Patents by Inventor Ming Yang

Ming Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230402321
    Abstract: A layer of carbon (e.g., graphite or graphene) at a metal interface (e.g., between an MEOL interconnect and a gate contact or a source or drain region contact, between an MEOL contact plug and a BEOL metallization layer, and/or between BEOL conductive structures) is used to reduce contact resistance at the metal interface, which increases electrical performance of an electronic device. Additionally, in some implementations, the layer of carbon may help prevent heat transfer from a second metal to a first metal when the second metal is deposited over the first metal. This results in more symmetric deposition of the second metal, which reduces surface roughness and contact resistance at the metal interface. As an alternative, in some implementations, the layer of carbon is etched before deposition of the second metal in order to reduce contact resistance at the metal interface.
    Type: Application
    Filed: August 10, 2023
    Publication date: December 14, 2023
    Inventors: Po-Hsien CHENG, Chi-Ming YANG, Tze-Liang LEE
  • Patent number: 11843467
    Abstract: Certain aspects of the present disclosure provide techniques for slot aggregation configuration with user equipment (UE) assistance information. A method that may be performed by a UE may include transmitting, to a base station (BS), assistance information indicating a preferred repetition factor. The method generally includes receiving an indication from the BS of a repetition factor. The BS can determine the repetition factor for the UE based, at least in part, on the assistance information and indicate the determined repetition factor to the UE.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: December 12, 2023
    Assignee: QUALCOMM Incorporated
    Inventors: Ming Yang, Kausik Ray Chaudhuri, Juan Montojo
  • Patent number: 11844125
    Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment may transmit, to a base station, assistance information that indicates a packet data convergence protocol (PDCP) preference for multiple connectivity communications from a master node and one or more secondary nodes; and receive, from the base station, a communication that indicates a routing of a sequence of PDCP packages across the master node and one or more active secondary nodes. Numerous other aspects are provided.
    Type: Grant
    Filed: June 11, 2021
    Date of Patent: December 12, 2023
    Assignee: QUALCOMM Incorporated
    Inventors: Ming Yang, Kausik Ray Chaudhuri, Juan Montojo
  • Patent number: 11837153
    Abstract: A light emitting substrate is provided. The light emitting substrate includes a plurality of light emitting controlling units arranged in M rows and N columns, M is an integer equal to or greater than one, N is an integer equal to or greater than one, wherein a respective one of the plurality of light emitting controlling units includes a plurality of light emitting elements arranged in J rows and I columns, J being an integer equal to or greater than one, I being an integer equal to or greater than one, a i-th column of the I columns of light emitting elements includes J rows of light emitting elements, 1?i?I; (M×J) number of first voltage signal lines; and (M×J) number of groups of second voltage signal lines.
    Type: Grant
    Filed: March 4, 2021
    Date of Patent: December 5, 2023
    Assignee: BOB Technology Group Co., Ltd.
    Inventors: Ming Yang, Qi Qi, Wanzhi Chen, Lubin Shi, Fuqiang Li, Fei Wang
  • Patent number: 11837011
    Abstract: A button module with vibration feedback and fingerprint sensing, a fingerprint sensing module for the same, and a control method for the same are provided. The fingerprint sensing module has a fingerprint sensing unit stacked on a vibration unit. When the fingerprint sensing module detects a fingerprint, the control unit or a host of an electronic device determines whether the fingerprint is authenticated. If it is not authenticated, the vibration unit is activated, so that the user realizes that the authentication is not passed in real time through the vibration. Then the user may quickly change another finger or move the finger's position to speed up the authentication process. This can prevent users from waiting to improve user experience.
    Type: Grant
    Filed: March 14, 2022
    Date of Patent: December 5, 2023
    Assignee: ELAN MICROELECTRONICS CORPORATION
    Inventors: Nan-Jung Liu, Tung-Ming Yang
  • Patent number: 11829225
    Abstract: Embodiments may include systems, techniques, methods, apparatus and/or device to receive an input selecting one or more areas of a display of the computing device, leaving one or more other areas of the display unselected, and to apply a masking layer to mask either pixels of the one or more selected areas or pixels of the one or more unselected areas to cause the masked pixels to be dimmed, to reduce power consumption by the display. Embodiments may further include where the one or more of the selected areas include a focus area of interest, and to apply the masking layer to mask pixels of the one or more unselected areas to cause the masked pixels to be dimmed. Embodiments may be implemented via software without directly interacting with hardware. Other embodiments may be described or claimed.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: November 28, 2023
    Assignee: Intel Corporation
    Inventors: Lunkai Zou, Hua-Mei Yang, Yiming He, Feng-Ming Yang, Ajay Saini, Ahmed Omer
  • Patent number: 11830419
    Abstract: A display panel and a light emitting signal generator thereof are provided. The light emitting signal generator includes an output stage circuit, a first control signal generator, a second control signal generator, a switch, and a capacitor. The output stage circuit generates a light emitting signal according to a first control signal and a second control signal. The first control signal generator generates the first control signal at a first control end. The second control signal generator generates the second control signal at a second control end. The switch is coupled between the first control end and the output stage circuit. The first capacitor is coupled to the first control end.
    Type: Grant
    Filed: December 22, 2022
    Date of Patent: November 28, 2023
    Assignee: AUO Corporation
    Inventors: Ming-Yang Deng, Ming-Hung Chuang
  • Patent number: 11832268
    Abstract: In some aspects, a method of wireless communication includes receiving control information by a UE from a base station. The control information indicates one or more first frequency resources of a BWP that are associated with a first communication type and further indicates one or more second frequency resources of the BWP that are associated with a second communication type. The method further includes, based on a first data type of first data corresponding to the first communication type and further based on a second data type of second data corresponding to the second communication type, performing a wireless communication with the base station using the one or more first frequency resources to communicate the first data and using the one or more second frequency resources to communicate the second data.
    Type: Grant
    Filed: May 6, 2021
    Date of Patent: November 28, 2023
    Assignee: QUALCOMM Incorporated
    Inventors: Ming Yang, Kausik Ray Chaudhuri, Juan Montojo
  • Publication number: 20230378360
    Abstract: The present disclosure describes structure and method of a fin field-effect transistor (finFET) device. The finFET device includes: a substrate, a fin over the substrate, and a gate structure over the fin. The gate structure includes a work-function metal (WFM) layer over an inner sidewall of the gate structure. A topmost surface of the WFM layer is lower than a top surface of the gate structure. The gate structure also includes a filler gate metal layer over the topmost surface of the WFM layer. A top surface of the filler gate metal layer is substantially co-planar with the top surface of the gate structure. The gate structure further includes a self-assembled monolayer (SAM) between the filler gate metal layer and the WFM layer.
    Type: Application
    Filed: July 28, 2023
    Publication date: November 23, 2023
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ju-Li Huang, Hsin-Che Chiang, Yu-Chi Pan, Chun-Ming Yang, Chun-Sheng Liang, Ying-Liang Chuang, Ming-Hsi Yeh
  • Publication number: 20230375920
    Abstract: A method of manufacturing a semiconductor device includes forming a photoresist layer over a substrate, including combining a first precursor and a second precursor in a vapor state to form a photoresist material, and depositing the photoresist material over the substrate. A protective layer is formed over the photoresist layer. The photoresist layer is selectively exposed to actinic radiation through the protective layer to form a latent pattern in the photoresist layer. The protective layer is removed, and the latent pattern is developed by applying a developer to the selectively exposed photoresist layer to form a pattern.
    Type: Application
    Filed: August 3, 2023
    Publication date: November 23, 2023
    Inventors: Ming-Hui WENG, Chen-Yu LIU, Chih-Cheng LIU, Yi-Chen KUO, Jia-Lin WEI, Yen-Yu CHEN, Jr-Hung LI, Yahru CHENG, Chi-Ming YANG, Tze-Liang LEE, Ching-Yu CHANG
  • Publication number: 20230376653
    Abstract: A neural network is used to place macros on a chip canvas in an integrated circuit (IC) design. The macros are first clustered into multiple macro clusters. Then the neural network generates a probability distribution over locations on a grid and aspect ratios of a macro cluster. The grid represents the chip canvas and is formed by rows and columns of grid cells. The macro cluster is described by at least an area size, aspect ratios, and wire connections. Action masks are generated for respective ones of the aspect ratios to block out a subset of unoccupied grid cells based on design rules that optimize macro placement. Then, by applying the action masks on the probability distribution, a masked probability distribution is generated. Based on the masked probability distribution, a location on the grid is selected for placing the macro cluster with a chosen aspect ratio.
    Type: Application
    Filed: May 11, 2023
    Publication date: November 23, 2023
    Inventors: Hsin-Chuan Kuo, Chia-Wei Chen, Yu-Hsiu Lin, Kun-Yu Wang, Sheng-Tai Tseng, Chun-Ku Ting, Fang-Ming Yang, Yu-Hsien Ku, Jen-Wei Lee, Ronald Kuo-Hua Ho, Chun-Chieh Wang, Yi-Ying Liao, Tai-Lai Tung, Ming-Fang Tsai, Chun-Chih Yang, Chih-Wei Ko, Kun-Chin Huang
  • Patent number: 11822237
    Abstract: A method of manufacturing a semiconductor device includes forming a photoresist layer over a substrate, including combining a first precursor and a second precursor in a vapor state to form a photoresist material, and depositing the photoresist material over the substrate. A protective layer is formed over the photoresist layer. The photoresist layer is selectively exposed to actinic radiation through the protective layer to form a latent pattern in the photoresist layer. The protective layer is removed, and the latent pattern is developed by applying a developer to the selectively exposed photoresist layer to form a pattern.
    Type: Grant
    Filed: October 15, 2020
    Date of Patent: November 21, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ming-Hui Weng, Chen-Yu Liu, Chih-Cheng Liu, Yi-Chen Kuo, Jia-Lin Wei, Yen-Yu Chen, Jr-Hung Li, Yahru Cheng, Chi-Ming Yang, Tze-Liang Lee, Ching-Yu Chang
  • Patent number: 11824012
    Abstract: An integrated circuit (IC) package structure includes a chip, a redistribution layer (RDL) structure, a molding compound structure and an electromagnetic interference (EMI) shielding structure. The RDL structure is formed on the chip and electrically connected thereto. The molding compound layer is provided on outer surfaces of the chip and the RDL structure. The EMI shielding structure is provided on outer surfaces of the molding compound structure. The molding compound structure layer provided on outer surfaces of the chip and the RDL structure provide protection and reinforcement to multiple faces of the IC package structure; and the EMI shielding structure provided on outer surfaces of the molding compound structure provides EMI protection to multiple faces of the chip and the RDL structure. The IC package structure has upgraded structural strength, reliability and stability in use. A method of manufacturing the above IC package structure is also introduced.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: November 21, 2023
    Assignee: Unimicron Technology Corp.
    Inventors: Kai-Ming Yang, Chia-Yu Peng, John Hon-Shing Lau
  • Publication number: 20230367208
    Abstract: An organometallic precursor for extreme ultraviolet (EUV) lithography is provided. An organometallic precursor includes an aromatic di-dentate ligand, a transition metal coordinated to the aromatic di-dentate ligand, and an extreme ultraviolet (EUV) cleavable ligand coordinated to the transition metal. The aromatic di-dentate ligand includes a plurality of pyrazine molecules.
    Type: Application
    Filed: July 20, 2023
    Publication date: November 16, 2023
    Inventors: Chih-Cheng Liu, Yi-Chen Kuo, Yen-Yu Chen, Jr-Hung Li, Chi-Ming Yang, Tze-Liang Lee
  • Publication number: 20230369048
    Abstract: A method of manufacturing semiconductor device includes forming a multilayer photoresist structure including a metal-containing photoresist over a substrate. The multilayer photoresist structure includes two or more metal-containing photoresist layers having different physical parameters. The metal-containing photoresist is a reaction product of a first precursor and a second precursor, and each layer of the multilayer photoresist structure is formed using different photoresist layer formation parameters. The different photoresist layer formation parameters are one or more selected from the group consisting of the first precursor, an amount of the first precursor, the second precursor, an amount of the second precursor, a length of time each photoresist layer formation operation, and heating conditions of the photoresist layers.
    Type: Application
    Filed: July 27, 2023
    Publication date: November 16, 2023
    Inventors: Jia-Lin WEI, Ming-Hui Weng, Chih-Cheng Liu, Yi-Chen Kuo, Yen-Yu Chen, Yahru Cheng, Jr-Hung Li, Ching-Yu Chang, Tze-Liang Lee, Chi-Ming Yang
  • Patent number: 11816844
    Abstract: A method for measuring angular velocity and angular acceleration based on monocular vision. Firstly, a movement sequence image of a feature mark fixed on a working table of a rotary motion generating device is acquired via an acquisition and imaging device. Secondly, a region of interest on the movement sequence image of the feature mark under different shooting distances and rotating conditions is determined by cyclic matching between a set of circular templates and the movement sequence image of the feature mark. Then, a sub-pixel of feature line edges in the region of interest is extracted using a line segment detection method, and only the feature line edges in a motion direction are retained through a constraint of the number of edge points. Finally, the angular velocity and angular acceleration are calculated by using the extracted feature line edges in the motion direction.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: November 14, 2023
    Assignees: Guizhou University, National Institute of Metrology, China
    Inventors: Ming Yang, Chenguang Cai, Zhihua Liu, Qi Lyu, Wenfeng Liu, Ping Yang
  • Publication number: 20230355028
    Abstract: A drip coffee filter structure in the present disclosure comprises a filter bag and two hanging ear devices designed at two lateral sides of the filter bag, respectively. The hanging ear devices make the filter bag hang on a cup upright or lopsidedly for extraction of coffee as required.
    Type: Application
    Filed: February 25, 2021
    Publication date: November 9, 2023
    Inventors: MING-YANG CHEN, CHAN-LIANG WANG, MING-SHENG CHEN
  • Publication number: 20230356035
    Abstract: A treadmill and an exercise accident detection method thereof are provided. The treadmill includes a treadmill body, an inertial sensor, and a processor. The inertial sensor is mounted on the treadmill body and continuously senses multiple sensed values while a treadmill belt of the treadmill is running. The processor is coupled to the inertial sensor, acquires multiple first sensed values sensed within a preset period by the inertial sensor, and analyzes the first sensed values sensed within the preset period to determine an event threshold value. The processor determines whether multiple second sensed values sensed not within the preset period by the inertial sensor satisfy a normal condition according to the event threshold value. If the second sensed values do not satisfy the normal condition, the processor controls the treadmill belt of the treadmill to stop running.
    Type: Application
    Filed: February 24, 2023
    Publication date: November 9, 2023
    Applicant: PEGATRON CORPORATION
    Inventors: Chien-Kun Chiu, Jia-Ming Yang, Chih-Chang Chen, Ban-Chwen Hsi, Yang-Ching Chang, Cheng-Yu Kao
  • Publication number: 20230363111
    Abstract: An immersion-type liquid cooling heat dissipation structure is provided. The immersion-type liquid cooling heat dissipation structure includes a metal heat dissipation substrate layer and a metal film layer. The metal film layer is formed on a surface of the metal heat dissipation substrate layer, and is configured to be immersed in an immersion-type coolant. An effective thickness of the metal film layer is less than 500 µm. A surface of the metal film layer has a plurality of micropores that facilitate generation of vapor bubbles. An effective width of each of the plurality of micropores is between 1 µm and 200 µm, and a depth of each of the plurality of micropores is between 100 nm and 50 µm.
    Type: Application
    Filed: May 8, 2022
    Publication date: November 9, 2023
    Inventors: KUO-WEI LEE, CHING-MING YANG, CHI-AN CHEN, TZE-YANG YEH
  • Publication number: 20230361199
    Abstract: Provided is a device with a replacement spacer structure and a method for forming such a structure. The method includes forming an initial spacer structure, wherein the initial spacer structure has an initial etch rate for a selected etchant. The method further includes removing a portion of the initial spacer structure, wherein a remaining portion of the initial spacer structure is not removed. Also, the method includes forming a replacement spacer structure adjacent to the remaining portion of the initial spacer structure to form a combined spacer structure, wherein the combined spacer structure has an intermediate etch rate for the selected etchant that is less than the initial etch rate for a selected etchant. Further, the method includes etching the combined spacer structure with the selected etchant to form a final spacer structure.
    Type: Application
    Filed: May 5, 2022
    Publication date: November 9, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chang-Ta Chen, Ming-Chang Wen, Kuo-Feng Yu, Chen-Yu Tai, Yun Lee, Poya Chuang, Chun-Ming Yang, Yoh-Rong Liu, Ya-Ting Yang