Patents by Inventor Ming-Tsung Tsai

Ming-Tsung Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12253895
    Abstract: An electronic system includes a main chip, a non-volatile storage circuit, and a detector circuit. The main chip is configured to read first time of a clock circuit. The non-volatile storage circuit is coupled to the main chip. The main chip stores the first time into the non-volatile storage circuit. The detector circuit includes a first output terminal. The first output terminal is coupled to the main chip. When a cold boot event occurs, the main chip reads the first time from the non-volatile storage circuit, and determines a reason of the cold boot event according to the first time, a second time of the clock circuit, and a logic value at the first output terminal.
    Type: Grant
    Filed: January 3, 2023
    Date of Patent: March 18, 2025
    Assignee: Realtek Semiconductor Corporation
    Inventors: Chao-Min Lai, Chien-Liang Chen, Ming-Tsung Tsai
  • Patent number: 12255070
    Abstract: In a semiconductor structure, a first conductive feature is formed in a trench by PVD and a glue layer is then deposited on the first conductive feature in the trench before CVD deposition of a second conductive feature there-over. The first conductive feature acts as a protection layer to keep silicide from being damaged by later deposition of metal or a precursor by CVD. The glue layer extends along the extent of the sidewall to enhance the adhesion of the second conductive features to the surrounding dielectric layer.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: March 18, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Min-Hsuan Lu, Kan-Ju Lin, Lin-Yu Huang, Sheng-Tsung Wang, Hung-Yi Huang, Chih-Wei Chang, Ming-Hsing Tsai, Chih-Hao Wang
  • Publication number: 20250084274
    Abstract: A curable composition includes an epoxy monomer component and an aniline-based hardener. The epoxy monomer component is a first component formed from a first epoxy monomer represented by Formula (I), or a second component including the first epoxy monomer represented by Formula (I) and a second epoxy monomer different from the first epoxy monomer represented by Formula (I), wherein each of the substituents in Formula (I) is given the definitions as set forth in the Specification and Claims. Based on 100 wt % of the epoxy monomer component, an amount of the first epoxy monomer represented by Formula (I) is not smaller than 25 wt % and less than 100 wt % and an amount of the second epoxy monomer is greater than 0% and not greater than 75 wt %. A cured product formed from the curable composition, and a method for encapsulating a semiconductor device using the curable composition are also provided.
    Type: Application
    Filed: September 12, 2024
    Publication date: March 13, 2025
    Inventors: Yun-Ching WU, Yu-Lin HUANG, Ming-Tsung TSAI, Pei-Nung CHEN, Shu-Wei CHANG, Ming-Tsung HSU
  • Patent number: 12235313
    Abstract: A composite intermediary device using vertical probe for wafer testing, comprising: a printed circuit board, a glass interposer and a vertical probe set; wherein the printed circuit board has printed circuit connected with a measuring apparatus, the glass interposer has multiple contact pads connected with the printed circuit, and then the probes of the vertical probe set are against the contact pads of the glass interposer and the bumps of the device under test. By a fine pitch configuration of the printed circuit and the contact pads of the glass interposer, the present invention achieves the requirements of synchronous and interleaved testing of multiple ICs.
    Type: Grant
    Filed: April 17, 2023
    Date of Patent: February 25, 2025
    Assignee: SYU GUANG TECHNOLOGY CO., LTD.
    Inventors: Kun Yu Wu, Ming Tsung Tsai
  • Publication number: 20250044530
    Abstract: Optical devices and methods of manufacture are presented in which a mirror structure is utilized with an optical interposer. In embodiments a method patterns a substrate to form a recess with a sidewall, forms a mirror coating on the sidewall, deposits and patterns a material to form a first waveguide adjacent to the mirror coating, and bonds an optical interposer over the first waveguide.
    Type: Application
    Filed: December 1, 2023
    Publication date: February 6, 2025
    Inventors: Ming-Fa Chen, Chih-Tsung Tsai, Kuo Chin Hsu
  • Publication number: 20240190491
    Abstract: A mobile kitchen cart assembly has a cart and two supporting stands respectively disposed at two sides of the cart. The cart includes a cart body, a cover plate, and multiple casters disposed at a bottom of the cart body. The cart body includes a carrier portion having an accommodating space and an operational portion located above the carrier portion and having an upper opening communicating with the accommodating space and a knife holder for holding knives. The cover plate covers the upper opening of the operational portion. The mobile kitchen cart assembly provides adequate operational space and a counter top at a suitable height by arrangement of the cart body with the cover plate and the two supporting stands.
    Type: Application
    Filed: December 8, 2022
    Publication date: June 13, 2024
    Applicant: Tryking Development Corporation
    Inventor: MING-TSUNG TSAI
  • Publication number: 20240151764
    Abstract: A composite intermediary device using vertical probe for wafer testing, comprising: a printed circuit board, a glass interposer and a vertical probe set; wherein the printed circuit board has printed circuit connected with a measuring apparatus, the glass interposer has multiple contact pads connected with the printed circuit, and then the probes of the vertical probe set are against the contact pads of the glass interposer and the bumps of the device under test. By a fine pitch configuration of the printed circuit and the contact pads of the glass interposer, the present invention achieves the requirements of synchronous and interleaved testing of multiple ICs.
    Type: Application
    Filed: April 17, 2023
    Publication date: May 9, 2024
    Inventors: KUN YU WU, MING TSUNG TSAI
  • Publication number: 20240109152
    Abstract: The invention relates to a combined dual-wavelength laser light processing device, having two laser light source and a Bessel beam lens, so as to form a Bessel beam with long focal length; Using the coaxial reflecting mirror to achieve deflecting and penetrating to form two coaxial finished light beams; a diffraction optical unit for adjusting the energy distribution of the finished light beam; a work platform; a laser galvanometric scanning module to achieve guiding the finished light beam; a controller electrically connected to the two laser light sources, and controls the projection timing and energy of the first and the second wavelength beams to form at least one rectangular pulse and at least one burst pulse, through the repeated conversion of the dual wavelengths in the composite light wave configuration make the processing of the composite material to be fast and precise.
    Type: Application
    Filed: April 19, 2023
    Publication date: April 4, 2024
    Inventors: Kun Yu Wu, Ming Tsung Tsai
  • Publication number: 20230376319
    Abstract: An electronic system includes a main chip, a non-volatile storage circuit, and a detector circuit. The main chip is configured to read first time of a clock circuit. The non-volatile storage circuit is coupled to the main chip. The main chip stores the first time into the non-volatile storage circuit. The detector circuit includes a first output terminal. The first output terminal is coupled to the main chip. When a cold boot event occurs, the main chip reads the first time from the non-volatile storage circuit, and determines a reason of the cold boot event according to the first time, a second time of the clock circuit, and a logic value at the first output terminal.
    Type: Application
    Filed: January 3, 2023
    Publication date: November 23, 2023
    Inventors: Chao-Min LAI, Chien-Liang CHEN, Ming-Tsung TSAI
  • Patent number: 11611801
    Abstract: The present invention provides a control method applied to an electronic device is disclosed, wherein the electronic device includes a processor and a wireless network module, and the control method includes the steps of: generating a determination result by determining if the wireless network module needs to transmit a packet; and when the determination result indicates that the wireless network module needs to transmit the packet, reducing a frequency of a clock signal used by the processor during a packet transmission.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: March 21, 2023
    Assignee: Realtek Semiconductor Corp.
    Inventors: Zhen-Rong Chen, Cheng-Yu Lee, Chia-Chi Yeh, Ming-Tsung Tsai
  • Patent number: 11314683
    Abstract: A circuitry applied to an electronic device having a Universal Serial Bus (USB) type-C connector is provided. The circuitry includes a transceiver circuit, a physical layer circuit and a processing circuit. In operations of the circuitry, the transceiver circuit is coupled to the USB type-C connector. The physical layer circuit is configured to directly utilize a plurality of first signals from the USB type-C connector as at least one portion of Ethernet signals, and process the first signals to generate a plurality of processed first signals. The processing circuit is configured to process the processed first signals to generate an output signal.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: April 26, 2022
    Assignee: Realtek Semiconductor Corp.
    Inventors: Chao-Min Lai, Ming-Tsung Tsai, Yu-Jen Lin, Shih-An Yang
  • Patent number: 11231759
    Abstract: A performance management method and an electronic device are provided. The method is applied to the electronic device with a system processor and includes: sensing a temperature of the electronic device and determining whether the temperature is greater than a first temperature setting value; when the temperature is not greater than the first temperature setting value, initiating a frequency increasing procedure; when the temperature is greater than the first temperature setting value, determining whether the temperature is greater than a second temperature setting value, where the second temperature setting value is greater than the first temperature setting value; when the temperature is greater than the first temperature setting value and is not greater than the second temperature setting value, initiating a first frequency reducing procedure; and when the temperature is greater than the second temperature setting value, initiating a second frequency reducing procedure or turning off the system processor.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: January 25, 2022
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Chien-Liang Chen, Chao-Min Lai, Ming-Tsung Tsai, Cheng-Yu Lee
  • Publication number: 20210352377
    Abstract: The present invention provides a control method applied to an electronic device is disclosed, wherein the electronic device includes a processor and a wireless network module, and the control method includes the steps of: generating a determination result by determining if the wireless network module needs to transmit a packet; and when the determination result indicates that the wireless network module needs to transmit the packet, reducing a frequency of a clock signal used by the processor during a packet transmission.
    Type: Application
    Filed: March 3, 2021
    Publication date: November 11, 2021
    Inventors: Zhen-Rong Chen, Cheng-Yu Lee, Chia-Chi Yeh, Ming-Tsung Tsai
  • Publication number: 20210200709
    Abstract: A circuitry applied to an electronic device having a Universal Serial Bus (USB) type-C connector is provided. The circuitry includes a transceiver circuit, a physical layer circuit and a processing circuit. In operations of the circuitry, the transceiver circuit is coupled to the USB type-C connector. The physical layer circuit is configured to directly utilize a plurality of first signals from the USB type-C connector as at least one portion of Ethernet signals, and process the first signals to generate a plurality of processed first signals. The processing circuit is configured to process the processed first signals to generate an output signal.
    Type: Application
    Filed: December 17, 2020
    Publication date: July 1, 2021
    Inventors: Chao-Min Lai, Ming-Tsung Tsai, Yu-Jen Lin, Shih-An Yang
  • Publication number: 20210181822
    Abstract: A performance management method and an electronic device are provided. The method is applied to the electronic device with a system processor and includes: sensing a temperature of the electronic device and determining whether the temperature is greater than a first temperature setting value; when the temperature is not greater than the first temperature setting value, initiating a frequency increasing procedure; when the temperature is greater than the first temperature setting value, determining whether the temperature is greater than a second temperature setting value, where the second temperature setting value is greater than the first temperature setting value; when the temperature is greater than the first temperature setting value and is not greater than the second temperature setting value, initiating a first frequency reducing procedure; and when the temperature is greater than the second temperature setting value, initiating a second frequency reducing procedure or turning off the system processor.
    Type: Application
    Filed: June 17, 2020
    Publication date: June 17, 2021
    Applicant: REALTEK SEMICONDUCTOR CORP.
    Inventors: Chien-Liang Chen, Chao-Min Lai, Ming-Tsung Tsai, Cheng-Yu Lee
  • Publication number: 20210079146
    Abstract: A polyolefin derivative and a composite material are provided. The polyolefin derivative is formed by reacting a modified polyolefin and an amine compound, wherein the modified polyolefin is formed by grafting a maleic anhydride onto a polyolefin. The amine compound includes a polyether amine and an alkylamine. Based on 100 parts by mole of the maleic anhydride group in the modified polyolefin, a reacting amount of the alkylamine is 1 part by mole to 40 parts by mole.
    Type: Application
    Filed: March 25, 2020
    Publication date: March 18, 2021
    Applicant: Daxin Materials Corporation
    Inventors: Ming-Tsung Tsai, Cheng-Hung Lee, Wei-Yao Lai
  • Patent number: 10776051
    Abstract: A memory sharing dual-mode network communication device includes a first memory, an OTT module and a PON module. The first memory is divided into an OTT region and a PON region, and the OTT module is used to obtain an OTT service, which includes an OTT processor, a memory arbitration circuit, a first memory main controller, a bridge circuit, and a memory slave controller. The PON module includes a PON processor and a second memory main controller. The memory arbitration circuit is configured to respond to a first access request from the OTT processor or a second access request of the PON processor to access the OTT area or the PON area of the first memory through the first memory host controller, and the memory arbitration circuit further determines the priority order of the first access request and the second access request.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: September 15, 2020
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Ming-Tsung Tsai, Chiu-Yun Tsai, Chien-Lien Peng, Fu-Ching Hsu
  • Publication number: 20200210109
    Abstract: A memory sharing dual-mode network communication device includes a first memory, an OTT module and a PON module. The first memory is divided into an OTT region and a PON region, and the OTT module is used to obtain an OTT service, which includes an OTT processor, a memory arbitration circuit, a first memory main controller, a bridge circuit, and a memory slave controller. The PON module includes a PON processor and a second memory main controller. The memory arbitration circuit is configured to respond to a first access request from the OTT processor or a second access request of the PON processor to access the OTT area or the PON area of the first memory through the first memory host controller, and the memory arbitration circuit further determines the priority order of the first access request and the second access request.
    Type: Application
    Filed: May 14, 2019
    Publication date: July 2, 2020
    Inventors: MING-TSUNG TSAI, CHIU-YUN TSAI, CHIEN-LIEN PENG, FU-CHING HSU
  • Publication number: 20190327519
    Abstract: A network streaming device that includes a wireless transmission module and a host module is provided. The wireless transmission module is configured to perform wireless communication with an external wireless access point through a wireless channel within a wireless frequency band. The host module is configured to be coupled with the wireless transmission module and generates a clock signal to the wireless transmission module according to a frequency range of the wireless channel such that the wireless transmission module operates according to the clock signal. The host module determines an operation frequency of the clock signal according to the frequency range of the wireless channel such that a plurality of harmonics of the clock signal generated according to the operation frequency are not within the frequency range.
    Type: Application
    Filed: October 22, 2018
    Publication date: October 24, 2019
    Inventors: Ming-Tsung Tsai, Huang-Lin Kuo
  • Patent number: D917184
    Type: Grant
    Filed: December 2, 2019
    Date of Patent: April 27, 2021
    Assignee: TRYKING DEVELOPMENT CORPORATION
    Inventor: Ming Tsung Tsai