Patents by Inventor Ming-Chih Tsai
Ming-Chih Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10823691Abstract: A sensor, a composite material and a method of manufacturing the same are provided. The sensor includes a first electrode, a second electrode, and a sensing material layer. The first electrode and the second electrode are separated from each other. The sensing material layer is located between the first electrode and the second electrode and covers the first electrode and the second electrode. The sensing material layer includes the composite material including a conductive polymer and a metal oxide. The conductive polymer has a hydrophilic end. The metal oxide is connected to the hydrophilic end of the conductive polymer. The metal oxide includes a metal oxide precursor.Type: GrantFiled: January 5, 2018Date of Patent: November 3, 2020Assignee: Winbond Electronics Corp.Inventors: Ming-Chih Tsai, Yu-Hsuan Ho
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Patent number: 10818497Abstract: The present invention provides a patterned structure for an electronic device and a manufacturing method thereof. The patterned structure includes a patterned layer, a blocking structure, a cantilever structure, and a connection structure. The patterned layer is disposed on a substrate. The blocking structure is disposed on the substrate at one side of the patterned layer, wherein a thickness of the blocking structure is smaller than a thickness of the patterned layer. The cantilever structure is disposed on the substrate and located between the patterned layer and the blocking structure. The cantilever structure is connected with the patterned layer and the blocking structure. The connection structure is connected between the patterned layer and the substrate at one side of the patterned layer, and located on the cantilever structure and the blocking structure.Type: GrantFiled: August 21, 2017Date of Patent: October 27, 2020Assignee: Winbond Electronics Corp.Inventors: Yen-Jui Chu, Hsin-Hung Chou, Ming-Chih Tsai
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Patent number: 10788521Abstract: A resistive environmental sensor including an electrode stack and a sensing layer is provided. The electrode stack includes a first electrode layer, a second electrode layer, and a dielectric layer disposed between the first and second electrode layers, wherein the electrode stack includes a side surface, and the first and second electrode layers are exposed on the side surface of the electrode stack. The sensing layer is disposed on the side surface of the electrode stack, and the sensing layer s in contact with the first and second electrode layers. An environmental variation is inspected by sensing a resistance variation of the sensing layer that is between the first and second electrode layers. The above-mentioned sensor is capable of sensing gases, light, humidity, temperature, and so on. The above-mentioned sensor has advantages of low resistivity and good sensitivity.Type: GrantFiled: October 18, 2017Date of Patent: September 29, 2020Assignee: Winbond Electronics Corp.Inventors: Yu-Hsuan Ho, Ming-Chih Tsai
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Patent number: 10697919Abstract: A reduction-oxidation sensor device and a manufacturing method thereof are provided. The reduction-oxidation sensor device includes a first electrode, at least one sensing structure and a second electrode. The first electrode is located on a substrate. The at least one sensing structure is located on the first electrode and the substrate. The at least one sensing structure includes a metal nanowire layer and a metal oxide layer. The metal nanowire layer is disposed on the first electrode and the substrate. The metal nanowire layer is wrapped by the metal oxide layer. The second electrode is located on the at least one sensing structure.Type: GrantFiled: January 11, 2018Date of Patent: June 30, 2020Assignee: Winbond Electronics Corp.Inventors: Ming-Chih Tsai, Yu-Hsuan Ho, Yen-Jui Chu, Ming-Hung Hsieh
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Patent number: 10697753Abstract: A strain sensing device and a manufacturing method thereof are provided in the invention. The strain sensing device includes a substrate and at least one sensing electrode. The substrate has a plurality of pores. A material of the substrate includes nanocellulose, and the substrates is strained in response to changes in external conditions. The at least one sensing electrode is disposed on the substrate, wherein the sensing electrode contacting the substrate extends into the pores of the substrate. The at least one sensing electrode has a major axis parallel to a surface of the substrate. A resistance value of the at least one sensing electrode changes in response to a strain of the substrate.Type: GrantFiled: January 11, 2018Date of Patent: June 30, 2020Assignee: Winbond Electronics Corp.Inventors: Ming-Chih Tsai, Yu-Hsuan Ho
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Patent number: 10527504Abstract: A transparent pressure sensor and a manufacturing method thereof are provided. The transparent pressure sensor includes several layers of transparent electrodes, at least one pressure-sensitive deformation layer between the transparent electrodes, and a metal oxide layer. Each layer of the transparent electrodes is composed of nanowires, and the metal oxide layer is disposed in a space among the nanowires.Type: GrantFiled: August 17, 2017Date of Patent: January 7, 2020Assignee: Winbond Electronics Corp.Inventors: Yu-Hsuan Ho, Ming-Chih Tsai, Ming-Hung Hsieh
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Patent number: 10473607Abstract: A gas sensor includes a first substrate, at least one first electrode, a sensing structure, at least one second electrode, and a second substrate. The at least one first electrode is located on the first substrate. The sensing structure is located on the at least one first electrode and the first substrate, and the sensing structure includes a first semiconductor layer and a second semiconductor layer. The first semiconductor layer having a first conductive type covers the first substrate and the at least one first electrode; the second semiconductor layer having a second conductive type is located on the first semiconductor layer. The at least one second electrode covers the sensing structure. The second substrate covers the at least one second electrode and the sensing structure.Type: GrantFiled: August 4, 2017Date of Patent: November 12, 2019Assignee: Winbond Electronics Corp.Inventors: Ming-Chih Tsai, Yu-Hsuan Ho
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Patent number: 10453620Abstract: A perovskite composite structure is provided. The perovskite composite structure includes a light absorption layer and a sterically-hindered layer disposed in the periphery of the light absorption layer. The light absorption layer includes a perovskite material. The sterically-hindered layer includes a two-dimensional material.Type: GrantFiled: November 9, 2017Date of Patent: October 22, 2019Assignee: Winbond Electronics Corp.Inventors: Ming-Chih Tsai, Yu-Hsuan Ho
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Patent number: 10401200Abstract: A multifunctional sensor including a substrate, a first sensing structure, a dielectric layer and a second sensing structure is provided. The first sensing structure is disposed on the substrate. The dielectric layer is disposed on the first sensing structure. The second sensing structure is disposed on the dielectric layer. The first sensing structure and the second sensing structure are located on the same side of the substrate.Type: GrantFiled: August 16, 2017Date of Patent: September 3, 2019Assignee: Winbond Electronics Corp.Inventors: Ming-Chih Tsai, Yu-Hsuan Ho
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Patent number: 10323996Abstract: A pressure sensor and a manufacturing method thereof are provided. The pressure sensor includes a thin-film transistor (TFT) array and a pressure-sensitive layer covering the TFT array. The pressure-sensitive layer includes a plurality of insulating layers and one of one-directional materials arranged on the same plane and two-directional materials. The insulating layers and the one- or two-directional materials are alternately stacked so as to effectively enhance pressure resolution.Type: GrantFiled: August 7, 2017Date of Patent: June 18, 2019Assignee: Winbond Electronics Corp.Inventors: Yu-Hsuan Ho, Ming-Chih Tsai, Ming-Hung Hsieh
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Patent number: 10282964Abstract: A gas detecting device configured to be attached to a surface includes a substrate, a semiconductor layer, a light-emitting component, a first electrode and a second electrode. The substrate includes a plurality of stacking layers stacked onto one another, and a material of the substrate includes cellulose nanofibrils (CNF). The substrate is formed by 3-D printing, such that a contact surface of the substrate is tightly attached to the surface. The semiconductor layer is formed on the substrate by 3-D printing. The light-emitting component is disposed on the substrate. The first electrode is coupled to the semiconductor layer and the light-emitting component. The second electrode is coupled to the semiconductor layer and a ground electrode. The first electrode and the second electrode are both disposed on the semiconductor layer and maintain a gap therebetween. A resistance of the semiconductor layer is changed according to a concentration of a designated gas.Type: GrantFiled: May 15, 2017Date of Patent: May 7, 2019Assignee: Winbond Electronics Corp.Inventors: Ming-Hung Hsieh, Yu-Hsuan Ho, Ming-Chih Tsai, Yen-Jui Chu
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Patent number: 10277995Abstract: A bone-conduction hearing aid device is provided. The bone-conduction hearing aid device is suitable for being attached to a body surface and includes a substrate, an input transducer, an amplifier, and a bone-conduction speaker. The substrate is composed of a plurality of stacking layers stacked on top of one another. A material of the substrate includes cellulose nanofiber. The substrate is formed by 3D printing technique so that a contact surface of the substrate is tightly attached with the body surface. The input transducer is disposed on the substrate and configured to receive a sound signal and convert the sound signal into an electric signal. The amplifier is disposed on the substrate and coupled to the input transducer to amplify the electric signal into an amplified electric signal. The bone-conduction speaker is disposed on the substrate and coupled to the amplifier to convert the amplified electric signal into a vibration signal.Type: GrantFiled: November 24, 2017Date of Patent: April 30, 2019Assignee: Winbond Electronics Corp.Inventors: Ming-Hung Hsieh, Yu-Hsuan Ho, Ming-Chih Tsai, Yen-Jui Chu
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Publication number: 20180362736Abstract: A composite material including a nanocellulose core and a metal shell is provided. The metal shell covers a surface of the nanocellulose core. The composite material is nanosized and has high mechanical strength. Additionally, a method of manufacturing the composite material is also provided.Type: ApplicationFiled: January 14, 2018Publication date: December 20, 2018Applicant: Winbond Electronics Corp.Inventors: Ming-Chih Tsai, Yu-Hsuan Ho
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Publication number: 20180238750Abstract: A pressure sensor and a manufacturing method thereof are provided. The pressure sensor includes a first electrode, a pressure-sensitive layer covering the first electrode, and a second electrode covering the pressure-sensitive layer. A support material is contained in the pressure-sensitive layer, and the support material is a nano-sized material with an aspect ratio between 100 and 5000. Mechanical property of the pressure-sensitive layer in the pressure sensor can be improved by the property of the nano-sized material.Type: ApplicationFiled: December 18, 2017Publication date: August 23, 2018Applicant: Winbond Electronics Corp.Inventors: Yu-Hsuan Ho, Ming-Chih Tsai, Ming-Hung Hsieh
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Publication number: 20180240607Abstract: A perovskite composite structure is provided. The perovskite composite structure includes a light absorption layer and a sterically-hindered layer disposed in the periphery of the light absorption layer. The light absorption layer includes a perovskite material. The sterically-hindered layer includes a two-dimensional material.Type: ApplicationFiled: November 9, 2017Publication date: August 23, 2018Applicant: Winbond Electronics Corp.Inventors: Ming-Chih Tsai, Yu-Hsuan Ho
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Publication number: 20180234779Abstract: A bone-conduction hearing aid device is provided. The bone-conduction hearing aid device is suitable for being attached to a body surface and includes a substrate, an input transducer, an amplifier, and a bone-conduction speaker. The substrate is composed of a plurality of stacking layers stacked on top of one another. A material of the substrate includes cellulose nanofiber. The substrate is formed by 3D printing technique so that a contact surface of the substrate is tightly attached with the body surface. The input transducer is disposed on the substrate and configured to receive a sound signal and convert the sound signal into an electric signal. The amplifier is disposed on the substrate and coupled to the input transducer to amplify the electric signal into an amplified electric signal. The bone-conduction speaker is disposed on the substrate and coupled to the amplifier to convert the amplified electric signal into a vibration signal.Type: ApplicationFiled: November 24, 2017Publication date: August 16, 2018Applicant: Winbond Electronics Corp.Inventors: Ming-Hung Hsieh, Yu-Hsuan Ho, Ming-Chih Tsai, Yen-Jui Chu
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Publication number: 20180231481Abstract: A gas sensor includes a first substrate, at least one first electrode, a sensing structure, at least one second electrode, and a second substrate. The at least one first electrode is located on the first substrate. The sensing structure is located on the at least one first electrode and the first substrate, and the sensing structure includes a first semiconductor layer and a second semiconductor layer. The first semiconductor layer having a first conductive type covers the first substrate and the at least one first electrode; the second semiconductor layer having a second conductive type is located on the first semiconductor layer. The at least one second electrode covers the sensing structure. The second substrate covers the at least one second electrode and the sensing structure.Type: ApplicationFiled: August 4, 2017Publication date: August 16, 2018Applicant: Winbond Electronics Corp.Inventors: Ming-Chih Tsai, Yu-Hsuan Ho
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Publication number: 20180231403Abstract: A multifunctional sensor including a substrate, a first sensing structure, a dielectric layer and a second sensing structure is provided. The first sensing structure is disposed on the substrate. The dielectric layer is disposed on the first sensing structure. The second sensing structure is disposed on the dielectric layer. The first sensing structure and the second sensing structure are located on the same side of the substrate.Type: ApplicationFiled: August 16, 2017Publication date: August 16, 2018Applicant: Winbond Electronics Corp.Inventors: Ming-Chih Tsai, Yu-Hsuan Ho
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Publication number: 20180224416Abstract: A gas sensor including a substrate, an output layer, a sensing layer, and a nanoporous polymer film is provided. The output layer is disposed on the substrate. The sensing layer is disposed on the output layer. The nanoporous polymer film is disposed on the sensing layer.Type: ApplicationFiled: September 5, 2017Publication date: August 9, 2018Applicant: Winbond Electronics Corp.Inventors: Ming-Chih Tsai, Yu-Hsuan Ho
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Publication number: 20180209864Abstract: A pressure sensor and a manufacturing method thereof are provided. The pressure sensor includes a thin-film transistor (TFT) array and a pressure-sensitive layer covering the TFT array. The pressure-sensitive layer includes a plurality of insulating layers and one of one-dimensional materials arranged on the same plane and two-dimensional materials. The insulating layers and the one- or two-dimensional materials are alternately stacked so as to effectively enhance pressure resolution.Type: ApplicationFiled: August 7, 2017Publication date: July 26, 2018Applicant: Winbond Electronics Corp.Inventors: Yu-Hsuan Ho, Ming-Chih Tsai, Ming-Hung Hsieh