Patents by Inventor Ming-Wu Lee

Ming-Wu Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110076455
    Abstract: A key includes a preform, a first molded layer formed on a first side surface of the preform by injection molding, and a second molded layer formed on the second side surface by injection molding. The preform, the first molded layer, and the second molded layer cooperatively define a depression. A periphery of the first molded layer forms an assembly portion. A portion of the second layer on the periphery of the first molder layer is substantially parallel to a portion of the ink layer on the periphery of the first molder layer. A method of manufacturing the key is also provided.
    Type: Application
    Filed: November 24, 2009
    Publication date: March 31, 2011
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen)CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: MING-WU LEE, HAO-DONG XU, CHU-YUAN CHEN, SHOU-FANG ZHONG
  • Patent number: 6363607
    Abstract: A method of manufacturing a high density connector comprises five steps. The first step is to prepare essential elements of the connector, such as a dielectric cover, a metallic shell, a pair of guiding members and a plurality of contacts. Each contact is L-shaped and comprises a horizontal soldering portion. The second step is to first insert mold a pair of dielectric bases around the contacts to produce a contact subassembly. The three step is to second insert mold a dielectric housing around the contact subassembly to form a contact module. The forth step is to adjust the horizontal soldering portions of the contacts for ensuring a good coplanarity thereof. The fifth step is to assemble the contact module with the cover, the shell and the guiding members, thereby completing the connector.
    Type: Grant
    Filed: October 6, 1999
    Date of Patent: April 2, 2002
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Chao-Hsu Chen, Ming-Wu Lee, Kun-Tsan Wu
  • Patent number: 6132261
    Abstract: A high-density electrical connector comprises two sets of SMT contacts and two sets of DIP contacts, a dielectric housing formed by insert molding and a shield covering the housing, the dielectric housing comprises a pair of first housing members and a second housing member around the pair of first housing members, each first housing member is insert molded to a set of SMT contacts on one side thereof and a set of DIP contacts on an opposite side thereof in a first insert molding step, the second housing member is insert molded to and combines the pair of first housing members having the SMT contacts and the DIP contacts, thus, proper alignment, engagement, and coplanarity of the contacts assembled in the housing are easily obtained without interference from an insertion force.
    Type: Grant
    Filed: September 28, 1999
    Date of Patent: October 17, 2000
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Ming-Wu Lee, Kun-Tsan Wu, Song-Rong Chiou
  • Patent number: 6102748
    Abstract: A high-density electrical connector comprises a housing, two sets of SMT contacts insert molded in opposite sides of the housing, and a shield covering the housing. The housing comprises a first housing member and a second housing member surroundingly incorporating the first housing member. A recess is defined between the first and second housing members. A method of manufacturing the high-density connector comprises the steps of: 1) insert molding a pair of SMT contact carriers to opposite sides of the first housing member; 2) insert molding the first housing member having the two SMT contact carriers to the second housing member; 3) severing carrier plates from the two SMT contact carriers; 4) assembling the shield to the housing. The first insert molding forms a base and a crossbeam retaining mounting and mating portions of the SMT contacts with a gap defined therebetween. The base defines a plurality of openings.
    Type: Grant
    Filed: October 5, 1999
    Date of Patent: August 15, 2000
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Ming-Wu Lee, Kun-Tsan Wu, Jen-Jou Chang