Patents by Inventor Ming Yeung

Ming Yeung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190251044
    Abstract: A mother board topology including a processor operable to be coupled to one or more communication channels for communicating commands. The topology includes a first communication channel electrically coupling a first set of two or more dual in-line memory modules (DIMMs) and a first primary data buffer on a mother board. The topology includes a second communication channel electrically coupling a second set of two or more DIMMs and a second primary data buffer on the mother board. The topology includes a third channel electrically coupling the first primary data buffer, the primary second data buffer, and the processor.
    Type: Application
    Filed: December 31, 2018
    Publication date: August 15, 2019
    Inventors: Chi-Ming YEUNG, Yoshie NAKABAYASHI, Thomas GIOVANNINI, Henry STRACOVSKY
  • Publication number: 20190165376
    Abstract: A meta-solid-state battery includes a first layer disposed on a first current collector, a second layer disposed on a second current collector, and third layer disposed between the first layer and the second layer. The first layer and the second layer are the cathode and anode electrodes. The third layer includes a first meta-solid-state electrolyte material. Each of the cathode and anode electrodes contain: an active material in an amount ranging from approximately 70% to 99.98% by weight, a carbon additive in an amount ranging from approximately 0.010% to 20% by weight, and a second meta-solid-state electrolyte material in an amount ranging from approximately 0.010% to 10% by weight. The first and second meta-solid-state electrolyte material include a gel polymer.
    Type: Application
    Filed: May 3, 2016
    Publication date: May 30, 2019
    Applicant: The Hong Kong University of Science and Technology
    Inventors: Matthew Ming-Fai Yuen, Francesco Ciucci, Stephen Chin-To Kwok, Kan Kan Yeung
  • Patent number: 10299969
    Abstract: A diaper includes a medical pad including a piece of substrate with a major surface and an electric circuit on the major surface, a sensor connected with the electric circuit for measuring the electrical resistance of the electric circuit, and a wireless data transceiver or a radio frequency identification (RFID) tag electrically connected with the sensor for receiving results of the measuring from the sensor for subsequent transmission. The system carries out real time self-calibration to adaptively monitor the condition of the medical pad even in the face of changing environment and changing material properties.
    Type: Grant
    Filed: October 9, 2018
    Date of Patent: May 28, 2019
    Assignee: CONVERGENCE SYSTEMS LIMITED
    Inventors: Kin Yue Albert Lai, Cheuk Kuen Kenny Chan, Man Wai Law, Kwok Wah Sit, Ngai Yin Chan, Siu Chong Tin, Wai Kin Chan, Tak Leung Siu, Yick Ming Yeung, Jerry Garrett
  • Publication number: 20190143481
    Abstract: A cleaning process monitoring system, comprising: a cleaning container comprising an inlet for receiving a cleaning solution and an outlet for draining a waste solution; a particle detector coupled to the outlet and configured to measure a plurality of particle parameters associated with the waste solution so as to provide a real-time monitoring of the cleaning process; a pump coupled to the cleaning container and configured to provide suction force to draw solution through the cleaning system; a controller coupled to the pump and the particle detector and configured to receive the plurality of particle parameters from the particle detector and to provide control to the cleaning system; and a host computer coupled to the controller and configured to provide at least one control parameter to the controller.
    Type: Application
    Filed: March 29, 2018
    Publication date: May 16, 2019
    Inventors: Charlie WANG, Yu-Ping TSENG, Y.J. CHEN, Wai-Ming YEUNG, Chien-Shen CHEN, Danny KUO, Yu-Hsuan HSIEH, Hsuan LO
  • Patent number: 10255220
    Abstract: System and method for dynamic termination control to enable use of an increased number of memory modules on a single channel. In some embodiments, six or eight DIMMs are coupled to a single channel. The dynamic termination scheme can include configurations for input bus termination (IBT) on each of the memory modules for the address bus/command bus and configurations for on-die termination (ODT) one each of the memory modules for the data bus.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: April 9, 2019
    Assignee: Rambus Inc.
    Inventors: Chi-Ming Yeung, David Secker, Ravindranath Kollipara, Shajith Musaliar Sirajudeen, Yoshie Nakabayashi
  • Publication number: 20190038478
    Abstract: A diaper includes a medical pad including a piece of substrate with a major surface and an electric circuit on the major surface, a sensor connected with the electric circuit for measuring the electrical resistance of the electric circuit, and a wireless data transceiver or a radio frequency identification (RFID) tag electrically connected with the sensor for receiving results of the measuring from the sensor for subsequent transmission. The system carries out real time self-calibration to adaptively monitor the condition of the medical pad even in the face of changing environment and changing material properties.
    Type: Application
    Filed: October 9, 2018
    Publication date: February 7, 2019
    Inventors: Kin Yue Albert Lai, Cheuk Kuen Kenny Chan, Man Wai Law, Kwok Wah Sit, Ngai Yin Chan, Siu Chong Tin, Wai Kin Chan, Tak Leung Siu, Yick Ming Yeung, Jerry Garrett
  • Patent number: 10199350
    Abstract: An apparatus for heating a substrate during die bonding is disclosed. The apparatus comprises: a substrate carrier configured to hold the substrate; a heating device configured to heat the substrate; a first actuator for effecting relative motion between the substrate carrier and the heating device such that the substrate is relatively indexed with respect to the heating device; a second actuator for effecting relative motion between the substrate carrier and the heating device such that the heating device contacts the substrate to heat different portions of the substrate. In particular, the second actuator is operative to separate the heating device from the substrate in order for the first actuator to relatively index the substrate across the heating device. A method of heating a substrate during die bonding is also disclosed.
    Type: Grant
    Filed: May 25, 2012
    Date of Patent: February 5, 2019
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Ming Yeung Luke Wan, Chi Wai Cheung, Chin Tung So
  • Patent number: 10186549
    Abstract: A method for bonding a matrix of light-emitting elements onto a substrate includes forming conductive material on bond pads of the substrate in a matrix arrangement. Separately, a plurality of light-emitting elements is also picked up and placed onto a temporary carrier in the said matrix arrangement. The temporary carrier containing the plurality of light-emitting elements is then held with a bond head, and is moved by the bond head to establish contact between electrodes on the plurality of light-emitting elements and the conductive material on the substrate. When heat is applied to the light-emitting elements while exerting a compressive force with the bond head against the conductive material, conductive joints are formed between the light-emitting elements and the substrate.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: January 22, 2019
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Yiu Ming Cheung, Ming Li, Zetao Ma, Kai Ming Yeung
  • Patent number: 10169258
    Abstract: A mother board topology including a processor operable to be coupled to one or more communication channels for communicating commands. The topology includes a first communication channel electrically coupling a first set of two or more dual in-line memory modules (DIMMs) and a first primary data buffer on a mother board. The topology includes a second communication channel electrically coupling a second set of two or more DIMMs and a second primary data buffer on the mother board. The topology includes a third channel electrically coupling the first primary data buffer, the primary second data buffer, and the processor.
    Type: Grant
    Filed: March 15, 2016
    Date of Patent: January 1, 2019
    Assignee: Rambus Inc.
    Inventors: Chi-Ming Yeung, Yoshie Nakabayashi, Thomas Giovannini, Henry Stracovsky
  • Patent number: 10134489
    Abstract: A medical pad includes a piece of substrate with a major surface and an electric circuit on the major surface, a sensor connected with the electric circuit for measuring the electrical resistance of the electric circuit, and a wireless data transceiver or a radio frequency identification (RFID) tag electrically connected with the sensor for receiving results of the measuring from the sensor for subsequent transmission. The system carries out real time self-calibration to adaptively monitor the condition of a medical pad even in the face of changing environment and changing material properties.
    Type: Grant
    Filed: October 6, 2015
    Date of Patent: November 20, 2018
    Assignee: Convergence Systems Limited
    Inventors: Kin Yue Albert Lai, Cheuk Kuen Kenny Chan, Man Wai Law, Kwok Wah Sit, Ngai Yin Chan, Siu Chong Tin, Wai Kin Chan, Tak Leung Siu, Yick Ming Yeung, Jerry Garrett
  • Patent number: 9980484
    Abstract: A self-regenerating chitosan based filter medium for disinfecting and purifying organic pollutants and other pollutants in a gas or liquid is disclosed herein. Porosity and surface charge of said filter medium is manipulative/tunable by varying one or more of the following parameter(s): concentration of chitosan, crosslinking density, amount of copolymers and additives, freezing temperature, freezing profile, and/or types of crosslinker used. The present filter medium is capable of self-regenerating under exposure to ultra-violet light for sufficient time and removing over 90% of the pollutants from each influent flowing through the filter medium.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: May 29, 2018
    Assignee: Nano and Advanced Materials Institute Limited
    Inventors: Jifan Li, Yee Man Ho, Ka Chun Lee, Wai Yan Chan, Mui Chan, Kai Ming Yeung
  • Patent number: 9921751
    Abstract: A memory system includes a CPU that communicates commands and addresses to a main-memory module. The module includes a buffer circuit that relays commands and data between the CPU and the main memory. The memory module additionally includes an embedded processor that shares access to main memory in support of peripheral functionality, such as graphics processing, for improved overall system performance. The buffer circuit facilitates the communication of instructions and data between CPU and the peripheral processor in a manner that minimizes or eliminates the need to modify CPU, and consequently reduces practical barriers to the adoption of main-memory modules with integrated processing power.
    Type: Grant
    Filed: January 19, 2016
    Date of Patent: March 20, 2018
    Assignee: Rambus Inc.
    Inventors: Richard E. Perego, Pradeep Batra, Steven Woo, Lawrence Lai, Chi-Ming Yeung
  • Patent number: 9880971
    Abstract: A memory appliance system is described and includes a processor coupled to one or more communication channels with a command interface, wherein the processor is configured for communicating commands over the communication channels. A plurality of Smart Memory Cubes (SMCs) is coupled to the processor through the communication channels. Each of the SMCs includes a controller that is programmable, and a plurality of memory devices. The controller is configured to respond to commands from the command interface to access content stored in one or more of the plurality of memory devices and to perform data operations on content accessed from the plurality of memory devices.
    Type: Grant
    Filed: November 12, 2014
    Date of Patent: January 30, 2018
    Assignee: Rambus Inc.
    Inventors: Keith Lowery, Vlad Fruchter, Chi-Ming Yeung
  • Patent number: 9841791
    Abstract: A rack unit configuration is described that includes a first printed circuit board (PCB) assembly interleaved with a second PCB assembly that is inverted with respect to the first PCB assembly. The configuration of the first PCB assembly and the second PCB assembly allow for increased component and power densities within computing systems, memory systems, etc. The increased density may be achieved while allowing sufficient mechanical clearance to allow easy component replacement and servicing (e.g., and hot pluggability). Power density may also be increased with PCB assemblies including nested and interleaved power modules.
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: December 12, 2017
    Assignee: Rambus Inc.
    Inventors: Donald R. Mullen, Chi-Ming Yeung, David A. Secker
  • Patent number: 9824779
    Abstract: In response to a first memory access transaction having a first base address, data fields and a repair fields are retrieved from a first DRAM channel. The data fields include a first data field. The repair fields include a first repair field storing repair data. The repair data is to replace any data in the first data field. In response to a second memory access transaction having a second base address, repair tag fields are retrieved from a second DRAM channel. The repair tag fields include a repair tag field that indicates the repair data is be replace the data stored in the first data field.
    Type: Grant
    Filed: May 20, 2015
    Date of Patent: November 21, 2017
    Assignee: Rambus Inc.
    Inventors: Frederick A. Ware, Vlad Fruchter, Chi-Ming Yeung
  • Publication number: 20170098044
    Abstract: A medical pad includes a piece of substrate with a major surface and an electric circuit on the major surface, a sensor connected with the electric circuit for measuring the electrical resistance of the electric circuit, and a wireless data transceiver or a radio frequency identification (RFID) tag electrically connected with the sensor for receiving results of the measuring from the sensor for subsequent transmission. The system carries out real time self-calibration to adaptively monitor the condition of a medical pad even in the face of changing environment and changing material properties.
    Type: Application
    Filed: October 6, 2015
    Publication date: April 6, 2017
    Inventors: Kin Yue Albert LAI, Cheuk Kuen Kenny Chan, Man Wai Law, Kwok Wah Sit, Ngai Yin Chan, Siu Chong Tin, Wai Kin Chan, Tak Leung Siu, Yick Ming Yeung, Jerry Garrett
  • Patent number: 9579797
    Abstract: Methods and systems are provided for operating various robotic systems. The methods and systems involve applications of platforms that enable multiple-input teleoperation and a high degree of immersiveness for the user. The robotic systems may include multiple arms for manipulators and retrieving information from the environment and/or the robotic system. The robotic methods may include control modification modules for detecting that an operation of a robotic device based on the control commands fails to comply with one or more operational parameters; identifying the non-compliant control command; and generating a modifier for the secondary device to adjust the non-compliant control command to comply with the set of operational parameters.
    Type: Grant
    Filed: April 10, 2015
    Date of Patent: February 28, 2017
    Assignee: QUANSER CONSULTING INC.
    Inventors: Agop Jean Georges Apkarian, Amir Haddadi, Gilbert Ming Yeung Lai, Hervé Jean-Pierre Lacheray, Paul Karam, David Ryan Erickson
  • Patent number: 9546912
    Abstract: A time-temperature indicator (TTI) uses polymer hardening properties to “set” or retain indications of temperature history. The TTI includes a mesh layer affixed to a thermo-conductive adhesive layer and a photonic crystal patterned film affixed to the mesh layer. The photonic crystal shows a property of bandgap shift vs temperature and responds to a predetermined range of temperatures to provide a visible indication of the range of temperatures. A hardener pouch is affixed to one end of the mesh layer and releases hardener in response to an initiating event, so that the photonic crystal material responds to the hardener by presenting a fixed state.
    Type: Grant
    Filed: December 11, 2012
    Date of Patent: January 17, 2017
    Assignee: NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
    Inventors: Po Shan Chan, Kai Ming Yeung, Mui Chan, Sin Man Lee
  • Publication number: 20160364347
    Abstract: A mother board topology including a processor operable to be coupled to one or more communication channels for communicating commands. The topology includes a first communication channel electrically coupling a first set of two or more dual in-line memory modules (DIMMs) and a first primary data buffer on a mother board. The topology includes a second communication channel electrically coupling a second set of two or more DIMMs and a second primary data buffer on the mother board. The topology includes a third channel electrically coupling the first primary data buffer, the primary second data buffer, and the processor.
    Type: Application
    Filed: March 15, 2016
    Publication date: December 15, 2016
    Inventors: Chi-Ming YEUNG, Yoshie NAKABAYASHI, Thomas GIOVANNINI, Henry STRACOVSKY
  • Publication number: 20160314822
    Abstract: System and method for training and performing operations (e.g., read and write operations) on a double buffered memory topology. In some embodiments, eight DIMMs are coupled to a single channel. The training and operations schemes are configured with timing and signaling to allow training and operations with the double buffered memory topology. In some embodiments, the double buffered memory topology includes one or more buffers on a system board (e.g., motherboard).
    Type: Application
    Filed: March 15, 2016
    Publication date: October 27, 2016
    Inventors: Chi-Ming YEUNG, Yoshie NAKABAYASHI, Thomas GIOVANNINI, Henry STRACOVSKY