Patents by Inventor Ming Liang

Ming Liang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250086406
    Abstract: Implementations of the present disclosure relate to text generation with a customizable style. In a method, a first natural language is received; the first natural language text is converted, via a text generation model, into a second natural language text that at least partly reflects the meaning of the first natural language text and has a style distinguishable from the first natural language text, the text generation model comprising a modifiable parameter; and in response to receiving a modification to the parameter, the first natural language text is converted, via the text generation model, into a third natural language text that at least partly reflects the meaning of the first natural language text and includes a style distinguishable from both the first natural language text and the second natural language text.
    Type: Application
    Filed: August 12, 2024
    Publication date: March 13, 2025
    Inventors: Nan Duan, Ming Zhou, Yaobo Liang
  • Publication number: 20250087553
    Abstract: A method includes forming a solder layer on a surface of one or more chips. A lid is positioned over the solder layer on each of the one or more chips. Heat and pressure are applied to melt the solder layer and attach each lid to a corresponding solder layer. The solder layer has a thermal conductivity of ?50 W/mK.
    Type: Application
    Filed: November 22, 2024
    Publication date: March 13, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yang-Che CHEN, Chen-Hua LIN, Huang-Wen TSENG, Victor Chiang LIANG, Chwen-Ming LIU
  • Patent number: 12249493
    Abstract: A method includes loading a wafer over a wafer chuck in a process chamber; performing a deposition process on the loaded wafer; supplying a fluid medium to a fluid guiding structure in the wafer chuck from a fluid inlet port on the wafer chuck, the fluid guiding structure comprising a plurality of arc-shaped channels fluidly communicated with each other; guiding the fluid medium from a first one of the arc-shaped channels of the fluid guiding structure to a second one of the arc-shaped channels of the fluid guiding structure. The second one of the arc-shaped channels of the fluid guiding structure is concentric with the first one of the arc-shaped channels of the fluid guiding structure from a top view.
    Type: Grant
    Filed: February 22, 2023
    Date of Patent: March 11, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Sheng-Chun Yang, Yi-Ming Lin, Po-Wei Liang, Chu-Han Hsieh, Chih-Lung Cheng, Po-Chih Huang
  • Publication number: 20250075503
    Abstract: Some embodiments of the present disclosure relate to a roofing shingle comprising a substrate, wherein the substrate having a top surface and a bottom surface; and a material layer, wherein the material layer comprises graphene, wherein the material layer is disposed on or above the top surface of the substrate. Some embodiments of the present disclosure relate to a method comprising one or more of obtaining a substrate, wherein the substrate having a top surface and a bottom surface; obtaining a graphene composition, wherein the graphene composition comprises at least graphene; and applying the graphene composition to the top surface of the substrate or a surface above the top surface of the substrate to obtain a material layer comprising graphene.
    Type: Application
    Filed: June 28, 2024
    Publication date: March 6, 2025
    Inventors: Ming-Liang Shiao, Luis Duque, Brian Lee
  • Publication number: 20250078303
    Abstract: A method for rapidly calculating intersection over union (IOU) between a target region and a designated region in an image is used in an electronic device. The electronic device detects a target object from an image received from a monitored location, and determines a designated region, a target region, and a combined region from the image, the target region including the target object. The electronic device calculates a first area of the designated region, a second area of the target region, and a third area of the combined region, and calculates a value of IOU according to formula of SIOU=(S1+S2?S3)/S2. S1 represents the first area, S2 represents the second area, and S3 represents the third area. The electronic device issues an intrusion warning in or concerning a monitored region according to a comparison result between the value of IOU and a preset threshold.
    Type: Application
    Filed: November 19, 2024
    Publication date: March 6, 2025
    Inventors: BIN-BIN LIANG, DONG-MING LI, JI-XING CHEN
  • Publication number: 20250077306
    Abstract: A computer-implemented method for computing workload management includes collecting power usage information from a location and collecting computing task information with respect to computing tasks performed at the location. The collected computing task information can be parsed to get a predicted approximate power usage information for each task. The tasks can be scheduled based on the predicted approximate power usage information to improve (e.g., maximize) usage of power from an unstable power source.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 6, 2025
    Inventors: Guang Han Sui, Peng Hui Jiang, Fan Jing Meng, Ming Liang Zu, Jun Su
  • Publication number: 20250078591
    Abstract: A smart key device includes a battery, a wireless charging module, a sound output component, a distance measuring module, and a control module, wherein the wireless charging module is electrically connected to the battery, and the control module is electrically connected to the wireless charging module, the sound output component and the distance measuring module. The wireless charging module receives power and provide power to the battery. The sound output component is enabled by a first enable signal to output a sound prompt. The distance measuring module is enabled by a second enable signal to perform distance measurement. The control module includes a Bluetooth transceiver and a microcontroller, wherein the microcontroller generates the second enable signal when the Bluetooth transceiver receives a pairing signal and generates the first enable signal when determining that the measured distance is less than a preset distance.
    Type: Application
    Filed: September 15, 2023
    Publication date: March 6, 2025
    Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventor: Ming Liang YU
  • Publication number: 20250077826
    Abstract: A smart key device includes a battery, a power detection module, a power indication module, and a microcontroller, wherein the battery is electrically connected to the power detection module and the microcontroller, and the microcontroller is electrically connected to the power detection module and the power indication module. The power detection module is configured to be controlled by the first control signal to detect remaining power. The power indication module is configured to be controlled by a second control signal to indicate the remaining power. The microcontroller is configured to generate the first control signal and the second control signal, wherein the second control signal includes the remaining power.
    Type: Application
    Filed: September 13, 2023
    Publication date: March 6, 2025
    Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventor: Ming Liang YU
  • Patent number: 12240924
    Abstract: The present invention discloses a preparation method of highly alkali-stable cationic polymers, including the following steps: placing a polymerization mixture comprising 1-R1-3-piperidinone or its salts or hydrate thereof and arene monomers in a first organic solvent, performing catalytic polycondensation by adding organic strong acids, and obtaining a polymer dispersion with piperidine moieties; slowly dropping the dispersion of the polymer with piperidine moieties into a first precipitant, and obtaining a polymer powder with piperidine moieties after drying; dissolving the polymer powder with piperidine moieties of in a second organic solvent, after adding the quaternization reagent, obtaining a cationic polymer solution.
    Type: Grant
    Filed: May 2, 2024
    Date of Patent: March 4, 2025
    Assignees: HEFEI UNIVERSITY OF TECHNOLOGY, ANQING POLYROCKS TECHNOLOGY RESEARCH CO., LTD.
    Inventors: Haibing Wei, Tao Wang, Hongfang Zhu, Yatao Liang, Ming Xu, Duoying Chen, Yunsheng Ding
  • Patent number: 12243848
    Abstract: Methods and systems for improving fusion bonding are disclosed. Plasma treatment is performed on a substrate prior to the fusion bonding, which leaves residual charge on the substrate to be fusion bonded. The residual charge is usually dissipated through an electrically conductive silicone cushion on a loading pin. In the methods, the amount of residual voltage on a test silicon wafer is measured. If the residual voltage is too high, this indicates the usable lifetime of the silicone cushion has passed, and the electrically conductive silicone cushion is replaced. This ensures the continued dissipation of residual charge during use in production, improving the quality of fusion bonds between substrates.
    Type: Grant
    Filed: February 8, 2022
    Date of Patent: March 4, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hong-Ta Kuo, Yen Hao Huang, I-Shi Wang, Ming-Yi Shen, Tzu-Ping Yang, Hsing-Yu Wang, Huang-Liang Lin, Yin-Tung Chou, Yuan-Hsin Chi, Sheng-Yuan Lin
  • Patent number: 12243788
    Abstract: A method of testing a semiconductor package includes: forming a charge measurement unit over a carrier substrate; forming a first dielectric layer over the charge measurement unit; forming a first metallization layer over the dielectric layer, wherein the forming of the first metallization layer induces first charges to accumulate on the charge measurement unit; performing a first test against the charge measurement unit to determine whether breakdown occurs in the charge measurement unit; and in response to determining that no breakdown occurs in the charge measurement unit, forming a second dielectric layer over the first metallization layer.
    Type: Grant
    Filed: July 27, 2023
    Date of Patent: March 4, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chi-Hui Lai, Yang-Che Chen, Chen-Hua Lin, Victor Chiang Liang, Chwen-Ming Liu
  • Patent number: 12242150
    Abstract: An electronic device includes: a first substrate; a second substrate opposite to the first substrate; a black matrix layer disposed between the first and second substrates and including a first pixel region and a first shielding region arranged along a first direction, wherein the first pixel region includes first and sub-pixel openings arranged along a second direction different from the first direction; a scan line disposed between the first and second substrates and extending along the second direction, wherein the first shielding region overlaps the scan line; and first and second pixel color resists respectively disposed corresponding to the first and second sub-pixel openings, wherein in a cross-sectional view, a recess is formed between the first pixel color resist and the second pixel color resist, the recess is disposed in the first pixel region, and the recess comprises a curved side wall.
    Type: Grant
    Filed: April 12, 2023
    Date of Patent: March 4, 2025
    Assignee: INNOLUX CORPORATION
    Inventors: Wei-Chih Chen, Chih-Ming Liang
  • Publication number: 20250066569
    Abstract: Some embodiments of the present disclosure relate to an article comprising a reinforced glass mat. In some embodiments, the reinforced glass mat includes a glass mat and a reinforcement material. In some embodiments, the glass mat includes a web of glass fibers. In some embodiments, the reinforcement material is embedded into the web of glass fibers of the glass mat. In some embodiments, the reinforced glass mat includes a sufficient amount of the reinforcement material, so as to result in a nail shank shear resistance of 13 lbs to 17 lbs, when the article is tested according to ASTM 1761 at 140° F. Methods of making the article, specific embodiments of the reinforcement material in the form of a polymeric binder, and methods of forming a roofing shingle from the article are also disclosed.
    Type: Application
    Filed: November 12, 2024
    Publication date: February 27, 2025
    Inventors: Ming-Liang Shiao, Jim Svec, Brian Lee
  • Publication number: 20250066582
    Abstract: A resin composition includes 100 parts by weight of hydrocarbon resin polymers and 0.01 to 50 parts by weight of divinyl aromatic compound. A substrate structure includes a resin layer and a conductive layer disposed on the resin layer, wherein the resin layer is formed from the resin composition. A manufacturing method of the resin composition includes the following steps: providing a mixture, wherein the mixture includes a monovinyl aromatic compound and a divinyl aromatic compound, and optionally includes a bridged ring compound; polymerizing the mixture to form a crude composition; and purifying the crude composition to prepare the resin composition.
    Type: Application
    Filed: August 22, 2024
    Publication date: February 27, 2025
    Inventors: Yi-Hsuan TANG, Chien-Han CHEN, Wei-Liang LEE, Ming-Hung LIAO, Yu-Tien CHEN, Yu-Chen HSU, Tzu-Yuan SHIH, Ka Chun AU-YEUNG
  • Patent number: 12238864
    Abstract: An electronic apparatus including a compression molding board and a connection pad is provided. The compression molding board has a device bonding area and a bending area formed by compression molding. The device bonding area is different from the bending area. The connection pad is disposed on the device bonding area of the compression molding board.
    Type: Grant
    Filed: March 24, 2022
    Date of Patent: February 25, 2025
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Lin Hsu, Kuan-Chu Wu, Ting-Yu Ke, Min-Hsiung Liang, Yu-Ming Peng
  • Patent number: 12238800
    Abstract: A STA in a STA MLD sends an information frame on a link corresponding to the station, and the information frame is used to indicate a STA in an awake state in the STA MLD. An AP MLD receives the information frame, and sends a downlink message frame on a one or more links corresponding to a part of or all of STAs in the awake state in the STA MLD.
    Type: Grant
    Filed: November 20, 2023
    Date of Patent: February 25, 2025
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Ming Gan, Yifan Zhou, Yunbo Li, Yuchen Guo, Jian Yu, Dandan Liang
  • Patent number: 12231234
    Abstract: This application discloses a data transmission method and device, a chip system, and a computer-readable storage medium. In the method, a station may receive preamble puncturing indication information that includes one or more indicators. An indicator of the one or more indicators corresponds to preamble puncturing information of a data packet. The station sends or receives the data packet based on the preamble puncturing indication information. The preamble puncturing information includes a size and location of preamble puncturing, or that there is no preamble puncturing. The preamble puncturing information may be an index indicated by the preamble puncturing indication information, to learn of a status of preamble puncturing in the data packet.
    Type: Grant
    Filed: September 9, 2022
    Date of Patent: February 18, 2025
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jian Yu, Mengshi Hu, Ming Gan, Dandan Liang
  • Patent number: 12231363
    Abstract: This application relates to the field of wireless communication technologies, and in particular, to a method and an apparatus for transmitting a physical layer protocol data unit, and for example, is applied to a wireless local area network. The method includes: A first communications device generates a PPDU and may send the PPDU, where the PPDU includes an LTF sequence; and correspondingly, a second communications device receives the PPDU, and parses the PPDU to obtain the LTF sequence included in the PPDU. Embodiments of this application can be used to design an LTF sequence that has a relatively low PAPR on entire bandwidth, on a single resource unit, on a combined resource unit, and in a considered multi-stream scenario.
    Type: Grant
    Filed: August 16, 2023
    Date of Patent: February 18, 2025
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Chenchen Liu, Dandan Liang, Ming Gan
  • Patent number: 12227947
    Abstract: A roofing system including a cap shingle and methods of producing a cap shingle and forming a roof are disclosed. In one embodiment, the cap shingle can include at least one layer of shingle material including an upper surface having a headlap portion and an exposure portion, and a lower surface. A sealant can be applied along the lower surface and a sealant attachment zone can be positioned along the upper surface of the at least one layer of shingle material between the headlap and exposure portions. The sealant attachment zone can be configured to contact a sealant applied along a lower surface of a next cap shingle to promote adhesion between the cap shingles installed along a ridge, hip, or cap of the roof.
    Type: Grant
    Filed: March 20, 2024
    Date of Patent: February 18, 2025
    Assignee: BMIC LLC
    Inventors: Jeffrey S. Avitabile, Luis Duque, Ming-Liang Shiao, Olan T. Leitch
  • Publication number: 20250052062
    Abstract: A sealant pouch system for adhering roofing shingles includes a plurality of pouches containing an adhesive with a viscosity of 25 cps to 2500 cps. Each pouch comprises an outer film that encases the adhesive and is configured to rupture when subjected to a sufficient force or a temperature above a predetermined threshold. The method of installation involves placing the pouches on the reveal portion of shingles in a first row, installing a second row of shingles to overlap the first row, and applying sufficient force to rupture the pouches, causing the adhesive to contact both the headlap and reveal portions of the shingles, thereby sealing the rows together. The pouches may have various shapes and are designed to prevent rolling or sliding off sloped roof decks.
    Type: Application
    Filed: August 9, 2024
    Publication date: February 13, 2025
    Inventors: David Ellis, Ming-Liang Shiao, Brian Lee