Abstract: A dot projector with automatic power control includes a housing covering a substrate with an installing space and a platform therein, an automatic power control integrated circuit, a photodiode and a reflector disposed under the platform of the housing, a collimator disposed in the installing space of the housing and a diffractive optical element bonded on the platform of the housing. Whereby a laser diode emits a laser light to the reflector for the laser light to be reflected perpendicularly through the collimator to the diffractive optical element; then the diffractive optical element produces a plurality of light spots and the a stray light is also produced from the laser light. The photodiode of the automatic power control integrated circuit then detects the stray light and produces a feedback signal transmitted back to the laser diode for adjustment of the laser emission power in order to control the light spots produced by the diffractive optical element.

Abstract: A laser module package with dual colors and multi-dies mainly includes a first PCB arranged in long shape and electrically connected to a plurality of first dies, a second PCB arranged in long shape and electrically connected to a plurality of second dies, a plurality of first collimators correspondingly disposed in a plurality of first openings, and a plurality of second collimators correspondingly disposed in a plurality of second openings. A plurality of first reflectors correspondingly reflects laser beams emitted from the first dies to the first collimators and a plurality of second reflectors correspondingly reflects laser beams emitted from the second dies to the second collimators; or having a plurality of first metal pieces fixing corresponding first dies for the laser beams emitted therefrom to go through the corresponding first collimators and a plurality of second metal pieces fixing corresponding second dies for the laser beams emitted therefrom to go through the corresponding second collimators.

Abstract: A rotating optical range finder includes a stationary base, a rotating base, an optical sensor, a transmitting circuit, a receiving circuit, a first induction coil, and a second induction coil. The rotating base is disposed on the stationary base. The optical sensor is disposed in the rotating base. The transmitting circuit is disposed in the stationary base. The receiving circuit is disposed in the rotating base and electrically connected to the optical sensor. The first induction coil is disposed in the stationary base and electrically connected to the transmitting circuit. The second induction coil is disposed in the rotating base and electrically connected to the receiving circuit.

Abstract: A rotating optical range finder includes a stationary base, a rotating base, an optical sensor, a transmitting circuit, a receiving circuit, a first induction coil, and a second induction coil. The rotating base s disposed on the stationary base. The optical sensor is disposed in the rotating base. The transmitting circuit is disposed in the stationary base. The receiving circuit is disposed in the rotating base and electrically connected to the optical sensor. The first induction coil is disposed in the stationary base and electrically connected to the transmitting circuit. The second induction coil is disposed in the rotating base and electrically connected to the receiving circuit.

Abstract: A laser emitting device includes a laser plane source for providing planar surrounding light, a reflector, and a connection mechanism. The reflector surrounds the laser plane source and has a reflective sidewall facing the laser plane source. The reflective sidewall includes a plurality of reflective surfaces connected to each other. Each of the reflective surfaces has an individual angle relative to the planar surround light. The planar surrounding light hits one of the reflective surfaces and forms a laser ring emitted from the laser emitting device. The connection mechanism allows the reflector to be moved relative to laser plane source. A size of the laser ring can be changed by changing the reflective surface to be hit.

Abstract: In the specification and drawing, an optical detection apparatus is described and shown with scanning devices, detectors, and a processing unit, wherein the scanning devices are positioned to scan a detection region with different light wavelengths.

Abstract: An optical detection apparatus includes a scanning device, a sensor, and a distinguishing module. The scanning device is positioned to scan a detection region with a scan light beam, in which the incident angle of the scan light beam varies with time. The sensor is positioned to sense a plurality of reflected scan light beams respectively generated by a plurality of actual touches within the detection region. The distinguishing module is operative to distinguish the actual touches from a plurality of ghost touches according to time signals upon which the plurality of reflected scan light beams are sensed by the sensor.

Abstract: Disclosed herein are optical detection systems and modules thereof. The optical detection system is used for determining a location where an object contacts a detection area.

Abstract: Disclosed herein includes a module and an optical detection device comprising the same for determining a touch position on a screen caused by an object, such as a finger of a user or a stylus pen.

Abstract: A packaging base for semiconductor elements is made of metal powder selected from the group consisting of cupper (Cu), iron (Fe), wolfram (W), molybdenum (Mo), aluminum (Al), indium (In), and gallium (Ga) or from an alloy of combinations thereof. A heat sink is integrally formed by metallurgical injection molding process. A fixing mount and a protection mount are positioned on the heat sink, thereby creating a packaging base structure. The protection mount surrounds the fixing mount for protecting semiconductor elements like laser diode dies. The packaging base structure includes a mounting gap for the purpose of an easy installation of the semiconductor elements. In this way, the reduction of the heat-removal capacity caused by the thermal contact resistance of the conventional configuration can be avoided so that the cooling effect can be enhanced. Meanwhile, the fabrication process is simplified.