Patents by Inventor Mitchell Andrew Hansen

Mitchell Andrew Hansen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High frequency attenuator
    Patent number: 10460992
    Abstract: High-frequency thin film chip attenuators can include a substrate having a first side and a second side, a first portion coupled to the first side of the substrate, and a second portion coupled to the second side of the substrate. The first portion can include a ground section, an input contact section, and an output contact section. The second portion can include a ground section, an input section, an output section, and a plurality of resistive sections providing electrical communication between the input section, the output section, and the ground section. The resistive sections can be arranged in an attenuation configuration to attenuate a signal received at the input section and output via the output section. A plurality of through-holes extending through the substrate can provide electrical communication between sections on the first side of the substrate and associated sections on the second side of the substrate.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: October 29, 2019
    Assignee: THIN FILM TECHNOLOGY CORPORATION
    Inventors: Michael James Howieson, Mitchell Andrew Hansen, Mark Hamilton Broman
  • HIGH FREQUENCY ATTENUATOR
    Publication number: 20190214303
    Abstract: High-frequency thin film chip attenuators can include a substrate having a first side and a second side, a first portion coupled to the first side of the substrate, and a second portion coupled to the second side of the substrate. The first portion can include a ground section, an input contact section, and an output contact section. The second portion can include a ground section, an input section, an output section, and a plurality of resistive sections providing electrical communication between the input section, the output section, and the ground section. The resistive sections can be arranged in an attenuation configuration to attenuate a signal received at the input section and output via the output section. A plurality of through-holes extending through the substrate can provide electrical communication between sections on the first side of the substrate and associated sections on the second side of the substrate.
    Type: Application
    Filed: November 6, 2018
    Publication date: July 11, 2019
    Inventors: Michael James Howieson, Mitchell Andrew Hansen, Mark Hamilton Broman
  • High frequency attenuator
    Patent number: 10153208
    Abstract: High-frequency thin film chip attenuators can include a substrate having a first side and a second side, a first portion coupled to the first side of the substrate, and a second portion coupled to the second side of the substrate. The first portion can include a ground section, an input contact section, and an output contact section. The second portion can include a ground section, an input section, an output section, and a plurality of resistive sections providing electrical communication between the input section, the output section, and the ground section. The resistive sections can be arranged in an attenuation configuration to attenuate a signal received at the input section and output via the output section. A plurality of through-holes extending through the substrate can provide electrical communication between sections on the first side of the substrate and associated sections on the second side of the substrate.
    Type: Grant
    Filed: January 9, 2018
    Date of Patent: December 11, 2018
    Assignee: THIN FILM TECHNOLOGY CORPORATION
    Inventors: Michael James Howieson, Mitchell Andrew Hansen, Mark Hamilton Broman