Patents by Inventor Ming-Ting HUANG

Ming-Ting HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11177142
    Abstract: A method includes attaching a first die and a second die to a carrier; forming a molding material between the first die and second die; and forming a redistribution structure over the first die, the second die and the molding material, the redistribution structure includes a first redistribution region; a second redistribution region; and a dicing region between the first redistribution region and the second redistribution region. The method further includes forming a first opening and a second opening in the dicing region, the first opening and the second opening extending through the redistribution structure and exposing the molding material; and separating the first die and the second die by cutting through a portion of the molding material aligned with the dicing region from a second side of the molding material toward the first side of the molding material, the second side opposing the first side.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: November 16, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Li-Hsien Huang, Yueh-Ting Lin, An-Jhih Su, Ming Shih Yeh, Der-Chyang Yeh
  • Patent number: 11158605
    Abstract: A system and method for packaging semiconductor dies is provided. An embodiment comprises a first package with a first contact and a second contact. A post-contact material is formed on the first contact in order to adjust the height of a joint between the contact pad a conductive bump. In another embodiment a conductive pillar is utilized to control the height of the joint between the contact pad and external connections.
    Type: Grant
    Filed: October 23, 2017
    Date of Patent: October 26, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Cheng Lin, Chung-Shi Liu, Kuei-Wei Huang, Cheng-Ting Chen, Wei-Hung Lin, Ming-Da Cheng
  • Patent number: 10172919
    Abstract: Disclosed herein is a method of treating influenza A virus (IAV) infection by a fusion protein. According to some embodiments of the present disclosure, the fusion protein comprises a HBD peptide and a IgG1 Fc region. According to other embodiments of the present disclosure, the fusion protein comprises a DcR3 protein and a IgG1 Fc region. The present fusion protein is found to possess inhibitory effects on IAV-induced secretion of the inflammatory cytokine, and IAV-induced infiltration of inflammatory cell into the lung tissue. Accordingly, the fusion protein is useful for developing a medicament for the treatment or prophylaxis of IAV infection and/or ameliorating pulmonary injury caused by excessive inflammation associated with IAV infection in a subject.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: January 8, 2019
    Assignee: ACADEMIA SINICA
    Inventors: Shie-Liang Hsieh, Yung-Chi Chang, Ming-Ting Huang
  • Publication number: 20170360884
    Abstract: Disclosed herein is a method of treating influenza A virus (IAV) infection by a fusion protein. According to some embodiments of the present disclosure, the fusion protein comprises a HBD peptide and a IgG1 Fc region. According to other embodiments of the present disclosure, the fusion protein comprises a DcR3 protein and a IgG1 Fc region. The present fusion protein is found to possess inhibitory effects on IAV-induced secretion of the inflammatory cytokine, and IAV-induced infiltration of inflammatory cell into the lung tissue. Accordingly, the fusion protein is useful for developing a medicament for the treatment or prophylaxis of IAV infection and/or ameliorating pulmonary injury caused by excessive inflammation associated with IAV infection in a subject.
    Type: Application
    Filed: December 29, 2015
    Publication date: December 21, 2017
    Applicant: Academia Sinica
    Inventors: Shie-Liang HSIEH, Yung-Chi CHANG, Ming-Ting HUANG