Abstract: The imaging system includes a wire, a second signal transmission unit and a computer system. At least one first signal transmission unit is disposed on the wire which is configured to enter a blood vessel in a human body. The second signal transmission unit is disposed outside of the human body. The computer system is electrically connected to the second signal transmission unit. The first signal transmission unit emits a first signal, the second signal transmission unit receives the first signal, and the computer system generates a first image according to the first signal. The second signal transmission unit emits a second signal, and receives a reflection signal corresponding to the second signal. The computer system generates a second image according to the reflection signal, and merges the first image with the second image as a third image for rendering a position of the wire in the human body.

Abstract: The system comprises an optical fiber, a light emitting module, an ultrasound detector and an imaging system. The optical fiber has a first end and a second end. The second end of the optical fiber is configured to enter a blood vessel of a human body. The light emitting module emits a laser ray into the first end of the optical fiber, and the laser ray diffuses into a human tissue through the optical fiber to generate an ultrasound signal. The ultrasound detector is disposed corresponding to the second end of the optical fiber for receiving the ultrasound signal. The imaging system is coupled to the ultrasound detector and generates an image with respect to the blood vessel according to the ultrasound signal.

Abstract: A sensor package structure includes a substrate, a sensing member, a shielding member, a metallic wire, and an encapsulating compound. The substrate includes a die bonding zone and a wiring zone. The sensing member is mounted on the die bonding zone and includes a sensing zone, a carrying zone arranged around the sensing zone, and a connecting zone arranged outside of the carrying zone. The shielding member includes a translucent covering portion and a supporting portion connected to a peripheral portion of the covering portion. The supporting portion having a coefficient of thermal expansion less than 10 ppm/° C. is fixed on the carrying zone. The metallic wire connects the wiring zone and the connecting zone. The encapsulating compound is disposed on the wiring zone and covers a peripheral side of the sensing member, the connecting zone, and a peripheral side of the shielding member.

Abstract: A sensor package structure includes a substrate, a sensing member, a shielding member, a metallic wire, and an encapsulating compound. The substrate includes a die bonding zone and a wiring zone. The sensing member is mounted on the die bonding zone and includes a sensing zone, a carrying zone arranged around the sensing zone, and a connecting zone arranged outside of the carrying zone. The shielding member includes a translucent covering portion and a supporting portion connected to a peripheral portion of the covering portion. The supporting portion having a coefficient of thermal expansion less than 10 ppm/° C. is fixed on the carrying zone. The metallic wire connects the wiring zone and the connecting zone. The encapsulating compound is disposed on the wiring zone and covers a peripheral side of the sensing member, the connecting zone, and a peripheral side of the shielding member.

Abstract: One or more methods of forming shallow trench isolation (STI) and resulting semiconductor arraignments are provided. A method of forming STI includes forming a nitride liner in a first opening and second opening and recessing the nitride liner in the first opening and second opening while forming an oxide structure in the first opening and second opening, thus forming a first STI region in the first opening and a second STI region in the second opening. A semiconductor arraignment includes a first STI region in an active area and a second STI region in an isolation area, where a first recessed nitride layer height in the first STI region is different than a second recessed nitride layer height in the second STI region.

Abstract: A puncturing instrument is provided to overcome the inconvenience in performing the puncturing operation due to the inability to see the internal structure of a patient. The puncturing instrument includes a first tube, a second tube and a light-guiding member is disclosed. The first tube includes two first openings. One of the two first openings forms a sharp portion. The second tube is received in the first tube and includes two second openings and a gas outlet. One of the two second openings is provided with a lens, and the gas outlet is adjacent to the lens and the sharp portion of the first opening. The light-guiding member is received in the second tube. Furthermore, a puncturing equipment using the puncturing instrument and a signal processing method of the puncturing equipment are also disclosed.

Abstract: A magnetic excitation system includes a magnetic excitation apparatus for generating a magnetic field, and an analyzing device including a detecting unit for detecting magnetic flux of the magnetic field, and a processing unit. The processing unit is configured to: determine a magnetic flux distribution associated with a target according to the magnetic flux; generate, according to the magnetic flux distribution, a simulated magnetic field distribution over the target before a magnetic induction needle is punctured into the target; and calculate, in real time, temperature and ablating range associated with the target based on the magnetic flux when the magnetic induction needle is punctured into the target.

Abstract: A magnetic excitation device for an electromagnetic thermal ablation apparatus includes a magnetic unit and two coil units. The magnetic unit has two magnetic induction ends that are spaced apart from each other. The coil units are respectively disposed around the magnetic induction ends. Each of the coil units has two connection parts connectible to an alternating electric power source for generating an alternating magnetic field.

Abstract: An orthodontic bracket is for use with an arch wire and is for attaching to a tooth. The orthodontic bracket includes abase unit. The base unit includes a base member that has a first side for attaching to the tooth and a second side opposite to the first side, and a plurality of retaining bars that project from the second side of the base member away from the first side and that are angularly spaced apart from one another, every adjacent pair of the retaining bars defining a retaining passage that is configured to permit selective extension of the arch wire therethrough.

Abstract: A vascular clamp for use in minimally invasive surgery includes a positioning member having a first side and a second side opposite to the first side and looping/tightening member and a reinforcing member. The positioning member includes a through-hole, a positioning hole, and a connection gap intercommunicating the through-hole with the positioning hole. Each of the through-hole, the positioning hole, and the connection gap extends from the first side through the second side of the positioning member. The looping/tightening member includes a connection end and a free end. The connection end is connected to the positioning member. The looping/tightening member includes a positioning section having a plurality of engagement blocks. A neck is interconnected between two adjacent engagement blocks. One of the engagement blocks is selectively and removably engaged in the positioning hole. The reinforcing member is mounted between the first and second sides of the positioning member.

Abstract: A dental bracket is adapted to connect with a wire for repositioning of a tooth in a mouth of a patient, and includes a base member, a cap, and an adjustable unit. The cap is connected removably to the base member to define an accommodating chamber therebetween, and is formed with an opening in spatial communication with the accommodating chamber. The adjustable unit includes an inner end portion disposed within the accommodating chamber and retained at a selected one of a plurality of angular positions, and an outer end surface formed with at least one wire engaging groove that is disposed outwardly of the opening in the cap. The cap is removable from the base member to allow for angular position adjustment of the inner end portion of the adjusting member relative to the base member.

Abstract: One or more methods of forming shallow trench isolation (STI) and resulting semiconductor arraignments are provided. A method of forming STI includes forming a nitride liner in a first opening and second opening and recessing the nitride liner in the first opening and second opening while forming an oxide structure in the first opening and second opening, thus forming a first STI region in the first opening and a second STI region in the second opening. A semiconductor arraignment includes a first STI region in an active area and a second STI region in an isolation area, where a first recessed nitride layer height in the first STI region is different than a second recessed nitride layer height in the second STI region.

Abstract: The present invention discloses a wafer level image sensor packaging structure and a manufacturing method of the same. The manufacturing method includes the following steps: providing a silicon wafer, dicing the silicon wafer, providing a plurality of transparent lids, fabricating a plurality of semi-finished products, performing a packaging process, mounting solder balls, and cutting an encapsulant between the semi-finished products. The manufacturing method of the invention has the advantage of being straightforward, uncomplicated, and cost-saving. Thus, the wafer level image sensor package structure is lightweight, thin, and compact. To prevent the image sensor chip from cracking on impact during handling, the encapsulant will be arranged on the lateral sides of the semi-finished products during the packaging process.

Abstract: The present invention discloses a wafer level image sensor packaging structure and a manufacturing method for the same. The manufacturing method includes the following steps: providing a silicon wafer with image sensor chips, providing a plurality of transparent lids, allotting one said transparent lid on top of the corresponding image sensor chip, and carrying out a packaging process. The manufacturing method of the invention has the advantage of having a simpler process, lower cost, and higher production yield rate. The encapsulation compound arranges on the first surface of the image sensor chip and covers the circumference of the transparent lid to avoid the side light leakage as traditional chip scale package (CSP). Thus, the sensing performance of the wafer level image sensor packaging structure can be enhanced.

Abstract: A fixing structure including a metal housing and a fixing base is disclosed. The housing has a carrying plane and the fixing base having a first contact end and, opposite, a second contact end is disposed on the housing. The perpendicular distance from the first contact end to the carrying plane is greater than that from the second contact end to the carrying plane. A wireless transmission device is disposed on the fixing base and in contact with the first contact end and the second contact end, so that a perpendicular distance from an antenna end of the wireless transmission device to the carrying plane is greater than a perpendicular distance from a fixed end of the wireless transmission device to the carrying plane. Therefore, a relatively great distance is kept between the antenna end and the housing for preventing the antenna end from being interfered by the metal housing.

Abstract: This present invention discloses a manufacturing method and structure for a wafer level image sensor module with fixed focal length. The method includes the following steps. First, a silicon wafer comprising several image sensor chips having a photosensitive area and a lens module array wafer comprising several wafer level lens modules with fixed focal length are provided. Next, the image sensor chips and the wafer level lens modules are sorted in grades according to the different quality grades. According to the sorting results, each of the wafer level lens modules is assigned to be situated above the image sensor chip that has the same grade. At the same time, each of the wafer level lens modules is directed to face the photosensitive area of each image sensor chip. Finally, in the packaging process, the wafer level lens module is surrounded by an encapsulation material.

Abstract: A pocket warmer able to give out odors is provided with a combustion unit and a placing stand assembled over the combustion unit for receiving aromatic substance or essential oil with an odor a user wants. Thus, when the combustion unit of the pocket warmer is heated, hot air produced will rise and carry out heating to the aromatic substance or the essential oil of the placing stand over the combustion unit, able to attain effects of keeping warm and giving out odors, and safe and practical in use.

Abstract: The present invention discloses a manufacturing method and structure of a wafer level image sensor module with package structure. The structure of the wafer level image sensor module with package structure includes a semi-finished product, a plurality of solder balls, and an encapsulant. The semi-finished product includes an image sensing chip and a wafer level lens assembly. The encapsulant is disposed on lateral sides of the image sensing chip and the wafer level lens assembly. Also, the manufacturing method includes the steps of: providing a silicon wafer, dicing the silicon wafer, providing a lens assembly wafer, fabricating a plurality of semi-finished products, performing a packaging process, mounting the solder balls, and cutting the encapsulant. Accordingly, the encapsulant encapsulates each of the semi-finished products by being disposed on the lateral sides thereof.

Abstract: A fixing structure including a metal housing and a fixing base is disclosed. The housing has a carrying plane and the fixing base having a first contact end and, opposite, a second contact end is disposed on the housing. The perpendicular distance from the first contact end to the carrying plane is greater than that from the second contact end to the carrying plane. A wireless transmission device is disposed on the fixing base and in contact with the first contact end and the second contact end, so that a perpendicular distance from an antenna end of the wireless transmission device to the carrying plane is greater than a perpendicular distance from a fixed end of the wireless transmission device to the carrying plane. Therefore, a relatively great distance is kept between the antenna end and the housing for preventing the antenna end from being interfered by the metal housing.

Abstract: An imitation metal engineering plastic composite material and a preparation method of the same relate to a polymer composite material. Plastic and metal are combined while maintaining the advantages of the imitation metal engineering plastic composite material and the preparation method thereof. The composition of the composite material comprises an engineering thermoplastic, a high-density filler, a mineral powder, a glass fiber, a toughener, a coupling agent, a lubricant and an antioxidant. The composite material features a high density, a high mechanical performance, an excellent thermal deformation temperature, and good plastic injection molding manufacturability. The method of combining the coupling agent and the optimal conditions of the particles are adopted to make the manufacturing simpler and easier, and a general twin-screw granulator can be used for producing granules, and a general plastic injection molding machine can be used in the plastic injection molding process.