Abstract: A semiconductor device includes a bridge and a first integrated circuit. The bridge is free of active devices and includes a first conductive connector. The first integrated circuit includes a substrate and a second conductive connector disposed in a first dielectric layer over the substrate. The second conductive connector is directly bonded to the first conductive connector. The second conductive connector includes conductive pads and first conductive vias and a second conductive via between the conductive pads. The second conductive via is not overlapped with the first conductive vias while the first conductive vias are overlapped with one another. A vertical distance between the second conductive via and the first conductive connector is larger than a vertical distance between each of the first conductive vias and the first conductive connector, and a sidewall of the first dielectric layer is substantially flush with a sidewall of the substrate.

Abstract: A wavelength conversion element including a substrate, a blocking wall structure layer, and a wavelength conversion layer is provided. The blocking wall structure layer is disposed on a surface of the substrate and defines multiple microgrooves. Reflectivity of the blocking wall structure layer is in a range of 1% to 99%. The wavelength conversion layer is disposed in the microgrooves and includes multiple wavelength conversion particles. A height of the blocking wall structure layer along a normal direction of the surface of the substrate is greater than a height of the wavelength conversion layer along the normal direction of the surface of the substrate. A backlight module adopting the wavelength conversion element is also provided.

Abstract: A surface-modified contact lens, having a surface contact angle hysteresis of less than 15°, includes a lens body and a first surface modification layer disposed on a surface of the lens body. The first surface modification layer comprises a first reactive hydrophilic polymer. The surface of the lens body has a first functional group or a second functional group, and the first reactive hydrophilic polymer has a third functional group or a fourth functional group. A first covalent cross-link bond is formed between the surface of the lens body and the first surface modification layer. The first covalent cross-link bond is formed by reacting the first functional group or the second functional group of the surface of the lens body with the third functional group or the fourth functional group of the first reactive hydrophilic polymer.

Abstract: A surface-modified contact lens, having a surface contact angle hysteresis of less than 15°, includes a lens body and a first surface modification layer disposed on a surface of the lens body. The first surface modification layer comprises a first reactive hydrophilic polymer. The surface of the lens body has a first functional group or a second functional group, and the first reactive hydrophilic polymer has a third functional group or a fourth functional group. A first covalent cross-link bond is formed between the surface of the lens body and the first surface modification layer. The first covalent cross-link bond is formed by reacting the first functional group or the second functional group of the surface of the lens body with the third functional group or the fourth functional group of the first reactive hydrophilic polymer.

Abstract: A light-emitting diode device is provided, including a submount, a light-emitting diode (LED) chip mounted on the submount, a first transparent insulating layer formed on the submount and the LED chip, a transparent conductive layer formed on the first transparent insulating layer, a phosphor layer formed on the first transparent conductive layer covering the LED chip, and a transparent passivation layer formed on the phosphor layer and over the transparent conductive layer.