Patents by Inventor Mirko Hattass

Mirko Hattass has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8695427
    Abstract: A micromechanical component is described including a substrate having a spacer layer and a test structure for ascertaining the thickness of the spacer layer. The test structure includes a seismic mass, which is elastically deflectable along a measuring axis parallel to the substrate, a first electrode system and a second electrode system for deflecting the seismic mass along the measuring axis, having a mass electrode, which is produced by a part of the seismic mass, and a substrate electrode, which is situated on the substrate in each case, the first electrode system being designed to be thicker than the second electrode system by the layer thickness of the spacer layer.
    Type: Grant
    Filed: May 26, 2011
    Date of Patent: April 15, 2014
    Assignee: Robert Bosch GmbH
    Inventors: Jochen Reinmuth, Ralf Boessendoerfer, Axel Franke, Mirko Hattass
  • Publication number: 20130299928
    Abstract: A hybridly integrated component includes an ASIC element having a processed front side, a first MEMS element having a micromechanical structure extending over the entire thickness of the first MEMS substrate, and a first cap wafer mounted over the micromechanical structure of the first MEMS element. At least one structural element of the micromechanical structure of the first MEMS element is deflectable, and the first MEMS element is mounted on the processed front side of the ASIC element such that a gap exists between the micromechanical structure and the ASIC element. A second MEMS element is mounted on the rear side of the ASIC element. The micromechanical structure of the second MEMS element extends over the entire thickness of the second MEMS substrate and includes at least one deflectable structural element.
    Type: Application
    Filed: May 9, 2013
    Publication date: November 14, 2013
    Applicant: ROBERT BOSCH GMBH
    Inventors: Johannes CLASSEN, Heribert WEBER, Mirko HATTASS, Daniel Christoph MEISEL
  • Publication number: 20130299925
    Abstract: A micromechanical inertial sensor includes an ASIC element having a processed front side, an MEMS element having a micromechanical sensor structure, and a cap wafer mounted above the micromechanical sensor structure, which sensor structure includes a seismic mass and extends over the entire thickness of the MEMS substrate. The MEMS element is mounted on the processed front side of the ASIC element above a standoff structure and is electrically connected to the ASIC element via through-contacts in the MEMS substrate and in adjacent supports of the standoff structure. A blind hole is formed in the MEMS substrate in the area of the seismic mass, which blind hole is filled with the same electrically conductive material as the through-contacts, the conductive material having a greater density than the MEMS substrate.
    Type: Application
    Filed: May 9, 2013
    Publication date: November 14, 2013
    Applicant: ROBERT BOSCH GMBH
    Inventors: Johannes CLASSEN, Mirko HATTASS, Daniel Christoph MEISEL
  • Publication number: 20130299924
    Abstract: A component system includes at least one MEMS element, a cap for a micromechanical structure of the MEMS element, and at least one ASIC substrate. The micromechanical structure of the MEMS element is implemented in the functional layer of an SOI wafer. The MEMS element is mounted face down, with the structured functional layer on the ASIC substrate, and the cap is implemented in the substrate of the SOI wafer. The ASIC substrate includes a starting substrate provided with a layered structure on both sides. At least one circuit level is implemented in each case both in the MEMS-side layered structure and in the rear-side layered structure of the ASIC substrate. In the ASIC substrate, at least one ASIC through contact is implemented which electrically contacts at least one circuit level of the rear-side layered structure and/or at least one circuit level of the MEMS-side layered structure.
    Type: Application
    Filed: May 9, 2013
    Publication date: November 14, 2013
    Applicant: Robert Bosch GmbH
    Inventors: Heribert WEBER, Frank Fischer, Mirko Hattass, Yvonne Bergmann
  • Publication number: 20130284227
    Abstract: An energy source for supplying an autonomous electrical load system with electrical energy includes a thermogenerator device configured to generate a thermoelectric voltage to be fed to the electrical load system. The thermogenerator device is under the influence of a temperature difference between a warmer first thermal coupling device and a colder second thermal coupling device. The energy source further includes a microfluidic cooling device having a heat-absorption region, a heat-emission region, and a closed microfluidic circulation system configured to circulate a fluid between the heat-absorption region and the heat-emission region. The heat-absorption region has a thermally conductive connection to the second thermal coupling device.
    Type: Application
    Filed: April 29, 2013
    Publication date: October 31, 2013
    Applicant: Robert Bosch GmbH
    Inventors: Rolf Scheben, Mirko Hattass
  • Patent number: 8461833
    Abstract: A method for determining the sensitivity of a sensor provides the following steps: a) first and second deflection voltages are applied to first and second electrode systems of the sensor, respectively, and first and second electrostatic forces are exerted on an elastically suspended seismic mass of the sensor by the first and second electrode systems, respectively, and a restoring force is exerted on the mass as a result of the elasticity of the mass, and a force equilibrium is established among the first and second electrostatic forces and the restoring force, and the mass assumes a deflection position characteristic of the force equilibrium, and an output signal characteristic of the force equilibrium and of the deflection position is measured; and b) the sensitivity of the sensor is computed on the basis of the first and second deflection voltages.
    Type: Grant
    Filed: November 9, 2010
    Date of Patent: June 11, 2013
    Assignee: Robert Bosch GmbH
    Inventors: Johannes Classen, Arnd Kaelberer, Hans-Joerg Faisst, Axel Franke, Mirko Hattass, Holger Rank, Robert Sattler, Alexander Buhmann, Ramona Maas, Marian Keck
  • Publication number: 20120297878
    Abstract: A micromechanical angular acceleration sensor for measuring an angular acceleration is disclosed. The sensor includes a substrate, a seismic mass, at least one suspension, which fixes the seismic mass to the substrate in a deflectable manner, and at least one piezoresistive and/or piezoelectric element for measuring the angular acceleration. The piezoresistive and/or piezoelectric element is arranged in a cutout of the seismic mass. A corresponding method and uses of the sensor are also disclosed.
    Type: Application
    Filed: May 24, 2012
    Publication date: November 29, 2012
    Applicant: Robert Bosch GmbH
    Inventors: Reinhard Neul, Torsten Ohms, Mirko Hattass, Daniel Christoph Meisel
  • Publication number: 20120272735
    Abstract: The disclosure relates to a micromechanical rotary acceleration sensor including a substrate with at least one anchoring device and at least two flywheel masses. At least one of the flywheel masses is connected to at least one anchoring device by means of a coupling element. The at least one anchoring device is designed in such a manner that the at least two flywheel masses are elastically deflectable from a respective rest position about at least one axis of rotation. The at least two flywheel masses is designed in such a manner that they have different natural frequencies.
    Type: Application
    Filed: April 23, 2012
    Publication date: November 1, 2012
    Applicant: Robert Bosch GmbH
    Inventors: Reinhard Neul, Torsten Ohms, Mirko Hattass, Daniel Christoph Meisel
  • Publication number: 20120067123
    Abstract: A micromechanical rotation rate sensor, in particular for use in motor vehicles, includes a substrate, at least one seismic mass, which is arranged in a sprung manner on the substrate, drive means for production of a periodic movement of the seismic mass, force detection means for detection of a Coriolis force, which acts on the seismic mass as a result of rotation about a rotation axis which is at right angles to the excitation direction, and measurement means, wherein the measurement means are designed for measurement of structural deviations of the rotation rate sensor.
    Type: Application
    Filed: September 16, 2011
    Publication date: March 22, 2012
    Applicant: Robert Bosch GmbH
    Inventors: Mirko Hattass, Benjamin Schmidt
  • Publication number: 20120036915
    Abstract: A sensor system having a substrate and a mass which is movably suspended relative to the substrate is described, the sensor system including detection arrangement for detecting a deflection of the seismic mass relative to the substrate along a deflection direction, the detection arrangement including a first measuring electrode affixed to the substrate and a second measuring electrode affixed to the substrate, and a first overlap, which is perpendicular to the deflection direction, between the first measuring electrode and the seismic mass along the deflection direction is greater than a second overlap, which is perpendicular to the deflection direction, between the second measuring electrode and the seismic mass.
    Type: Application
    Filed: August 3, 2011
    Publication date: February 16, 2012
    Inventors: Axel FRANKE, Mirko Hattass, Alexander Buhmann, Marian Keck
  • Publication number: 20110296917
    Abstract: A micromechanical component is described including a substrate having a spacer layer and a test structure for ascertaining the thickness of the spacer layer. The test structure includes a seismic mass, which is elastically deflectable along a measuring axis parallel to the substrate, a first electrode system and a second electrode system for deflecting the seismic mass along the measuring axis, having a mass electrode, which is produced by a part of the seismic mass, and a substrate electrode, which is situated on the substrate in each case, the first electrode system being designed to be thicker than the second electrode system by the layer thickness of the spacer layer.
    Type: Application
    Filed: May 26, 2011
    Publication date: December 8, 2011
    Inventors: Jochen Reinmuth, Ralf Boessendoerfer, Axel Franke, Mirko Hattass
  • Publication number: 20110140692
    Abstract: A method for determining the sensitivity of a sensor provides the following steps: a) first and second deflection voltages are applied to first and second electrode systems of the sensor, respectively, and first and second electrostatic forces are exerted on an elastically suspended seismic mass of the sensor by the first and second electrode systems, respectively, and a restoring force is exerted on the mass as a result of the elasticity of the mass, and a force equilibrium is established among the first and second electrostatic forces and the restoring force, and the mass assumes a deflection position characteristic of the force equilibrium, and an output signal characteristic of the force equilibrium and of the deflection position is measured; and b) the sensitivity of the sensor is computed on the basis of the first and second deflection voltages.
    Type: Application
    Filed: November 9, 2010
    Publication date: June 16, 2011
    Inventors: Johannes Classen, Arnd Kaelberer, Hans-Joerg Faisst, Axel Franke, Mirko Hattass, Holger Rank, Robert Sattler, Alexander Buhmann, Ramona Maas, Marian Keck
  • Publication number: 20110134502
    Abstract: A micromechanical component includes a micromechanical unidimensional optical lattice structure for diffracting an incident light beam, and a linear drive connected to the lattice structure for compressing and/or stretching the lattice structure in the plane of the lattice structure. The lattice structure is of elastic design with regard to a change of shape resulting from the compressing and/or stretching. The micromechanical component may be incorporated in a device for beam deflection of monochromatic light or in a spectrometer.
    Type: Application
    Filed: October 26, 2010
    Publication date: June 9, 2011
    Inventor: Mirko Hattass