Patents by Inventor Ming-Der Lin

Ming-Der Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20030100140
    Abstract: A method for packaging an electro-optics device is disclosed. A transparent material is added between the die carrier and the electro-optics device, so that the light emitted from the backside of the electro-optics device can be extracted. Furthermore, a light reflective layer is formed on the die carrier, and a pattern of the light reflective layer is designed to prevent the light from being reflected to the active layer, the reflecting decreasing light-emitting efficiency again.
    Type: Application
    Filed: January 15, 2003
    Publication date: May 29, 2003
    Applicant: OPTO TECH CORPORATION
    Inventors: Ming-Der Lin, Chang-Da Tsai, Kwang-Ru Wang, Ching-Liang Kao, Wen-Liang Tseng, Chia-Chen Chang
  • Publication number: 20030010986
    Abstract: A light emitting semiconductor device with a surface-mounted and flip-chip package structure is disclosed. The light emitting semiconductor device includes an insulating substrate and a LED. The LED includes a substrate, a first-type semiconductor layer, a first electrode formed on part of the first-type semiconductor layer surface, a second-type semiconductor layer formed on the first-type semiconductor layer surface but not covering the first electrode, and a second electrode formed on the second-type semiconductor layer. Two electrode layers are formed on the two sides of the insulating substrate and extend upwardly and downwardly to the upper and lower surface of the insulating substrate. The device is characterized in that the LED is mounted on the insulating substrate by a flip chip method and the insulating substrate is formed with two electrode layers at both side walls to surface-mounted with the LED.
    Type: Application
    Filed: July 9, 2002
    Publication date: January 16, 2003
    Inventors: Ming-der Lin, Kwang-ru Wang
  • Patent number: 6465808
    Abstract: A method and structure for forming an electrode on a light emitting device. The present invention provides a transparent electrode or a reflective electrode formed on a p-type gallium nitride-based compound semiconductor. The electrode comprises a plurality of opaque ohmic contact dots formed on the p-type gallium nitride-based compound semiconductor and a transparent conductive layer (or a light reflective conductive layer) covering the p-type gallium nitride-based compound semiconductor. Utilizing the present invention, the electrode is suitable for any light emitting device, and the light efficiency of the light emitting device is higher than that of the conventional light emitting device. Furthermore, the process of forming the electrode is easier than that of the conventional process.
    Type: Grant
    Filed: January 11, 2001
    Date of Patent: October 15, 2002
    Assignee: Highlink Technology Corporation
    Inventor: Ming-Der Lin
  • Publication number: 20020131145
    Abstract: A forming method and a structure of a high efficiency electro-optics device are disclosed. In the present invention, the cell-fixing surface between the die carrier and the electro-optics cell is decreased to increase the light emitting and absorbing regions of the electro-optics device. Thus, the operating efficiency and the sensitivity of the electro-optics device is increased substantially. Especially, the present invention has the advantage of fully showing the efficacy of device using the transparent substrate. Furthermore, when the electro-optics cell is fixing on the cell-fixing surface by utilizing the eutectic or metal-melting bonding method, a result of self-alignment can be achieved. Thus, the accuracy of the packaging device is increased substantially, thereby reducing the loss caused by the failure of poor cell-fixing while in mass production and meanwhile increasing the accuracy of fixing cell. Therefore, the present technology is quite suitable for use in the packaging of high precision.
    Type: Application
    Filed: February 11, 2002
    Publication date: September 19, 2002
    Applicant: OPTO TECH CORPORATION
    Inventors: Ming-Der Lin, Kwang-Ru Wang, Chang-Da Tsai, Jung-Kuei Hsu
  • Publication number: 20020131726
    Abstract: A method and a structure for packaging an electro-optics device are disclosed. A transparent material is added between the die carrier and the electro-optics device, so that the light emitted from the backside of the electro-optics device can be extracted. Furthermore, a light reflective layer is formed on the die carrier, and a pattern of the light reflective layer is designed to prevent the light from being reflected to the active layer, the reflecting decreasing light-emitting efficiency again.
    Type: Application
    Filed: March 1, 2002
    Publication date: September 19, 2002
    Applicant: OPTO TECH CORPORATION
    Inventors: Ming-Der Lin, Chang-Da Tsai, Kwang-Ru Wang, Ching-Liang Kao, Wen-Liang Tseng, Chia-Chen Chang
  • Patent number: 6445008
    Abstract: A photo sensing device uses surface-emitting LED as light emitter to increase responsive of light receiver and prevent the short circuit of connection wires, and the manufacturing method thereof. The light emitter is directly mounted on top front surface of an encapsulating epoxy enclosing a light receiver. The light emitted from backside of the light emitter passes through the encapsulating epoxy and is directly absorbed by the light receiver. The response is enhanced as compared with prior art.
    Type: Grant
    Filed: October 25, 2001
    Date of Patent: September 3, 2002
    Assignee: Opto Tech Corporation
    Inventors: Ming-Der Lin, Feng Ju Chuang, Wen Liang Tseng, Chia Chen Chang
  • Publication number: 20020063256
    Abstract: A method and structure for forming an electrode on a light emitting device. The present invention provides a transparent electrode or a reflective electrode formed on a p-type gallium nitride-based compound semiconductor. The electrode comprises a plurality of opaque ohmic contact dots formed on the p-type gallium nitride-based compound semiconductor and a transparent conductive layer (or a light reflective conductive layer) covering the p-type gallium nitride-based compound semiconductor. Utilizing the present invention, the electrode is suitable for any light emitting device, and the light efficiency of the light emitting device is higher than that of the conventional light emitting device. Furthermore, the process of forming the electrode is easier than that of the conventional process.
    Type: Application
    Filed: January 11, 2001
    Publication date: May 30, 2002
    Applicant: Highlink Technology Corporation
    Inventor: Ming-Der Lin
  • Patent number: 6255129
    Abstract: A light-emitting diode device, such as a blue, green, blue-green light-emitting diode, with a one-wire-bonding characteristic and the method of manufacturing the same have been disclosed. The light-emitting diode device has a GaN-based semiconductor laminated structure formed on an insulating substrate. The GaN-based semiconductor laminated structure includes an n-type layer on its bottom side, a p-type layer on its top side, and an active layer, for generating light, sandwiched between the n-type and p-type layers. An annular isolation portion such as a trench or a high resistivity portion formed by ion implantation is formed in the GaN-based semiconductor laminated structure to separate the p-type layer into a central p-type layer and a peripheral p-type layer and to separate the active layer into a central active layer and a peripheral active layer. A p-type electrode is formed on the central p-type layer without electrically connecting to the peripheral p-type layer.
    Type: Grant
    Filed: September 7, 2000
    Date of Patent: July 3, 2001
    Assignee: Highlink Technology Corporation
    Inventor: Ming-Der Lin
  • Patent number: 5543620
    Abstract: A structure for pyroelectric IR heat-sensing elements having a wide angle field of view is made by forming the essential heat-sensing elements and the related electronic elements into a planarized-packing configuration suitable for surface bonding. The heat-sensing elements are caused to be inclined and facing each other in a suspended structure so as to increase the sensing viewing angle.
    Type: Grant
    Filed: November 30, 1994
    Date of Patent: August 6, 1996
    Assignee: Opto Tech Corporation
    Inventors: San-Bao Lin, Gwo-Dawn Chang, Jin-Shown Shie, Chein-Hsun Wang, Ping-Kuo Weng, Ming-Der Lin