Abstract: Manufacturing of a shoe is enhanced by creating 3-D models of shoe parts. For example, a laser beam may be projected onto a shoe-part surface, such that a projected laser line appears on the shoe part. An image of the projected laser line may be analyzed to determine coordinate information, which may be converted into geometric coordinate values usable to create a 3-D model of the shoe part. Once a 3-D model is known and is converted to a coordinate system recognized by shoe-manufacturing tools, certain manufacturing steps may be automated.

Abstract: A semiconductor device includes a semiconductor substrate having a first region and a second region, insulators, gate stacks, and first and second S/Ds. The first and second regions respectively includes at least one first semiconductor fin and at least one second semiconductor fin. A width of a middle portion of the first semiconductor fin is equal to widths of end portions of the first semiconductor fin. A width of a middle portion of the second semiconductor fin is smaller than widths of end portions of the second semiconductor fin. The insulators are disposed on the semiconductor substrate. The first and second semiconductor fins are sandwiched by the insulators. The gate stacks are over a portion of the first semiconductor fin and a portion of the second semiconductor fin. The first and second S/Ds respectively covers another portion of the first semiconductor fin and another portion of the second semiconductor fin.

Abstract: Manufacturing of a shoe or a portion of a shoe is enhanced by executing various shoe-manufacturing processes in an automated fashion. For example, information describing a shoe part may be determined, such as an identification, an orientation, a color, a surface topography, an alignment, a size, etc. Based on the information describing the shoe part, automated shoe-manufacturing apparatuses may be instructed to apply various shoe-manufacturing processes to the shoe part, such as a pickup and placement of the shoe part with a pickup tool.

Abstract: An electronic device includes a substrate, a first silicon transistor, a second silicon transistor and a first oxide semiconductor transistor. The first silicon transistor, the second silicon transistor and the first oxide semiconductor transistor are disposed on the substrate. The first silicon transistor has a first terminal electrically connected to a first voltage level, a second terminal and a control terminal. The second silicon transistor has a first terminal electrically connected to the second terminal of the first silicon transistor, a second terminal electrically connected to a second voltage level, and a control terminal electrically connected to the control terminal of the first silicon transistor. The first oxide semiconductor transistor has a first terminal electrically connected to the first terminal of the second silicon transistor. Wherein, a voltage value of the first voltage level is greater than a voltage value of the second voltage level.

Abstract: The present disclosure proposes an electromagnetic susceptibility (EMS) testing method based on computer-vision. The method includes a training stage and a testing stage. During the training stage, the electronic device receives a testing data and the monitor displays a first picture. A camera captures the first picture to generate a template video. The processor generates a plurality of template images at least according to the template video. During the testing stage, an antenna emits an interference signal to the electronic device. The electronic device receives the testing data and the monitor displays a second picture. The camera captures the second picture to generate a testing video. The processor generates a testing image according to the testing video and calculates a difference ratio between the testing image and each template image. The processor sends an alert signal when the difference ratio is greater than a threshold.

Abstract: The present disclosure describes a method for controlling radiation conditions and an example system for performing the method. The method includes sending a first setting to configure a radiation device to provide radiation to a substrate undergoing a process operation in a process chamber of the radiation device. The method further includes receiving radiation energy data measured at a plurality of locations of the process chamber and receiving measurement data measured on the substrate during the process operation. The method further includes in response to a variance of the radiation energy data being above a first predetermined threshold and in response to a difference between reference data and the measurement data being above a second predetermined threshold, sending a second setting to configure the radiation device to provide radiation to the substrate.

Abstract: A semiconductor device includes a semiconductor substrate having a first region and a second region, insulators, gate stacks, and first and second S/Ds. The first and second regions respectively includes at least one first semiconductor fin and at least one second semiconductor fin. A width of a middle portion of the first semiconductor fin is equal to widths of end portions of the first semiconductor fin. A width of a middle portion of the second semiconductor fin is smaller than widths of end portions of the second semiconductor fin. The insulators are disposed on the semiconductor substrate. The first and second semiconductor fins are sandwiched by the insulators. The gate stacks are over a portion of the first semiconductor fin and a portion of the second semiconductor fin. The first and second S/Ds respectively covers another portion of the first semiconductor fin and another portion of the second semiconductor fin.

Abstract: A semiconductor device includes a semiconductor substrate having a first region and a second region, insulators, gate stacks, and first and second S/Ds. The first and second regions respectively includes at least one first semiconductor fin and at least one second semiconductor fin. A width of a middle portion of the first semiconductor fin is equal to widths of end portions of the first semiconductor fin. A width of a middle portion of the second semiconductor fin is smaller than widths of end portions of the second semiconductor fin. The insulators are disposed on the semiconductor substrate. The first and second semiconductor fins are sandwiched by the insulators. The gate stacks are over a portion of the first semiconductor fin and a portion of the second semiconductor fin. The first and second S/Ds respectively covers another portion of the first semiconductor fin and another portion of the second semiconductor fin.

Abstract: A semiconductor device includes a semiconductor substrate having a first region and a second region, insulators, gate stacks, and first and second S/Ds. The first and second regions respectively includes at least one first semiconductor fin and at least one second semiconductor fin. A width of a middle portion of the first semiconductor fin is equal to widths of end portions of the first semiconductor fin. A width of a middle portion of the second semiconductor fin is smaller than widths of end portions of the second semiconductor fin. The insulators are disposed on the semiconductor substrate. The first and second semiconductor fins are sandwiched by the insulators. The gate stacks are over a portion of the first semiconductor fin and a portion of the second semiconductor fin. The first and second S/Ds respectively covers another portion of the first semiconductor fin and another portion of the second semiconductor fin.

Abstract: A circuit board includes an analog area and a digital area. The analog area includes an analog ground layer and an analog wiring layer formed on the analog ground layer. The digital area includes a digital ground layer and a digital wiring layer formed on the digital ground layer. The digital ground layer is connected with the analog ground layer to form a main ground layer. The digital wiring layer is separate from the analog wiring layer.

Abstract: A combined bezel for fixing a display panel module on the rear thereof is described. The combined bezel has a plurality of beams and a plurality of decorative corners. Each decorative corner couples to two adjacent beams to form a viewing area to expose a display area of the display panel module. The decorative corner further has a decorative pillar and two fixing wings. The two fixing wings fixed on the decorative pillar couples one crossbeam to one vertical beam and the decorative pillar is disposed between the crossbeam and the vertical beam to fill a gap therebetween.

Abstract: A real-time electronic business transaction system and method is proposed, which is capable of reporting STFC (Ship To First Commitment) and FCT (Factory Cycle Time) data in real time to a customer in response to an electronic purchase order from the customer. The proposed electronic business transaction system comprises an EDI (Electronic Data Exchange) platform, a SAP (Service Advertising Platform) platform, an SQL(Structured Query Language) server, and a WWW (World Wide Web) server. The EDI platform is linked to a customer-site workstation and is used to receive any electronic purchase order from the customer. The SAP platform is used to perform a predefined FCT computation procedure to compute for a set of FCT data based on the received electronic purchase order; while the SQL server is used to perform a predefined STFC computation procedure to compute for a set of STFC data based on the received electronic purchase order.

Abstract: A combined bezel for fixing a display panel module on the rear thereof is described. The combined bezel has a plurality of beams and a plurality of decorative corners. Each decorative corner couples to two adjacent beams to form a viewing area to expose a display area of the display panel module. The decorative corner further has a decorative pillar and two fixing wings. The two fixing wings fixed on the decorative pillar couples one crossbeam to one vertical beam and the decorative pillar is disposed between the crossbeam and the vertical beam to fill a gap therebetween.

Abstract: The invention relates to a virtual processor through USB (VPTU), which is installed in a peripheral with USB interface specifications and comprises an I/O instruction decoding unit for decoding or compiling received and compiled instructions of USB packets for parsing the instructions and converting the same into instructions identifiable by an application chipset of the peripheral or a CPU of a computer in order to eliminate microprocessors and memory devices of a conventional peripheral complied with the USB interface specifications and perform operations involved in the transmission or receiving of the USB packets and storing USB interface programs and intermediate data created in the operations.

Abstract: The invention relates to a virtual processor through USB (VPTU), which is installed in a peripheral with USB interface specifications and comprises an I/O instruction decoding unit for decoding or compiling received and compiled instructions of USB packets for parsing the instructions and converting the same into instructions identifiable by an application chipset of the peripheral or a CPU of a computer in order to eliminate microprocessors and memory devices of a conventional peripheral complied with the USB interface specifications and perform operations involved in the transmission or receiving of the USB packets and storing USB interface programs and intermediate data created in the operations.

Abstract: A real-time electronic business transaction system and method is proposed, which is capable of reporting STFC (Ship To First Commitment) and FCT (Factory Cycle Time) data in real time to a customer in response to an electronic purchase order from the customer. The proposed electronic business transaction system comprises an EDI (Electronic Data Exchange) platform, a SAP (Service Advertising Platform) platform, an SQL(Structured Query Language) server, and a WWW (World Wide Web) server. The EDI platform is linked to a customer-site workstation and is used to receive any electronic purchase order from the customer. The SAP platform is used to perform a predefined FCT computation procedure to compute for a set of FCT data based on the received electronic purchase order; while the SQL server is used to perform a predefined STFC computation procedure to compute for a set of STFC data based on the received electronic purchase order.