Patents by Inventor Ming Yang

Ming Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250006774
    Abstract: A light emitting plate, a wiring plate and a display device are provided. The light emitting plate includes light emitting units. Each light emitting unit includes a light emitting sub-unit including a connection line unit and a light emitting diode chip connected with the connection line unit. The connection line unit includes electrical contact pairs, and each electrical contact pairs includes a first electrode contact and a second electrode contact; in each connection line unit, the second electrode contacts are electrically connected with each other, the first electrode contacts are electrically connected with each other, and only one electrical contact pairs in each connection line unit is connected with the light emitting diode chip; in each connection line unit, at least two first electrode contacts are arranged adjacent to each other, and at least two first electrode contacts are arranged between at least two second electrode contacts.
    Type: Application
    Filed: September 13, 2024
    Publication date: January 2, 2025
    Applicant: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Ming YANG, Wei HAO, Qibing GU, Guofeng HU, Lingyun SHI, Minghua XUAN, Can ZHANG
  • Patent number: 12181629
    Abstract: Various embodiments may relate to an optical device. The optical device may include a stacked structure having a first surface and a second surface opposite the first surface. The stacked structure may include a plurality of holes or grooves extending from the first surface towards the second surface. The stacked structure may include a transition metal dichalcogenide material (TMDC) material. A thickness of the stacked structure may be of any value less than 100 nm.
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: December 31, 2024
    Assignee: Agency for Science, Technology and Research
    Inventors: Zeng Wang, Jinghua Teng, Shijie Wang, Ming Yang
  • Patent number: 12178920
    Abstract: Nanocrystals, compositions, and methods that aid particle transport in mucus are provided. In some embodiments, the compositions and methods involve making mucus-penetrating particles (MPP) without any polymeric carriers, or with minimal use of polymeric carriers. The compositions and methods may include, in some embodiments, modifying the surface coatings of particles formed of pharmaceutical agents that have a low water solubility. Such methods and compositions can be used to achieve efficient transport of particles of pharmaceutical agents though mucus barriers in the body for a wide spectrum of applications, including drug delivery, imaging, and diagnostic applications. In certain embodiments, a pharmaceutical composition including such particles is well-suited for administration routes involving the particles passing through a mucosal barrier.
    Type: Grant
    Filed: December 5, 2023
    Date of Patent: December 31, 2024
    Assignee: The Johns Hopkins University
    Inventors: Alexey Popov, Elizabeth M. Enlow, James Bourassa, Colin R. Gardner, Hongming Chen, Laura M. Ensign, Samuel K. Lai, Tao Yu, Justin Hanes, Ming Yang
  • Patent number: 12171798
    Abstract: Provided are an essential oil composition and a preparation method thereof. The essential oil composition includes a eutectic composition and an essential oil; the eutectic composition includes a hydrogen-bond donor and a hydrogen-bond acceptor; the hydrogen-bond donor is geranic acid or derivatives of the geranic acid; the hydrogen-bond acceptor is choline or derivatives or hydrates of the choline; a mass ratio of the hydrogen-bond donor to the hydrogen-bond acceptor is 1-10:1-10.
    Type: Grant
    Filed: March 13, 2024
    Date of Patent: December 24, 2024
    Assignee: Jiangxi University of Chinese Medicine
    Inventors: Zhenfeng Wu, Wei He, Di Wang, Ming Yang, Na Wan
  • Patent number: 12173332
    Abstract: A new mutant of D-amino acid transaminase, based on supercomputing-assisted technology, belongs to the fields of computational biology, computer-aided design, and enzyme engineering technology, and specifically relates to mutants of D-amino acid transaminase obtained based on supercomputing-assisted technology and applications thereof. Compared to the wild-type enzyme, the aforementioned mutant of D-amino acid transaminase exhibits a half-life (t1/2) of over 12 hours at 40° C., while it is only 8.8 minutes for the wild-type D-amino acid transaminase. The half-inactivation temperature (T5015) of the mutant is 45.3° C., approximately 5.4° C. higher than that of the wild-type D-amino acid transaminase. This substantially enhances its thermal stability, enzymatic activity, etc., effectively broadening its application fields and scope. The mutant has a wide range of industrial applications and thus holds substantial practical value.
    Type: Grant
    Filed: July 26, 2023
    Date of Patent: December 24, 2024
    Assignee: SHANDONG COMPUTER SCIENCE CENTER (NATIONAL SUPERCOMPUTER CENTER IN JINAN)
    Inventors: Xin Wang, Ming Yang, Xiaoming Wu, Fuqiang Wang, Yan Liang, Zhenya Chen, Chao Mu
  • Patent number: 12176583
    Abstract: The present disclosure discloses a protective film assembly, applied to an electrode assembly of an energy storage device, and including an insulation sheet for wrapping the electrode assembly and arranged between a housing of the energy storage device and the electrode assembly. The first side surface covering region includes a first covering sub-region and a second covering sub-region which can overlap each other; the second side surface covering region includes a third covering sub-region and a fourth covering sub-region which can overlap each other; the maximum sizes of the first covering sub-region and the second covering sub-region in a thickness direction and height direction of the electrode assembly are equal, so that the first covering sub-region and the second covering sub-region have a high matching degree and a large bonding area. The present disclosure further discloses an energy storage device.
    Type: Grant
    Filed: March 9, 2023
    Date of Patent: December 24, 2024
    Assignees: SHENZHEN HITHIUM ENERGY STORAGE TECHNOLOGY CO., LTD, XIAMEN HITHIUM ENERGY STORAGE TECHNOLOGY CO., LTD.
    Inventors: Wenyang Zhou, Yongfeng Xiong, Ming Yang
  • Patent number: 12174526
    Abstract: A pellicle for an EUV photo mask includes a first layer, a second layer, and a main membrane disposed between the first layer and second layer. The main membrane includes a plurality of co-axial nanotubes, each of which includes an inner tube and one or more outer tubes surrounding the inner tube, and two of the inner tube and one or more outer tubes are made of different materials from each other.
    Type: Grant
    Filed: January 14, 2022
    Date of Patent: December 24, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tzu-Ang Chao, Chao-Ching Cheng, Han Wang, Ming-Yang Li, Gregory Michael Pitner
  • Publication number: 20240415239
    Abstract: A free-ends belt buckle, adapted to tighten a flexible belt strap having a strap body and two end portions, includes a buckle panel and a pair of interlocking arrangements symmetrically provided at two ends of the buckle panel. Each of the interlocking arrangements includes a side portion, a pair of outer and inner locker slots transversely formed in the side portion in a parallel manner, and a locker bar defined between the outer locker slot and the inner locker slot. Thereby, the two end portions of the belt strap are capable of penetrating through the two outer locker slots from rearside to frontside respectively, bending about the two locker bars respectively, penetrating through the two inner locker slots from frontside to rearside respectively, and bending towards the two outer locker slots respectively and extending along an underside of the belt strap body of the belt strap.
    Type: Application
    Filed: June 14, 2023
    Publication date: December 19, 2024
    Inventor: Ming Yang
  • Publication number: 20240420838
    Abstract: An embodiment of the invention provides a physiological information monitoring system. The physiological information monitoring system may include a server, a monitoring device and at least one gateway. The server may store and analyze physiological information of a user. The monitoring device may measure the physiological information and broadcast a Bluetooth Low Energy (BLE) advertising packet comprising the physiological information. The gateway may detect the BLE advertising packet and transmit the detected BLE advertising packet to the server.
    Type: Application
    Filed: November 24, 2023
    Publication date: December 19, 2024
    Inventors: Yen-Ching YU, Chi-Ming YANG, Jui-Wei CHIANG
  • Patent number: 12170056
    Abstract: A light emitting substrate is provided. The light emitting substrate includes a plurality of light emitting controlling units arranged in M rows and N columns, M is an integer equal to or greater than one, N is an integer equal to or greater than one, wherein a respective one of the plurality of light emitting controlling units includes a plurality of light emitting elements arranged in J rows and I columns, J being an integer equal to or greater than one, I being an integer equal to or greater than one, a i-th column of the I columns of light emitting elements includes J rows of light emitting elements, 1?i?I; (M×J) number of first voltage signal lines; and (M×J) number of groups of second voltage signal lines.
    Type: Grant
    Filed: November 14, 2023
    Date of Patent: December 17, 2024
    Assignee: BOE Technology Group Co., Ltd.
    Inventors: Ming Yang, Qi Qi, Wanzhi Chen, Lubin Shi, Fuqiang Li, Fei Wang
  • Publication number: 20240413067
    Abstract: An electronic package module including a circuit substrate, an electronic component disposed on the circuit substrate and a molding compound is provided. The molding compound encapsulates the circuit substrate and the electronic component. The circuit substrate includes a first circuit layer and a first insulation layer covering on the first circuit layer. The first insulation layer has a boundary surface where a second circuit layer is disposed. A second insulation layer covers a part of the second circuit layer while the insulation layer bares a region surrounding the perimeter of the boundary surface. The molding compound directly contacts the region and the second insulation layer.
    Type: Application
    Filed: July 28, 2023
    Publication date: December 12, 2024
    Inventors: Chia-Yu PENG, Kai-Ming YANG, Pu-Ju LIN, Cheng-Ta KO
  • Publication number: 20240411095
    Abstract: The present disclosure provides a signal transmission device for setting on a wall. The signal transmission device comprises a circuit board, an electrical signal connector, an optical signal connector, a photoelectric converter, and a power injector. The electrical signal connector is arranged on the circuit board and configured to transmit and receive an electrical signal. The optical signal connector is arranged on the circuit board and configured to transmit and receive an optical signal. The photoelectric converter is placed on the circuit board and coupled between the electrical and optical signal connectors. Selectively. The photoelectric converter selectively converts the electrical signal to the optical signal or the optical signal to the electrical signal. The power injector is arranged on the circuit board and configured to provide working power to the photoelectric converter.
    Type: Application
    Filed: June 7, 2024
    Publication date: December 12, 2024
    Applicant: ELKA INTERNATIONAL LTD.
    Inventor: Jui-Ming YANG
  • Publication number: 20240411084
    Abstract: An exemplary package includes a photonic die, an electronic die, and a package component. The electronic die has an electronic device layer disposed between a frontside interconnect structure and a backside interconnect structure. The backside interconnect structure is configured to deliver power to the electronic device layer. The photonic die, the electronic die, and the package component are stacked top-to-bottom. The backside interconnect structure of the electronic die is connected to the package component, and the photonic die is connected to the electronic die. In some embodiments, the photonic die and the electronic die are each free of through semiconductor vias, such as through silicon vias. In some embodiments, a frontside interconnect structure of the photonic die is connected to the frontside interconnect structure of the electronic die. In some embodiments, a backside interconnect structure of the photonic die is connected to the frontside interconnect structure of the electronic die.
    Type: Application
    Filed: June 9, 2023
    Publication date: December 12, 2024
    Inventors: Stefan Rusu, Lan-Chou Cho, Ming Yang Jung, Tai-Chun Huang, You-Cheng Lu
  • Publication number: 20240402147
    Abstract: A method of establishing a cancer screening model is provided, including: providing a plurality of samples and a plurality of corresponding cancer states; analyzing these samples by a low-resolution mass spectrometer to obtain a plurality of mass spectral data, wherein the low-resolution mass spectrometer is undertaken a mass accuracy level above 5 ppm and a mass resolution (m/?m) below 10,000; inputting these mass spectral data into a machine learning algorithm to obtain a plurality of markers by a feature selection method; and using these markers and these cancer states by the machine learning algorithms to establish cancer screening model.
    Type: Application
    Filed: May 28, 2024
    Publication date: December 5, 2024
    Inventors: Cheng-Chih HSU, Hou-Chun HUANG, Hsin-Hsiang CHUNG, Laura Min Xuan CHAI, Yi-Hsin CHEN, Jia-Ying YU, Ming-Yang WANG
  • Publication number: 20240405123
    Abstract: A high-voltage device structure and methods of forming the same are described. In some embodiments, the structure includes a deep well region of a first conductivity type disposed in a substrate, a doped region disposed on the deep well region; a well region of the first conductivity type surrounding the deep well region and the doped region; a source region disposed on the well region, a drain region disposed on the doped region, and a first pickup region of the first conductivity type disposed on the well region. The first pickup region is laterally in contact with the source region, and the first pickup region, the well region, and the deep well region are electrically connected.
    Type: Application
    Filed: June 5, 2023
    Publication date: December 5, 2024
    Inventors: Chien-Ming KU, Wei-Jen CHANG, Wen-Hsing HSIEH, Ming-Yang HSU, Chia-Chi HO, Chung-Shih CHIANG
  • Patent number: 12159787
    Abstract: In a pattern formation method, a photoresist layer is formed over a substrate by combining a first precursor and a second precursor in a vapor state to form a photoresist material. The first precursor is an organometallic having a formula MaRbXc, where M is one or more selected from the group consisting of Sn, Bi, Sb, In, and Te, R is an alkyl group that is substituted by different EDG and/or EWG, X is a halide or sulfonate group, and 1?a?2, b?1, c?1, and b+c?4. The second precursor is water, an amine, a borane, and/or a phosphine. The photoresist material is deposited over the substrate, and selectively exposed to actinic radiation to form a latent pattern, and the latent pattern is developed by applying a developer to the selectively exposed photoresist layer to form a pattern.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: December 3, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chih-Cheng Liu, Ming-Hui Weng, Jr-Hung Li, Yahru Cheng, Chi-Ming Yang, Tze-Liang Lee, Ching-Yu Chang
  • Patent number: 12160953
    Abstract: A circuit board structure includes a carrier, a thin film redistribution layer disposed on the carrier, solder balls electrically connected to the thin film redistribution layer and the carrier, and a surface treatment layer. The thin film redistribution layer includes a first dielectric layer, pads, a first metal layer, a second dielectric layer, a second metal layer, and a third dielectric layer. A top surface of the first dielectric layer is higher than an upper surface of each pad. The first metal layer is disposed on a first surface of the first dielectric layer. The second dielectric layer has second openings exposing part of the first metal layer. The second metal layer extends into the second openings and is electrically connected to the first metal layer. The third dielectric layer has third openings exposing part of the second metal layer. The surface treatment layer is disposed on the upper surfaces.
    Type: Grant
    Filed: November 23, 2022
    Date of Patent: December 3, 2024
    Assignee: Unimicron Technology Corp.
    Inventors: Kai-Ming Yang, Chia-Yu Peng, Cheng-Ta Ko, Pu-Ju Lin
  • Publication number: 20240393656
    Abstract: A method of characterizing a traveling-wave Mach-Zehnder modulator (TWMZM) includes measuring an electrooptic parameter, such as S21, of a test structure including a test TWMZM and a first instance of electrical pads which are connected to deliver a radio frequency (RF) signal to electrooptically modulate light traveling through the test TWMZM. The electrooptic parameter is similarly measured of a reference structure including a reference TWMZM and a second instance of the electrical pads which are connected to deliver the RF signal to electrooptically modulate light traveling through the reference TWMZM. A vestigial traveling-wave electrooptic phase modulator of the reference TWMZM is shorter than a traveling-wave electrooptic phase modulator of the test TWMZM. An electrooptic characteristic of the test TWMZM, such as S21 bandwidth, is determined by operations including subtracting the measured electrooptic S21 of the reference structure from the measured electrooptic S21 of the test structure.
    Type: Application
    Filed: July 30, 2024
    Publication date: November 28, 2024
    Inventors: Ming Yang Jung, Lan-Chou Cho, Stefan Rusu
  • Publication number: 20240395612
    Abstract: A layer of carbon (e.g., graphite or graphene) at a metal interface (e.g., between an MEOL interconnect and a gate contact or a source or drain region contact, between an MEOL contact plug and a BEOL metallization layer, and/or between BEOL conductive structures) is used to reduce contact resistance at the metal interface, which increases electrical performance of an electronic device. Additionally, in some implementations, the layer of carbon may help prevent heat transfer from a second metal to a first metal when the second metal is deposited over the first metal. This results in more symmetric deposition of the second metal, which reduces surface roughness and contact resistance at the metal interface. As an alternative, in some implementations, the layer of carbon is etched before deposition of the second metal in order to reduce contact resistance at the metal interface.
    Type: Application
    Filed: July 31, 2024
    Publication date: November 28, 2024
    Inventors: Po-Hsien CHENG, Chi-Ming YANG, Tze-Liang LEE
  • Publication number: 20240395993
    Abstract: A pixel circuit includes a pixel driving circuit and a bonding unit connected thereto. The bonding unit includes a first bonding terminal group and at least one second bonding terminal group that are arranged in parallel, and the first bonding terminal group and a second bonding terminal group are configured to bond light-emitting devices. The first bonding terminal group includes a first terminal and a second terminal, and the second bonding terminal group includes a third terminal and a fourth terminal. The first terminal and the third terminal are connected, and are both connected to the pixel driving circuit; the second terminal and the fourth terminal are connected, and are both connected to a set voltage signal line.
    Type: Application
    Filed: April 29, 2024
    Publication date: November 28, 2024
    Applicant: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Ming YANG, Seungwoo HAN, Zhuo LI, Dingchang ZHANG, Xuan FENG, Hui ZHANG, Liwei LIU