Abstract: A wireless earphone comprises a battery, a speaker and a chamber/space. The battery has a first surface, a second surface opposite the first surface, and a third surface extended between the first surface and the second surface. The battery is disconnected from any protecting circuits. The speaker is disposed adjacent to the first surface of the battery. The chamber/space is defined by the battery and the speaker. The chamber/space is devoid of any electronic component.

Abstract: A wireless earphone comprises a battery, a speaker and a chamber/space. The battery has a first surface, a second surface opposite the first surface, and a third surface extended between the first surface and the second surface. The battery is disconnected from any protecting circuits. The speaker is disposed adjacent to the first surface of the battery. The chamber/space is defined by the battery and the speaker. The chamber/space is devoid of any electronic component.

Abstract: A semiconductor device package comprises a first substrate, a first electronic component, an encapsulant, and a feeding structure. The first substrate has a first surface and a second surface opposite the first surface. The first electronic component is disposed on the first surface of the first substrate. The encapsulant encapsulates the first electronic component on the first surface of the first substrate. The feeding structure is disposed on the second surface of the first substrate without covering.

Abstract: The present disclosure provides an ear tip. The ear tip includes a main body, a first conductive element at least partially embedded in the main body, a second conductive element at least partially embedded in the main body and spaced apart from the first conductive element. The main body includes a central portion having a top and a tail portion extending from the top of the central portion. The first conductive element is proximal to the top of the central portion and the second conductive element is distal from the top of the central portion. A wearable device is also disclosed.

Abstract: A semiconductor device package comprises a first substrate, a first electronic component, an encapsulant, and a feeding structure. The first substrate has a first surface and a second surface opposite the first surface. The first electronic component is disposed on the first surface of the first substrate. The encapsulant encapsulates the first electronic component on the first surface of the first substrate. The feeding structure is disposed on the second surface of the first substrate without covering.

Abstract: The present disclosure provides a wearable device. The wearable device includes a first element and a second element. The first element is configured to sense a bio-signal from a user. The second element is configured to transmit the bio-signal to a processor. The second element has a first surface and a second surface non-coplanar with the first surface. The first element is in contact with the first surface and the second surface of the second element.

Abstract: The present disclosure provides a wearable device. The wearable device includes a first sensing element configured to be disposed adjacent to a right ear of a user while the wearable device is worn by the user and a second sensing element configured to be disposed adjacent to a left ear of the user and coupled to the first sensing element while the wearable device is worn by the user. The second sensing element and the first sensing element are configured to sense a biological signal from the user. The wearable device also includes a reference electrode configured to reduce an interference to the biological signal. A headset device and a method for operating a wearable device is also provided in the present disclosure.

Abstract: The present disclosure provides a semiconductor a semiconductor device package includes a substrate, an electronic component disposed on the substrate, a package body disposed on the substrate and encapsulating the electronic component, and a capacitor disposed above the electronic component. The capacitor is exposed from the package body.

Abstract: The present disclosure provides a semiconductor a semiconductor device package includes a substrate, an electronic component disposed on the substrate, a package body disposed on the substrate and encapsulating the electronic component, and a capacitor disposed above the electronic component. The capacitor is exposed from the package body.

Abstract: The present disclosure provides an ear tip. The ear tip includes a main body, a first conductive element at least partially embedded in the main body, a second conductive element at least partially embedded in the main body and spaced apart from the first conductive element. The main body includes a central portion having a top and a tail portion extending from the top of the central portion. The first conductive element is proximal to the top of the central portion and the second conductive element is distal from the top of the central portion. A wearable device is also disclosed.

Abstract: An acoustic device includes a first chamber, a first through hole, a vibration structure, and a separation structure. The first chamber includes a first end and a second end. The first through hole is defined at the first end of the first chamber. The vibration structure is disposed at the second end of the first chamber and is configured to transmit an acoustic wave away from the first chamber. The separation structure is disposed within the first chamber and divides the first chamber into a first sub-chamber and a second sub-chamber. The separation structure defines a second through hole connecting the first sub-chamber and the second sub-chamber.

Abstract: A semiconductor device package comprises a first substrate, a first electronic component, an encapsulant, and a feeding structure. The first substrate has a first surface and a second surface opposite the first surface. The first electronic component is disposed on the first surface of the first substrate. The encapsulant encapsulates the first electronic component on the first surface of the first substrate. The feeding structure is disposed on the second surface of the first substrate without covering.

Abstract: A wireless earphone comprises a battery, a speaker and a chamber/space. The battery has a first surface, a second surface opposite the first surface, and a third surface extended between the first surface and the second surface. The battery is disconnected from any protecting circuits. The speaker is disposed adjacent to the first surface of the battery. The chamber/space is defined by the battery and the speaker. The chamber/space is devoid of any electronic component.

Abstract: An acoustic device includes a first chamber, a first through hole, a vibration structure, and a separation structure. The first chamber includes a first end and a second end. The first through hole is defined at the first end of the first chamber. The vibration structure is disposed at the second end of the first chamber and is configured to transmit an acoustic wave away from the first chamber. The separation structure is disposed within the first chamber and divides the first chamber into a first sub-chamber and a second sub-chamber. The separation structure defines a second through hole connecting the first sub-chamber and the second sub-chamber.