then, a lighting device including a second stopping structure and a third stopping structure is provided. The second stopping structure and the third stopping structure are collaboratively defined as a second engaging structure. Then, the second engaging structure of the lighting device is stopped by the first stopping structure of the holder, so that the lighting device is supported by the lower portion of the holder. Then, electrical connection between the lighting device and a power source is established. Afterwards, the second engaging structure of the lighting device is engaged with the first engaging structure of the holder, so that the lighting device is supported by the upper portion of the holder.Type: ApplicationFiled: August 29, 2013Publication date: March 5, 2015Applicant: LEOTEK Electronics CorporationInventors: Shih-Chang Wang, Po-Chang Li, Ming-Chun Wu, Pin-Hao Hsu, Ming-Chih Lai
-
Publication number: 20140254149Abstract: An assembly structure of light-guiding cover is used in a lighting device. The lighting device comprises a light-emitting element. The assembly structure comprises a casing and a light-guiding cover. The casing has a receiving recess and a first engaging groove and a second engaging groove opposite to the first engaging groove, the light-emitting element is disposed within the receiving recess, and the first engaging groove and the second engaging groove are located at opposite two sides of the receiving recess. The light-guiding cover covers the receiving recess and has at least one aperture corresponding to the light-emitting element, wherein the light-guiding cover comprises a first engaging sheet and a second engaging sheet. The first engaging sheet is engaged with the first engaging groove. The second engaging sheet is disposed opposite to the first engaging sheet and engaged with the second engaging groove.Type: ApplicationFiled: May 3, 2013Publication date: September 11, 2014Applicant: LEOTEK Electronics CorporationInventors: Shih-Chang WANG, Po-Chang Li, Ming-Chih Lai, Pin-Hao Hsu
-
Patent number: 8545946Abstract: A liquid crystal alignment solution is provided, including at least one polymer selected from the group consisting of a polyamide acid-polyamide acid polymer represented by formula (A), a polyimide-polyamide acid polymer represented by formula (B) and a polyimide-polyimide polymer represented by formula (C), as defined in the contexts.Type: GrantFiled: March 25, 2010Date of Patent: October 1, 2013Assignee: Daxin Materials CorporationInventors: Min-Ruei Tsai, Wen-Chung Chu, Chia-Wen Chang, Ming-Chih Lai
-
Publication number: 20130235595Abstract: A housing of light emitting device including a first part for accommodating a light emitting diode module and providing a space for heat dissipation is disclosed. The first part includes an outline casing forming an enclosed room and at least one heat conductive structure disposed inside the enclosed room. The heat conductive structure couples to a heat dissipating side and a light emitting side of the outline casing.Type: ApplicationFiled: December 27, 2012Publication date: September 12, 2013Applicant: Leotek Electronics CorporationInventors: Shih-Chang WANG, Po-Chang Li, Ming-Chih Lai, Pin-Hao Hsu
-
Patent number: 8427143Abstract: A fixing structure for signal wires of a resolver is disposable on an end face of a stator of the resolver. The fixing structure includes a circuit board, a fixing section disposed on the circuit board for connecting the circuit board to the end face of the stator, a connection terminal seat disposed on the circuit board, multiple connection sections formed through the circuit board in the form of holes, and multiple bridge circuits respectively arranged between the corresponding connection sections and the connection terminal seat for bridging the corresponding connection sections and the connection terminal seat.Type: GrantFiled: March 7, 2011Date of Patent: April 23, 2013Assignee: Hiwin Mikrosystem Corp.Inventors: Ming-Chih Lai, Chi-Lu Li, Chih-Yu Wang
-
Publication number: 20120229124Abstract: A fixing structure for signal wires of a resolver is disposable on an end face of a stator of the resolver. The fixing structure includes a circuit board, a fixing section disposed on the circuit board for connecting the circuit board to the end face of the stator, a connection terminal seat disposed on the circuit board, multiple connection sections formed through the circuit board in the form of holes, and multiple bridge circuits respectively arranged between the corresponding connection sections and the connection terminal seat for bridging the corresponding connection sections and the connection terminal seat.Type: ApplicationFiled: March 7, 2011Publication date: September 13, 2012Inventors: Ming-Chih Lai, Chi-Lu Li, Chih-Yu Wang
-
Publication number: 20110108416Abstract: A magnetron sputter comprises a carrier, a magnet assembly, at least a middle magnetic ring, a target and at least a conducting magnetic ring. The magnet assembly is disposed on a carrying surface of the carrier comprising a permanent magnet and an external magnetic ring. The middle magnetic ring is disposed between the permanent magnet and the external magnetic ring of the magnet assembly. The target is disposed above the magnet assembly having a first surface which faces the carrying surface. The conducting magnetic ring is disposed on the first surface.Type: ApplicationFiled: November 10, 2009Publication date: May 12, 2011Inventors: Cheng-Tsung LIU, Ming-Chih Lai
-
Patent number: 7914863Abstract: A liquid crystal alignment solution is provided. The liquid crystal alignment solution includes a first polyimide-polyamide acid and a second polyimide-polyamide acid. The first polyimide-polyamide acid is represented by formula (A), and the second polyimide-polyamide acid is represented by formula (B), in which T1, T2, T3 and T4 are each independently a tetravalent residue of a tetracarboxylic acid dianhydride; D1, D2, D3 and D4 are each independently a divalent residue of a diamine; and m, n, p and q are each independently an positive integer, wherein m/(m+n)?0.5 and p/(p+q)?0.5.Type: GrantFiled: January 21, 2009Date of Patent: March 29, 2011Assignee: Daxin Material CorporationInventors: Ming-Chih Lai, Wen-Chung Chu, Chin-Wen Chang, Min-Ruei Tsai
-
Publication number: 20100243955Abstract: A liquid crystal alignment solution is provided. The liquid crystal alignment solution includes at least one polymer selected from the group consisting of a polyamide acid-polyamide acid polymer represented by formula (A), a polyimide-polyamide acid polymer represented by formula (B) and a polyimide-polyimide polymer represented by formula (C), in which T1 and T2 are each independently a tetravalent organic group; m<n; p<q; r<s; and at least one of D1 and D2 is selected from the group consisting of formulae (1) to (15).Type: ApplicationFiled: March 25, 2010Publication date: September 30, 2010Applicant: DAXIN MATERIALS CORPORATIONInventors: Min-Ruei Tsai, Wen-Chung Chu, Chia-Wen Chang, Ming-Chih Lai
-
Publication number: 20090194737Abstract: A liquid crystal alignment solution is provided. The liquid crystal alignment solution includes a first polyimide-polyamide acid and a second polyimide-polyamide acid. The first polyimide-polyamide acid is represented by formula (A), and the second polyimide-polyamide acid is represented by formula (B), in which T1, T2, T3 and T4 are each independently a tetravalent residue of a tetracarboxylic acid dianhydride; D1, D2, D3 and D4 are each independently a divalent residue of a diamine; and m, n, p and q are each independently an positive integer, wherein m/(m+n)?0.5 and p/(p+q)?0.5.Type: ApplicationFiled: January 21, 2009Publication date: August 6, 2009Applicant: Daxin Material CorporationInventors: Ming-Chih Lai, Wen-Chung Chu, Chin-Wen Chang, Min-Ruei Tsai
-
Patent number: 7402693Abstract: The invention provides a cyclobutanetetracarboxylate compound of general formula (I) and a preparation method thereof: in which R and R1 are as defined in the specification.Type: GrantFiled: August 2, 2007Date of Patent: July 22, 2008Assignee: Daxin Material CorporationInventors: Ming-Chih Lai, Chia-Wen Chang, Chi-Wi Ong